{"id":"https://openalex.org/W2092272170","doi":"https://doi.org/10.1109/cicc.2014.6946046","title":"MBus: A 17.5 pJ/bit/chip portable interconnect bus for millimeter-scale sensor systems with 8 nW standby power","display_name":"MBus: A 17.5 pJ/bit/chip portable interconnect bus for millimeter-scale sensor systems with 8 nW standby power","publication_year":2014,"publication_date":"2014-09-01","ids":{"openalex":"https://openalex.org/W2092272170","doi":"https://doi.org/10.1109/cicc.2014.6946046","mag":"2092272170"},"language":"en","primary_location":{"id":"doi:10.1109/cicc.2014.6946046","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2014.6946046","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE 2014 Custom Integrated Circuits Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111993350","display_name":"Ye-Sheng Kuo","orcid":null},"institutions":[{"id":"https://openalex.org/I27837315","display_name":"University of Michigan\u2013Ann Arbor","ror":"https://ror.org/00jmfr291","country_code":"US","type":"education","lineage":["https://openalex.org/I27837315"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Ye-sheng Kuo","raw_affiliation_strings":["University of Michigan, Ann Arbor, MI, USA","University of Michigan Ann Arbor MI, USA"],"affiliations":[{"raw_affiliation_string":"University of Michigan, Ann Arbor, MI, USA","institution_ids":["https://openalex.org/I27837315"]},{"raw_affiliation_string":"University of Michigan Ann Arbor MI, USA","institution_ids":["https://openalex.org/I27837315"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072986653","display_name":"Pat Pannuto","orcid":"https://orcid.org/0000-0001-7720-6267"},"institutions":[{"id":"https://openalex.org/I27837315","display_name":"University of Michigan\u2013Ann Arbor","ror":"https://ror.org/00jmfr291","country_code":"US","type":"education","lineage":["https://openalex.org/I27837315"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Pat Pannuto","raw_affiliation_strings":["University of Michigan, Ann Arbor, MI, USA","University of Michigan Ann Arbor MI, USA"],"affiliations":[{"raw_affiliation_string":"University of Michigan, Ann Arbor, MI, USA","institution_ids":["https://openalex.org/I27837315"]},{"raw_affiliation_string":"University of Michigan Ann Arbor MI, USA","institution_ids":["https://openalex.org/I27837315"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067061774","display_name":"Gyouho Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I27837315","display_name":"University of Michigan\u2013Ann Arbor","ror":"https://ror.org/00jmfr291","country_code":"US","type":"education","lineage":["https://openalex.org/I27837315"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Gyouho Kim","raw_affiliation_strings":["University of Michigan, Ann Arbor, MI, USA","University of Michigan Ann Arbor MI, USA"],"affiliations":[{"raw_affiliation_string":"University of Michigan, Ann Arbor, MI, USA","institution_ids":["https://openalex.org/I27837315"]},{"raw_affiliation_string":"University of Michigan Ann Arbor MI, USA","institution_ids":["https://openalex.org/I27837315"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5009778364","display_name":"Zhiyoong Foo","orcid":null},"institutions":[{"id":"https://openalex.org/I27837315","display_name":"University of Michigan\u2013Ann Arbor","ror":"https://ror.org/00jmfr291","country_code":"US","type":"education","lineage":["https://openalex.org/I27837315"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Zhiyoong Foo","raw_affiliation_strings":["University of Michigan, Ann Arbor, MI, USA","University of Michigan Ann Arbor MI, USA"],"affiliations":[{"raw_affiliation_string":"University of Michigan, Ann Arbor, MI, USA","institution_ids":["https://openalex.org/I27837315"]},{"raw_affiliation_string":"University of Michigan Ann Arbor MI, USA","institution_ids":["https://openalex.org/I27837315"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075063817","display_name":"Inhee Lee","orcid":"https://orcid.org/0000-0001-5723-9678"},"institutions":[{"id":"https://openalex.org/I27837315","display_name":"University of Michigan\u2013Ann Arbor","ror":"https://ror.org/00jmfr291","country_code":"US","type":"education","lineage":["https://openalex.org/I27837315"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Inhee Lee","raw_affiliation_strings":["University of Michigan, Ann Arbor, MI, USA","University of Michigan Ann Arbor MI, USA"],"affiliations":[{"raw_affiliation_string":"University of Michigan, Ann Arbor, MI, USA","institution_ids":["https://openalex.org/I27837315"]},{"raw_affiliation_string":"University of Michigan Ann Arbor MI, USA","institution_ids":["https://openalex.org/I27837315"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089152951","display_name":"Ben Kempke","orcid":null},"institutions":[{"id":"https://openalex.org/I27837315","display_name":"University of Michigan\u2013Ann Arbor","ror":"https://ror.org/00jmfr291","country_code":"US","type":"education","lineage":["https://openalex.org/I27837315"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ben Kempke","raw_affiliation_strings":["University of Michigan, Ann Arbor, MI, USA","University of Michigan Ann Arbor MI, USA"],"affiliations":[{"raw_affiliation_string":"University of Michigan, Ann Arbor, MI, USA","institution_ids":["https://openalex.org/I27837315"]},{"raw_affiliation_string":"University of Michigan Ann Arbor MI, USA","institution_ids":["https://openalex.org/I27837315"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035987149","display_name":"Prabal Dutta","orcid":"https://orcid.org/0000-0003-4106-9138"},"institutions":[{"id":"https://openalex.org/I27837315","display_name":"University of Michigan\u2013Ann Arbor","ror":"https://ror.org/00jmfr291","country_code":"US","type":"education","lineage":["https://openalex.org/I27837315"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Prabal Dutta","raw_affiliation_strings":["University of Michigan, Ann Arbor, MI, USA","University of Michigan Ann Arbor MI, USA"],"affiliations":[{"raw_affiliation_string":"University of Michigan, Ann Arbor, MI, USA","institution_ids":["https://openalex.org/I27837315"]},{"raw_affiliation_string":"University of Michigan Ann Arbor MI, USA","institution_ids":["https://openalex.org/I27837315"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026311377","display_name":"David Blaauw","orcid":"https://orcid.org/0000-0001-6744-7075"},"institutions":[{"id":"https://openalex.org/I27837315","display_name":"University of Michigan\u2013Ann Arbor","ror":"https://ror.org/00jmfr291","country_code":"US","type":"education","lineage":["https://openalex.org/I27837315"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"David Blaauw","raw_affiliation_strings":["University of Michigan, Ann Arbor, MI, USA","University of Michigan Ann Arbor MI, USA"],"affiliations":[{"raw_affiliation_string":"University of Michigan, Ann Arbor, MI, USA","institution_ids":["https://openalex.org/I27837315"]},{"raw_affiliation_string":"University of Michigan Ann Arbor MI, USA","institution_ids":["https://openalex.org/I27837315"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5040564153","display_name":"Yoonmyung Lee","orcid":"https://orcid.org/0000-0001-9468-1692"},"institutions":[{"id":"https://openalex.org/I27837315","display_name":"University of Michigan\u2013Ann Arbor","ror":"https://ror.org/00jmfr291","country_code":"US","type":"education","lineage":["https://openalex.org/I27837315"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yoonmyung Lee","raw_affiliation_strings":["University of Michigan, Ann Arbor, MI, USA","University of Michigan Ann Arbor MI, USA"],"affiliations":[{"raw_affiliation_string":"University of Michigan, Ann Arbor, MI, USA","institution_ids":["https://openalex.org/I27837315"]},{"raw_affiliation_string":"University of Michigan Ann Arbor MI, USA","institution_ids":["https://openalex.org/I27837315"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":9,"corresponding_author_ids":["https://openalex.org/A5111993350"],"corresponding_institution_ids":["https://openalex.org/I27837315"],"apc_list":null,"apc_paid":null,"fwci":2.5539,"has_fulltext":false,"cited_by_count":22,"citation_normalized_percentile":{"value":0.90805108,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11417","display_name":"Advancements in PLL and VCO Technologies","score":0.995199978351593,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9933000206947327,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/standby-power","display_name":"Standby power","score":0.6454290151596069},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.5474600791931152},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.5472967624664307},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5028933882713318},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5017397403717041},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.4796198308467865},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.423843652009964},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.41087356209754944},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.33364081382751465},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2701420187950134},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.19477194547653198},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.14223003387451172},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.07538282871246338}],"concepts":[{"id":"https://openalex.org/C7140552","wikidata":"https://www.wikidata.org/wiki/Q1366402","display_name":"Standby power","level":3,"score":0.6454290151596069},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.5474600791931152},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5472967624664307},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5028933882713318},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5017397403717041},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.4796198308467865},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.423843652009964},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.41087356209754944},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.33364081382751465},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2701420187950134},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.19477194547653198},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.14223003387451172},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.07538282871246338},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/cicc.2014.6946046","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2014.6946046","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE 2014 Custom Integrated Circuits Conference","raw_type":"proceedings-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.469.6890","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.469.6890","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://web.eecs.umich.edu/~prabal/pubs/papers/kuo14mbus.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.6299999952316284}],"awards":[],"funders":[{"id":"https://openalex.org/F4320332180","display_name":"Defense Advanced Research Projects Agency","ror":"https://ror.org/02caytj08"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W1484086080","https://openalex.org/W1977705237","https://openalex.org/W1992650325","https://openalex.org/W2104610553","https://openalex.org/W2165131946","https://openalex.org/W6628823417"],"related_works":["https://openalex.org/W2321291171","https://openalex.org/W2140159669","https://openalex.org/W2165693797","https://openalex.org/W1594447600","https://openalex.org/W2122214933","https://openalex.org/W2625455464","https://openalex.org/W2018755015","https://openalex.org/W2065289416","https://openalex.org/W2017236304","https://openalex.org/W2136854845"],"abstract_inverted_index":{"We":[0],"propose":[1],"an":[2,50],"ultra-low":[3,51],"power":[4,35,47,52,74,100],"interconnect":[5],"bus":[6,18],"for":[7],"millimeter-scale":[8],"wireless":[9],"sensor":[10,31],"nodes.":[11],"Using":[12],"only":[13,56],"4":[14],"IO":[15],"pads,":[16],"the":[17,20],"minimizes":[19],"required":[21],"chip":[22],"real":[23],"estate,":[24],"enabling":[25],"ultrasmall":[26],"form":[27],"factors":[28],"in":[29,87,92],"modular":[30],"node":[32],"designs.":[33],"Low":[34],"is":[36,65,79],"achieved":[37],"using":[38],"a":[39,71,88],"\u201cclockless\u201d":[40],"design":[41],"of":[42,98],"member":[43],"nodes":[44],"while":[45],"aggressive":[46],"gating":[48],"allows":[49],"standby":[53,75,99],"mode":[54],"with":[55,67],"53":[57],"gates":[58],"powered":[59],"on.":[60],"An":[61],"integrated":[62],"wakeup":[63],"scheme":[64],"compatible":[66],"PMUs":[68],"that":[69],"have":[70],"special":[72],"low":[73],"mode.":[76],"The":[77],"MBus":[78],"fully":[80],"synthesizable":[81],"and":[82,101],"uses":[83],"robust":[84],"timing.":[85],"Implemented":[86],"3":[89],"module":[90],"system":[91],"180nm":[93],"technology,":[94],"Mbus":[95],"achieves":[96],"8nW":[97],"17.5":[102],"pJ/bit/chip.":[103]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2023,"cited_by_count":3},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":2},{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":6},{"year":2015,"cited_by_count":3}],"updated_date":"2026-04-05T17:49:38.594831","created_date":"2025-10-10T00:00:00"}