{"id":"https://openalex.org/W2159039928","doi":"https://doi.org/10.1109/cicc.2007.4405670","title":"3D Capacitive Interconnections for High Speed Interchip Communication","display_name":"3D Capacitive Interconnections for High Speed Interchip Communication","publication_year":2007,"publication_date":"2007-09-01","ids":{"openalex":"https://openalex.org/W2159039928","doi":"https://doi.org/10.1109/cicc.2007.4405670","mag":"2159039928"},"language":"en","primary_location":{"id":"doi:10.1109/cicc.2007.4405670","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2007.4405670","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2007 IEEE Custom Integrated Circuits Conference","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5044201884","display_name":"R. Canegallo","orcid":"https://orcid.org/0000-0002-3381-0697"},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Roberto Canegallo","raw_affiliation_strings":["STMicroelectronics, Agrate Brianza, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Agrate Brianza, Italy","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5091297097","display_name":"A. Fazzi","orcid":"https://orcid.org/0000-0001-5384-9962"},"institutions":[{"id":"https://openalex.org/I9360294","display_name":"University of Bologna","ror":"https://ror.org/01111rn36","country_code":"IT","type":"education","lineage":["https://openalex.org/I9360294"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Alberto Fazzi","raw_affiliation_strings":["ARCES, University of Bologna, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ARCES, University of Bologna, Italy","institution_ids":["https://openalex.org/I9360294"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089473560","display_name":"Luca Ciccarelli","orcid":null},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Luca Ciccarelli","raw_affiliation_strings":["STMicroelectronics, Agrate Brianza, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Agrate Brianza, Italy","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021451362","display_name":"L. Magagni","orcid":null},"institutions":[{"id":"https://openalex.org/I9360294","display_name":"University of Bologna","ror":"https://ror.org/01111rn36","country_code":"IT","type":"education","lineage":["https://openalex.org/I9360294"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Luca Magagni","raw_affiliation_strings":["ARCES, University of Bologna, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ARCES, University of Bologna, Italy","institution_ids":["https://openalex.org/I9360294"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5066709887","display_name":"Federico Natali","orcid":null},"institutions":[{"id":"https://openalex.org/I9360294","display_name":"University of Bologna","ror":"https://ror.org/01111rn36","country_code":"IT","type":"education","lineage":["https://openalex.org/I9360294"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Federico Natali","raw_affiliation_strings":["ARCES, University of Bologna, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ARCES, University of Bologna, Italy","institution_ids":["https://openalex.org/I9360294"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109242172","display_name":"Pierluigi Rolandi","orcid":null},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"PierLuigi Rolandi","raw_affiliation_strings":["STMicroelectronics, Agrate Brianza, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Agrate Brianza, Italy","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018051850","display_name":"Erik Jung","orcid":"https://orcid.org/0000-0001-6172-6532"},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Erik Jung","raw_affiliation_strings":["IZM Fraunhofer, Berlin, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IZM Fraunhofer, Berlin, Germany","institution_ids":["https://openalex.org/I4210134425"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004087886","display_name":"L. Di Cioccio","orcid":"https://orcid.org/0000-0002-9327-7118"},"institutions":[{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Lea di Cioccio","raw_affiliation_strings":["CEA-Leti, Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CEA-Leti, Grenoble, France","institution_ids":["https://openalex.org/I2738703131","https://openalex.org/I4210150049"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5040667886","display_name":"R. Guerrieri","orcid":"https://orcid.org/0000-0002-8601-6884"},"institutions":[{"id":"https://openalex.org/I9360294","display_name":"University of Bologna","ror":"https://ror.org/01111rn36","country_code":"IT","type":"education","lineage":["https://openalex.org/I9360294"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Roberto Guerrieri","raw_affiliation_strings":["ARCES, University of Bologna, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ARCES, University of Bologna, Italy","institution_ids":["https://openalex.org/I9360294"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.4991,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.64513297,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"8"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9987000226974487,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9972000122070312,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/asynchronous-communication","display_name":"Asynchronous communication","score":0.5915381908416748},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5341628789901733},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.48625195026397705},{"id":"https://openalex.org/keywords/capacitive-coupling","display_name":"Capacitive coupling","score":0.45251184701919556},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.4385247826576233},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.312507688999176},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2000138759613037},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.18080806732177734}],"concepts":[{"id":"https://openalex.org/C151319957","wikidata":"https://www.wikidata.org/wiki/Q752739","display_name":"Asynchronous communication","level":2,"score":0.5915381908416748},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5341628789901733},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.48625195026397705},{"id":"https://openalex.org/C68278764","wikidata":"https://www.wikidata.org/wiki/Q444167","display_name":"Capacitive coupling","level":3,"score":0.45251184701919556},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.4385247826576233},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.312507688999176},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2000138759613037},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.18080806732177734},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0}],"mesh":[],"locations_count":4,"locations":[{"id":"doi:10.1109/cicc.2007.4405670","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2007.4405670","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2007 IEEE Custom Integrated Circuits Conference","raw_type":"proceedings-article"},{"id":"pmh:oai:cris.unibo.it:11585/70341","is_oa":false,"landing_page_url":"http://ieeexplore.ieee.org/document/4405670/","pdf_url":null,"source":{"id":"https://openalex.org/S4306402579","display_name":"Archivio istituzionale della ricerca (Alma Mater Studiorum Universit\u00e0 di Bologna)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4210117483","host_organization_name":"Istituto di Ematologia di Bologna","host_organization_lineage":["https://openalex.org/I4210117483"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"info:eu-repo/semantics/conferenceObject"},{"id":"pmh:oai:fraunhofer.de:N-173037","is_oa":false,"landing_page_url":"http://publica.fraunhofer.de/documents/N-173037.html","pdf_url":null,"source":{"id":"https://openalex.org/S4306400801","display_name":"Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Fraunhofer IZM","raw_type":"Conference Paper"},{"id":"pmh:oai:publica.fraunhofer.de:publica/361328","is_oa":false,"landing_page_url":"https://publica.fraunhofer.de/handle/publica/361328","pdf_url":null,"source":{"id":"https://openalex.org/S4306400318","display_name":"Fraunhofer-Publica (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"conference paper"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.9200000166893005,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":16,"referenced_works":["https://openalex.org/W35513896","https://openalex.org/W1524885163","https://openalex.org/W1982845048","https://openalex.org/W2005761748","https://openalex.org/W2021366471","https://openalex.org/W2023264348","https://openalex.org/W2060337673","https://openalex.org/W2138822603","https://openalex.org/W2143566085","https://openalex.org/W2150283660","https://openalex.org/W2175000298","https://openalex.org/W2186706209","https://openalex.org/W2295688064","https://openalex.org/W3146284279","https://openalex.org/W4245434926","https://openalex.org/W6651810353"],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W2116677773","https://openalex.org/W3014521742","https://openalex.org/W2155261584","https://openalex.org/W2584231425","https://openalex.org/W2150611273","https://openalex.org/W4207086172","https://openalex.org/W2042919702","https://openalex.org/W2617868873","https://openalex.org/W4225981436"],"abstract_inverted_index":{"A":[0],"3D":[1],"interconnection":[2],"scheme":[3,60],"based":[4],"on":[5,110],"capacitive":[6],"coupling":[7],"for":[8,29],"high":[9],"speed":[10],"chip":[11,13],"to":[12,51],"communication":[14],"has":[15],"been":[16,87],"implemented":[17],"in":[18],"a":[19,72],"0.13\u03bcm":[20],"CMOS":[21],"process.":[22],"This":[23],"paper":[24],"provides":[25],"detailed":[26],"design":[27],"example":[28],"both":[30,91],"synchronous":[31],"and":[32,35,71,84,93,97],"asynchronous":[33,59],"transmitter":[34],"receiver":[36],"circuits.":[37],"The":[38],"first":[39],"approach":[40],"shows":[41],"with":[42,63,79,107],"electrodes":[43,64],"15\u00d715\u03bcm2a":[44],"wide":[45],"range":[46],"of":[47,68,103],"operating":[48],"frequency":[49],"up":[50],"900MHzwith":[52],"an":[53],"energy":[54,80],"consumption":[55,81],"of41fJ/bit.":[56],"In":[57],"the":[58,101],"we":[61],"demonstrate":[62],"8\u00d78\u03bcm2a":[65],"vertical":[66],"propagation":[67,73],"clock":[69],"at1.7GHz":[70],"delay":[74],"of420psfor":[75],"general":[76],"purpose":[77],"signal":[78],"of80fJ/bit.":[82],"Functionality":[83],"performance":[85],"have":[86],"demonstrated":[88],"by":[89],"using":[90],"die-level":[92],"wafer-level":[94],"assembly":[95],"flows":[96],"BER":[98],"measurements":[99],"show":[100],"reliability":[102],"these":[104],"AC":[105],"interconnections":[106],"no":[108],"error":[109],"more":[111],"than1013bits":[112],"transmitted.":[113]},"counts_by_year":[{"year":2018,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":2}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}