{"id":"https://openalex.org/W2097239543","doi":"https://doi.org/10.1109/cicc.2011.6055399","title":"An output structure for a bi-modal 6.4-Gbps GDDR5 and 2.4-Gbps DDR3 compatible memory interface","display_name":"An output structure for a bi-modal 6.4-Gbps GDDR5 and 2.4-Gbps DDR3 compatible memory interface","publication_year":2011,"publication_date":"2011-09-01","ids":{"openalex":"https://openalex.org/W2097239543","doi":"https://doi.org/10.1109/cicc.2011.6055399","mag":"2097239543"},"language":"en","primary_location":{"id":"doi:10.1109/cicc.2011.6055399","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2011.6055399","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 IEEE Custom Integrated Circuits Conference (CICC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111885101","display_name":"N. Mishra","orcid":null},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Navin K. Mishra","raw_affiliation_strings":["Rambus Chip Technologies, Bangalore, India"],"affiliations":[{"raw_affiliation_string":"Rambus Chip Technologies, Bangalore, India","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5007422862","display_name":"Manish Jain","orcid":"https://orcid.org/0000-0001-9329-6434"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Manish Jain","raw_affiliation_strings":["Rambus Chip Technologies, Bangalore, India"],"affiliations":[{"raw_affiliation_string":"Rambus Chip Technologies, Bangalore, India","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112378444","display_name":"Phuong Le","orcid":null},"institutions":[{"id":"https://openalex.org/I4210095722","display_name":"Rambus (United States)","ror":"https://ror.org/00pn5a327","country_code":"US","type":"company","lineage":["https://openalex.org/I4210095722"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Phuong Le","raw_affiliation_strings":["Rambus Inc., Sunnyvale, CA, USA","Rambus Inc., 1050 Enterprise Way, Suite 700, Sunnyvale, CA, U.S.A"],"affiliations":[{"raw_affiliation_string":"Rambus Inc., Sunnyvale, CA, USA","institution_ids":["https://openalex.org/I4210095722"]},{"raw_affiliation_string":"Rambus Inc., 1050 Enterprise Way, Suite 700, Sunnyvale, CA, U.S.A","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030792224","display_name":"Sanku Mukherjee","orcid":null},"institutions":[{"id":"https://openalex.org/I4210095722","display_name":"Rambus (United States)","ror":"https://ror.org/00pn5a327","country_code":"US","type":"company","lineage":["https://openalex.org/I4210095722"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sanku Mukherjee","raw_affiliation_strings":["Rambus Inc., Sunnyvale, CA, USA","Rambus Inc., 1050 Enterprise Way, Suite 700, Sunnyvale, CA, U.S.A"],"affiliations":[{"raw_affiliation_string":"Rambus Inc., Sunnyvale, CA, USA","institution_ids":["https://openalex.org/I4210095722"]},{"raw_affiliation_string":"Rambus Inc., 1050 Enterprise Way, Suite 700, Sunnyvale, CA, U.S.A","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5015537552","display_name":"Arul Sendhil","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Arul Sendhil","raw_affiliation_strings":["Rambus Chip Technologies, Bangalore, India"],"affiliations":[{"raw_affiliation_string":"Rambus Chip Technologies, Bangalore, India","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5012382547","display_name":"Amir Amirkhany","orcid":"https://orcid.org/0000-0002-4377-6947"},"institutions":[{"id":"https://openalex.org/I4210095722","display_name":"Rambus (United States)","ror":"https://ror.org/00pn5a327","country_code":"US","type":"company","lineage":["https://openalex.org/I4210095722"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Amir Amirkhany","raw_affiliation_strings":["Rambus Inc., Sunnyvale, CA, USA","Rambus Inc., 1050 Enterprise Way, Suite 700, Sunnyvale, CA, U.S.A"],"affiliations":[{"raw_affiliation_string":"Rambus Inc., Sunnyvale, CA, USA","institution_ids":["https://openalex.org/I4210095722"]},{"raw_affiliation_string":"Rambus Inc., 1050 Enterprise Way, Suite 700, Sunnyvale, CA, U.S.A","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5111885101"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.5299,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.71003581,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11417","display_name":"Advancements in PLL and VCO Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11417","display_name":"Advancements in PLL and VCO Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9945999979972839,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.7814233303070068},{"id":"https://openalex.org/keywords/capacitive-sensing","display_name":"Capacitive sensing","score":0.5967370271682739},{"id":"https://openalex.org/keywords/modal","display_name":"Modal","score":0.5818289518356323},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5425617694854736},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5112590789794922},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3023339807987213},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2549474835395813},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.18079012632369995},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.055647820234298706}],"concepts":[{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.7814233303070068},{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.5967370271682739},{"id":"https://openalex.org/C71139939","wikidata":"https://www.wikidata.org/wiki/Q910194","display_name":"Modal","level":2,"score":0.5818289518356323},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5425617694854736},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5112590789794922},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3023339807987213},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2549474835395813},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.18079012632369995},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.055647820234298706},{"id":"https://openalex.org/C188027245","wikidata":"https://www.wikidata.org/wiki/Q750446","display_name":"Polymer chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C157915830","wikidata":"https://www.wikidata.org/wiki/Q2928001","display_name":"Bubble","level":2,"score":0.0},{"id":"https://openalex.org/C129307140","wikidata":"https://www.wikidata.org/wiki/Q6795880","display_name":"Maximum bubble pressure method","level":3,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/cicc.2011.6055399","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2011.6055399","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 IEEE Custom Integrated Circuits Conference (CICC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.8799999952316284}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W1986315961","https://openalex.org/W2099974801","https://openalex.org/W2101940004","https://openalex.org/W2104543397","https://openalex.org/W2145590995","https://openalex.org/W6646650030"],"related_works":["https://openalex.org/W3102847316","https://openalex.org/W3172386668","https://openalex.org/W2045392317","https://openalex.org/W2035297892","https://openalex.org/W3011006018","https://openalex.org/W4205540626","https://openalex.org/W2143949944","https://openalex.org/W2051563071","https://openalex.org/W4386571252","https://openalex.org/W2981692717"],"abstract_inverted_index":{"A":[0],"bi-modal":[1],"x32":[2],"memory":[3],"interface":[4,21],"supports":[5,30],"6.4-Gbps":[6],"GDDR5":[7,58,71],"signaling":[8,14],"as":[9,11],"well":[10],"2.4-Gbps":[12],"DDR3":[13,60,68],"with":[15,66],"a":[16,23],"1.5V":[17],"IO":[18],"supply.":[19],"The":[20,42],"incorporates":[22],"novel":[24],"driver":[25],"and":[26,33,48,53,59,63,69],"pre-driver":[27],"structure":[28],"that":[29],"one-tap":[31],"equalization":[32],"presents":[34],"very":[35],"small":[36],"capacitive":[37],"loading":[38],"to":[39],"the":[40],"pins.":[41],"entire":[43],"interface,":[44],"including":[45],"both":[46],"data":[47],"request":[49],"channels":[50],"achieves":[51],"11.6mW/Gbps":[52],"27.7mW/Gbps":[54],"energy":[55],"efficiencies":[56],"in":[57],"modes":[61],"respectively,":[62],"communicates":[64],"successfully":[65],"1.6-Gbps":[67],"6.0-Gbps":[70],"DRAMs.":[72]},"counts_by_year":[{"year":2015,"cited_by_count":1},{"year":2012,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}