{"id":"https://openalex.org/W2016808412","doi":"https://doi.org/10.1109/cicc.2012.6330685","title":"Lithography and design integration — New paradigm for the technology architecture development","display_name":"Lithography and design integration — New paradigm for the technology architecture development","publication_year":2012,"publication_date":"2012-09-01","ids":{"openalex":"https://openalex.org/W2016808412","doi":"https://doi.org/10.1109/cicc.2012.6330685","mag":"2016808412"},"language":"en","primary_location":{"id":"doi:10.1109/cicc.2012.6330685","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2012.6330685","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE 2012 Custom Integrated Circuits Conference","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111832882","display_name":"Jongwook Kye","orcid":null},"institutions":[{"id":"https://openalex.org/I35662394","display_name":"GlobalFoundries (United States)","ror":"https://ror.org/02h0ps145","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jongwook Kye","raw_affiliation_strings":["GLOBALFOUNDRIES, Inc., Sunnyvale, CA, USA","GLOBALFOUNDRIES, 1050 Arques Ave., Sunnyvale, CA 94088, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES, Inc., Sunnyvale, CA, USA","institution_ids":["https://openalex.org/I35662394"]},{"raw_affiliation_string":"GLOBALFOUNDRIES, 1050 Arques Ave., Sunnyvale, CA 94088, USA","institution_ids":["https://openalex.org/I35662394"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102166243","display_name":"Yuansheng Ma","orcid":null},"institutions":[{"id":"https://openalex.org/I35662394","display_name":"GlobalFoundries (United States)","ror":"https://ror.org/02h0ps145","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yuansheng Ma","raw_affiliation_strings":["GLOBALFOUNDRIES, Inc., Sunnyvale, CA, USA","GLOBALFOUNDRIES, 1050 Arques Ave., Sunnyvale, CA 94088, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES, Inc., Sunnyvale, CA, USA","institution_ids":["https://openalex.org/I35662394"]},{"raw_affiliation_string":"GLOBALFOUNDRIES, 1050 Arques Ave., Sunnyvale, CA 94088, USA","institution_ids":["https://openalex.org/I35662394"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100633051","display_name":"Lei Yuan","orcid":"https://orcid.org/0000-0003-0826-648X"},"institutions":[{"id":"https://openalex.org/I35662394","display_name":"GlobalFoundries (United States)","ror":"https://ror.org/02h0ps145","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Lei Yuan","raw_affiliation_strings":["GLOBALFOUNDRIES, Inc., Sunnyvale, CA, USA","GLOBALFOUNDRIES, 1050 Arques Ave., Sunnyvale, CA 94088, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES, Inc., Sunnyvale, CA, USA","institution_ids":["https://openalex.org/I35662394"]},{"raw_affiliation_string":"GLOBALFOUNDRIES, 1050 Arques Ave., Sunnyvale, CA 94088, USA","institution_ids":["https://openalex.org/I35662394"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110001992","display_name":"Yunfei Deng","orcid":null},"institutions":[{"id":"https://openalex.org/I35662394","display_name":"GlobalFoundries (United States)","ror":"https://ror.org/02h0ps145","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yunfei Deng","raw_affiliation_strings":["GLOBALFOUNDRIES, Inc., Sunnyvale, CA, USA","GLOBALFOUNDRIES, 1050 Arques Ave., Sunnyvale, CA 94088, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES, Inc., Sunnyvale, CA, USA","institution_ids":["https://openalex.org/I35662394"]},{"raw_affiliation_string":"GLOBALFOUNDRIES, 1050 Arques Ave., Sunnyvale, CA 94088, USA","institution_ids":["https://openalex.org/I35662394"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5040932462","display_name":"Harry Levinson","orcid":"https://orcid.org/0000-0001-7188-1536"},"institutions":[{"id":"https://openalex.org/I35662394","display_name":"GlobalFoundries (United States)","ror":"https://ror.org/02h0ps145","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Harry Levinson","raw_affiliation_strings":["GLOBALFOUNDRIES, Inc., Sunnyvale, CA, USA","GLOBALFOUNDRIES, 1050 Arques Ave., Sunnyvale, CA 94088, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES, Inc., Sunnyvale, CA, USA","institution_ids":["https://openalex.org/I35662394"]},{"raw_affiliation_string":"GLOBALFOUNDRIES, 1050 Arques Ave., Sunnyvale, CA 94088, USA","institution_ids":["https://openalex.org/I35662394"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I35662394"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":"7973","issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9440000057220459,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9440000057220459,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9373000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/multiple-patterning","display_name":"Multiple patterning","score":0.8159334659576416},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.8141357898712158},{"id":"https://openalex.org/keywords/node","display_name":"Node (physics)","score":0.6592228412628174},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6021191477775574},{"id":"https://openalex.org/keywords/computational-lithography","display_name":"Computational lithography","score":0.5849502086639404},{"id":"https://openalex.org/keywords/immersion-lithography","display_name":"Immersion lithography","score":0.5085405111312866},{"id":"https://openalex.org/keywords/scaling","display_name":"Scaling","score":0.5033299326896667},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.47599685192108154},{"id":"https://openalex.org/keywords/architecture","display_name":"Architecture","score":0.46142393350601196},{"id":"https://openalex.org/keywords/extreme-ultraviolet-lithography","display_name":"Extreme ultraviolet lithography","score":0.4193223714828491},{"id":"https://openalex.org/keywords/next-generation-lithography","display_name":"Next-generation lithography","score":0.410075306892395},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.3859657645225525},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3249410390853882},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.25253939628601074},{"id":"https://openalex.org/keywords/resist","display_name":"Resist","score":0.23769861459732056},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.21108391880989075},{"id":"https://openalex.org/keywords/electron-beam-lithography","display_name":"Electron-beam lithography","score":0.17037466168403625}],"concepts":[{"id":"https://openalex.org/C177409738","wikidata":"https://www.wikidata.org/wiki/Q1917460","display_name":"Multiple patterning","level":4,"score":0.8159334659576416},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.8141357898712158},{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.6592228412628174},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6021191477775574},{"id":"https://openalex.org/C182873914","wikidata":"https://www.wikidata.org/wiki/Q5157329","display_name":"Computational lithography","level":5,"score":0.5849502086639404},{"id":"https://openalex.org/C94263209","wikidata":"https://www.wikidata.org/wiki/Q1076175","display_name":"Immersion lithography","level":4,"score":0.5085405111312866},{"id":"https://openalex.org/C99844830","wikidata":"https://www.wikidata.org/wiki/Q102441924","display_name":"Scaling","level":2,"score":0.5033299326896667},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.47599685192108154},{"id":"https://openalex.org/C123657996","wikidata":"https://www.wikidata.org/wiki/Q12271","display_name":"Architecture","level":2,"score":0.46142393350601196},{"id":"https://openalex.org/C162996421","wikidata":"https://www.wikidata.org/wiki/Q371965","display_name":"Extreme ultraviolet lithography","level":2,"score":0.4193223714828491},{"id":"https://openalex.org/C163581340","wikidata":"https://www.wikidata.org/wiki/Q1983848","display_name":"Next-generation lithography","level":5,"score":0.410075306892395},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3859657645225525},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3249410390853882},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.25253939628601074},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.23769861459732056},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.21108391880989075},{"id":"https://openalex.org/C200274948","wikidata":"https://www.wikidata.org/wiki/Q256845","display_name":"Electron-beam lithography","level":4,"score":0.17037466168403625},{"id":"https://openalex.org/C142362112","wikidata":"https://www.wikidata.org/wiki/Q735","display_name":"Art","level":0,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.0},{"id":"https://openalex.org/C153349607","wikidata":"https://www.wikidata.org/wiki/Q36649","display_name":"Visual arts","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/cicc.2012.6330685","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2012.6330685","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE 2012 Custom Integrated Circuits Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.47999998927116394,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W1974376306","https://openalex.org/W2004752952","https://openalex.org/W2037378117","https://openalex.org/W2038178364","https://openalex.org/W2056491067","https://openalex.org/W2075369592","https://openalex.org/W2090109439","https://openalex.org/W2091425542"],"related_works":["https://openalex.org/W2078864937","https://openalex.org/W2971086886","https://openalex.org/W2077244098","https://openalex.org/W1971760865","https://openalex.org/W1991236041","https://openalex.org/W2115795789","https://openalex.org/W2003971204","https://openalex.org/W2054486439","https://openalex.org/W2053625825","https://openalex.org/W4401516118"],"abstract_inverted_index":{"This":[0],"paper":[1],"proposes":[2],"a":[3],"new":[4],"paradigm":[5],"for":[6,56],"coordination":[7],"of":[8,18],"lithography":[9,22],"and":[10,58],"design":[11],"at":[12],"advanced":[13],"technology":[14,19],"nodes.":[15],"Growing":[16],"complexity":[17],"without":[20],"any":[21,30,47],"pitch":[23],"reduction":[24],"(knowing":[25],"that":[26],"we":[27,37,73],"don't":[28],"have":[29],"imminent":[31],"lens":[32],"NA":[33],"or":[34],"wavelength":[35],"improvement)":[36],"need":[38],"to":[39,42,63,70],"challenge":[40],"node":[41,43],"scaling":[44],"more":[45],"than":[46],"time":[48],"before.":[49],"To":[50],"achieve":[51],"an":[52],"appropriate":[53],"scale":[54],"factor":[55],"20nm":[57],"beyond":[59],"it":[60],"is":[61],"necessary":[62],"introduce":[64],"double":[65],"patterning.":[66],"We":[67],"are":[68],"going":[69],"explain":[71],"how":[72],"change":[74],"our":[75],"landscape.":[76]},"counts_by_year":[{"year":2016,"cited_by_count":3},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}