{"id":"https://openalex.org/W2011761036","doi":"https://doi.org/10.1109/cicc.2013.6658452","title":"A HKMG 28nm 1GHz fully-pipelined tile-able 1MB embedded SRAM IP with 1.39mm&lt;sup&gt;2&lt;/sup&gt; per MB","display_name":"A HKMG 28nm 1GHz fully-pipelined tile-able 1MB embedded SRAM IP with 1.39mm&lt;sup&gt;2&lt;/sup&gt; per MB","publication_year":2013,"publication_date":"2013-09-01","ids":{"openalex":"https://openalex.org/W2011761036","doi":"https://doi.org/10.1109/cicc.2013.6658452","mag":"2011761036"},"language":"en","primary_location":{"id":"doi:10.1109/cicc.2013.6658452","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2013.6658452","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE 2013 Custom Integrated Circuits Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5011632198","display_name":"Ming-Zhang Kuo","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Ming-Zhang Kuo","raw_affiliation_strings":["Design Technology Platform R & D, Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan","Design Technol. Platform, Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Design Technology Platform R & D, Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]},{"raw_affiliation_string":"Design Technol. Platform, Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102018355","display_name":"Osamu Takahashi","orcid":"https://orcid.org/0000-0002-5321-1747"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Osamu Takahashi","raw_affiliation_strings":["Design Technology Platform R & D, Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan","Design Technol. Platform, Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Design Technology Platform R & D, Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]},{"raw_affiliation_string":"Design Technol. Platform, Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063911057","display_name":"Ping-Lin Yang","orcid":"https://orcid.org/0000-0002-6723-8190"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Ping-Lin Yang","raw_affiliation_strings":["Design Technology Platform R & D, Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan","Design Technol. Platform, Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Design Technology Platform R & D, Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]},{"raw_affiliation_string":"Design Technol. Platform, Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5038860671","display_name":"Cheng-Chung Lin","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Cheng-Chung Lin","raw_affiliation_strings":["Design Technology Platform R & D, Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan","Design Technol. Platform, Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Design Technology Platform R & D, Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]},{"raw_affiliation_string":"Design Technol. Platform, Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5086368713","display_name":"Min-Jer Wang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Min-Jer Wang","raw_affiliation_strings":["Design Technology Platform R & D, Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan","Design Technol. Platform, Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Design Technology Platform R & D, Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]},{"raw_affiliation_string":"Design Technol. Platform, Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5011720028","display_name":"Ping-Wei Wang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Ping-Wei Wang","raw_affiliation_strings":["Design Technology Platform R & D, Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan","Design Technol. Platform, Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Design Technology Platform R & D, Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]},{"raw_affiliation_string":"Design Technol. Platform, Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5109215102","display_name":"S.H. Dhong","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Sang-Hoo Dhong","raw_affiliation_strings":["Design Technology Platform R & D, Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan","Design Technol. Platform, Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Design Technology Platform R & D, Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]},{"raw_affiliation_string":"Design Technol. Platform, Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.08176431,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/static-random-access-memory","display_name":"Static random-access memory","score":0.601742148399353},{"id":"https://openalex.org/keywords/latency","display_name":"Latency (audio)","score":0.5236496925354004},{"id":"https://openalex.org/keywords/yield","display_name":"Yield (engineering)","score":0.5025753974914551},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.48397016525268555},{"id":"https://openalex.org/keywords/tile","display_name":"Tile","score":0.43024975061416626},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.32475048303604126},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.22448766231536865},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.2113877236843109},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.12416806817054749},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.09674903750419617}],"concepts":[{"id":"https://openalex.org/C68043766","wikidata":"https://www.wikidata.org/wiki/Q267416","display_name":"Static random-access memory","level":2,"score":0.601742148399353},{"id":"https://openalex.org/C82876162","wikidata":"https://www.wikidata.org/wiki/Q17096504","display_name":"Latency (audio)","level":2,"score":0.5236496925354004},{"id":"https://openalex.org/C134121241","wikidata":"https://www.wikidata.org/wiki/Q899301","display_name":"Yield (engineering)","level":2,"score":0.5025753974914551},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.48397016525268555},{"id":"https://openalex.org/C2780728851","wikidata":"https://www.wikidata.org/wiki/Q468402","display_name":"Tile","level":2,"score":0.43024975061416626},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.32475048303604126},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.22448766231536865},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.2113877236843109},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.12416806817054749},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.09674903750419617},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/cicc.2013.6658452","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2013.6658452","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE 2013 Custom Integrated Circuits Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.7799999713897705,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W2014357578","https://openalex.org/W2033887426","https://openalex.org/W2079083104","https://openalex.org/W2089064077","https://openalex.org/W2165765227","https://openalex.org/W6684238655"],"related_works":["https://openalex.org/W2114959296","https://openalex.org/W38346124","https://openalex.org/W2502442966","https://openalex.org/W2138666621","https://openalex.org/W2383936314","https://openalex.org/W1992771654","https://openalex.org/W2022661278","https://openalex.org/W2777914781","https://openalex.org/W4246369972","https://openalex.org/W4244869112"],"abstract_inverted_index":{"A":[0,64],"fully-pipelined":[1],"tile-able":[2],"1MB":[3],"SRAM":[4],"IP":[5],"with":[6,28,34,57],"a":[7,14,44],"0.127um":[8],"<sup":[9,24],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[10,25,61],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</sup>":[11,26],"cell":[12],"in":[13],"HKMG":[15],"28nm":[16],"bulk":[17],"technology":[18],"has":[19,43,70],"an":[20],"area":[21],"of":[22,48,68],"1.39mm":[23],"/MB":[27],"79.2%":[29],"array":[30],"efficiency.":[31],"It":[32],"operates":[33],"2-cycle":[35],"latency":[36],"up":[37],"to":[38],"1GHz.":[39],"The":[40],"no-repair":[41],"hardware":[42],"circuit":[45],"limited":[46],"yield":[47],"99.92":[49],"and":[50,54],"53%":[51],"at":[52],"100":[53],"850MHz,":[55],"respectively":[56],"0.75V":[58],"V":[59],"<sub":[60],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">DD</sub>":[62],".":[63],"Data":[65],"Retention":[66],"Voltage":[67],"0.42V":[69],"been":[71],"measured.":[72]},"counts_by_year":[],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}