{"id":"https://openalex.org/W2097006642","doi":"https://doi.org/10.1109/cicc.2008.4672172","title":"Variability in 3-D integrated circuits","display_name":"Variability in 3-D integrated circuits","publication_year":2008,"publication_date":"2008-09-01","ids":{"openalex":"https://openalex.org/W2097006642","doi":"https://doi.org/10.1109/cicc.2008.4672172","mag":"2097006642"},"language":"en","primary_location":{"id":"doi:10.1109/cicc.2008.4672172","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2008.4672172","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2008 IEEE Custom Integrated Circuits Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5081788301","display_name":"Filipp Akopyan","orcid":null},"institutions":[{"id":"https://openalex.org/I205783295","display_name":"Cornell University","ror":"https://ror.org/05bnh6r87","country_code":"US","type":"education","lineage":["https://openalex.org/I205783295"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Filipp Akopyan","raw_affiliation_strings":["Computer Systems Laboratory, Cornell University, Ithaca, NY, USA","Computer Systems Lab, Cornell University, Ithaca, NY"],"affiliations":[{"raw_affiliation_string":"Computer Systems Laboratory, Cornell University, Ithaca, NY, USA","institution_ids":["https://openalex.org/I205783295"]},{"raw_affiliation_string":"Computer Systems Lab, Cornell University, Ithaca, NY","institution_ids":["https://openalex.org/I205783295"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022228550","display_name":"Carlos Tadeo Ortega Otero","orcid":null},"institutions":[{"id":"https://openalex.org/I205783295","display_name":"Cornell University","ror":"https://ror.org/05bnh6r87","country_code":"US","type":"education","lineage":["https://openalex.org/I205783295"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Carlos Tadeo Ortega Otero","raw_affiliation_strings":["Computer Systems Laboratory, Cornell University, Ithaca, NY, USA","Computer Systems Lab, Cornell University, Ithaca, NY"],"affiliations":[{"raw_affiliation_string":"Computer Systems Laboratory, Cornell University, Ithaca, NY, USA","institution_ids":["https://openalex.org/I205783295"]},{"raw_affiliation_string":"Computer Systems Lab, Cornell University, Ithaca, NY","institution_ids":["https://openalex.org/I205783295"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006002801","display_name":"David Fang","orcid":null},"institutions":[{"id":"https://openalex.org/I205783295","display_name":"Cornell University","ror":"https://ror.org/05bnh6r87","country_code":"US","type":"education","lineage":["https://openalex.org/I205783295"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"David Fang","raw_affiliation_strings":["Computer Systems Laboratory, Cornell University, Ithaca, NY, USA","Computer Systems Lab, Cornell University, Ithaca, NY"],"affiliations":[{"raw_affiliation_string":"Computer Systems Laboratory, Cornell University, Ithaca, NY, USA","institution_ids":["https://openalex.org/I205783295"]},{"raw_affiliation_string":"Computer Systems Lab, Cornell University, Ithaca, NY","institution_ids":["https://openalex.org/I205783295"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103323207","display_name":"Sandra Jackson","orcid":null},"institutions":[{"id":"https://openalex.org/I205783295","display_name":"Cornell University","ror":"https://ror.org/05bnh6r87","country_code":"US","type":"education","lineage":["https://openalex.org/I205783295"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sandra J. Jackson","raw_affiliation_strings":["Computer Systems Laboratory, Cornell University, Ithaca, NY, USA","Computer Systems Lab, Cornell University, Ithaca, NY"],"affiliations":[{"raw_affiliation_string":"Computer Systems Laboratory, Cornell University, Ithaca, NY, USA","institution_ids":["https://openalex.org/I205783295"]},{"raw_affiliation_string":"Computer Systems Lab, Cornell University, Ithaca, NY","institution_ids":["https://openalex.org/I205783295"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5002575415","display_name":"Rajit Manohar","orcid":"https://orcid.org/0000-0001-8211-6602"},"institutions":[{"id":"https://openalex.org/I205783295","display_name":"Cornell University","ror":"https://ror.org/05bnh6r87","country_code":"US","type":"education","lineage":["https://openalex.org/I205783295"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Rajit Manohar","raw_affiliation_strings":["Computer Systems Laboratory, Cornell University, Ithaca, NY, USA","Computer Systems Lab, Cornell University, Ithaca, NY"],"affiliations":[{"raw_affiliation_string":"Computer Systems Laboratory, Cornell University, Ithaca, NY, USA","institution_ids":["https://openalex.org/I205783295"]},{"raw_affiliation_string":"Computer Systems Lab, Cornell University, Ithaca, NY","institution_ids":["https://openalex.org/I205783295"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5081788301"],"corresponding_institution_ids":["https://openalex.org/I205783295"],"apc_list":null,"apc_paid":null,"fwci":1.6647,"has_fulltext":false,"cited_by_count":16,"citation_normalized_percentile":{"value":0.84544206,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"659","last_page":"662"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10623","display_name":"Thin-Film Transistor Technologies","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.6090701222419739},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.6028386354446411},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.6023709177970886},{"id":"https://openalex.org/keywords/digital-electronics","display_name":"Digital electronics","score":0.5425480008125305},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5031995177268982},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4876188337802887},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.4802875220775604},{"id":"https://openalex.org/keywords/mixed-signal-integrated-circuit","display_name":"Mixed-signal integrated circuit","score":0.47076061367988586},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.4562377631664276},{"id":"https://openalex.org/keywords/integrated-circuit-design","display_name":"Integrated circuit design","score":0.4537395238876343},{"id":"https://openalex.org/keywords/logic-gate","display_name":"Logic gate","score":0.42112863063812256},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.41952720284461975},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.33443063497543335},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2513522207736969},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.24534818530082703},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.15885895490646362},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.10784924030303955},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.08709070086479187}],"concepts":[{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.6090701222419739},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.6028386354446411},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.6023709177970886},{"id":"https://openalex.org/C81843906","wikidata":"https://www.wikidata.org/wiki/Q173156","display_name":"Digital electronics","level":3,"score":0.5425480008125305},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5031995177268982},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4876188337802887},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.4802875220775604},{"id":"https://openalex.org/C62907940","wikidata":"https://www.wikidata.org/wiki/Q1541329","display_name":"Mixed-signal integrated circuit","level":3,"score":0.47076061367988586},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4562377631664276},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.4537395238876343},{"id":"https://openalex.org/C131017901","wikidata":"https://www.wikidata.org/wiki/Q170451","display_name":"Logic gate","level":2,"score":0.42112863063812256},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.41952720284461975},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.33443063497543335},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2513522207736969},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.24534818530082703},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.15885895490646362},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.10784924030303955},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.08709070086479187},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/cicc.2008.4672172","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2008.4672172","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2008 IEEE Custom Integrated Circuits Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.8299999833106995}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":21,"referenced_works":["https://openalex.org/W1993700253","https://openalex.org/W2005226599","https://openalex.org/W2009795871","https://openalex.org/W2023264348","https://openalex.org/W2027918523","https://openalex.org/W2114415166","https://openalex.org/W2117816012","https://openalex.org/W2118687888","https://openalex.org/W2126073857","https://openalex.org/W2130517400","https://openalex.org/W2134829921","https://openalex.org/W2138329321","https://openalex.org/W2139155713","https://openalex.org/W2144149750","https://openalex.org/W2151734895","https://openalex.org/W2295688064","https://openalex.org/W2536066754","https://openalex.org/W3145025383","https://openalex.org/W4253549065","https://openalex.org/W6678980098","https://openalex.org/W6728469656"],"related_works":["https://openalex.org/W2031235560","https://openalex.org/W2161335888","https://openalex.org/W4242383160","https://openalex.org/W1980349267","https://openalex.org/W2114773158","https://openalex.org/W2548106609","https://openalex.org/W2154989823","https://openalex.org/W1957521530","https://openalex.org/W1917800633","https://openalex.org/W1852277090"],"abstract_inverted_index":{"In":[0],"recent":[1],"years,":[2],"there":[3],"has":[4,18],"been":[5,19],"a":[6],"trend":[7],"among":[8],"digital":[9],"and":[10,48,66],"analog":[11],"circuit":[12,74],"designers":[13],"towards":[14],"three-dimensional":[15],"integration.":[16],"There":[17],"some":[20],"debate":[21],"regarding":[22],"the":[23,43,54,60,68],"applicability":[24],"of":[25,56,59,70],"3-D":[26,61],"technology":[27],"to":[28,35],"general":[29],"logic":[30],"circuits,":[31],"especially":[32],"with":[33,64],"regard":[34],"thermal":[36],"issues.":[37],"We":[38,51],"examine":[39],"process":[40],"variations":[41],"on":[42,73],"same":[44],"layer,":[45],"across":[46],"layers,":[47],"cross-chip":[49],"variations.":[50],"show":[52],"how":[53],"performance":[55],"each":[57],"layer":[58],"chip":[62],"varies":[63],"temperature,":[65],"demonstrate":[67],"effect":[69],"heat":[71],"pipes":[72],"performance.":[75]},"counts_by_year":[{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":3},{"year":2012,"cited_by_count":5}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}