{"id":"https://openalex.org/W1521582676","doi":"https://doi.org/10.1109/cicc.2005.1568744","title":"Will continued process-node shrinks kill high-performance analog design?","display_name":"Will continued process-node shrinks kill high-performance analog design?","publication_year":2006,"publication_date":"2006-01-18","ids":{"openalex":"https://openalex.org/W1521582676","doi":"https://doi.org/10.1109/cicc.2005.1568744","mag":"1521582676"},"language":"en","primary_location":{"id":"doi:10.1109/cicc.2005.1568744","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2005.1568744","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005.","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5030960326","display_name":"Jafar Savoj","orcid":null},"institutions":[{"id":"https://openalex.org/I64003239","display_name":"Marvell (Israel)","ror":"https://ror.org/01484hw40","country_code":"IL","type":"company","lineage":["https://openalex.org/I4210092679","https://openalex.org/I4210154351","https://openalex.org/I64003239"]}],"countries":["IL"],"is_corresponding":true,"raw_author_name":"J. Savoj","raw_affiliation_strings":["Marvell Semiconductor"],"affiliations":[{"raw_affiliation_string":"Marvell Semiconductor","institution_ids":["https://openalex.org/I64003239"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027456415","display_name":"D.A. Rich","orcid":null},"institutions":[{"id":"https://openalex.org/I53276908","display_name":"Marymount University","ror":"https://ror.org/0008kv292","country_code":"US","type":"education","lineage":["https://openalex.org/I53276908"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. RIch","raw_affiliation_strings":["Consultant"],"affiliations":[{"raw_affiliation_string":"Consultant","institution_ids":["https://openalex.org/I53276908"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012898977","display_name":"B. Forejt","orcid":null},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"B. Forejt","raw_affiliation_strings":["Texas Instruments"],"affiliations":[{"raw_affiliation_string":"Texas Instruments","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049341354","display_name":"Peter R. Kinget","orcid":"https://orcid.org/0000-0002-5707-6394"},"institutions":[{"id":"https://openalex.org/I78577930","display_name":"Columbia University","ror":"https://ror.org/00hj8s172","country_code":"US","type":"education","lineage":["https://openalex.org/I78577930"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"P. Kinget","raw_affiliation_strings":["Columbia University"],"affiliations":[{"raw_affiliation_string":"Columbia University","institution_ids":["https://openalex.org/I78577930"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5005450048","display_name":"Un-Ku Moon","orcid":"https://orcid.org/0000-0003-1948-057X"},"institutions":[{"id":"https://openalex.org/I131249849","display_name":"Oregon State University","ror":"https://ror.org/00ysfqy60","country_code":"US","type":"education","lineage":["https://openalex.org/I131249849"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Un-Ku Moon","raw_affiliation_strings":["Oregon State University"],"affiliations":[{"raw_affiliation_string":"Oregon State University","institution_ids":["https://openalex.org/I131249849"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112574151","display_name":"Modest M. Oprysko","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"M. Oprysko","raw_affiliation_strings":["IBM"],"affiliations":[{"raw_affiliation_string":"IBM","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049567991","display_name":"Behzad Razavi","orcid":"https://orcid.org/0000-0003-1168-9205"},"institutions":[{"id":"https://openalex.org/I2799798094","display_name":"UCLA Health","ror":"https://ror.org/01d88se56","country_code":"US","type":"funder","lineage":["https://openalex.org/I2799798094"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"B. Razavi","raw_affiliation_strings":["UCLA"],"affiliations":[{"raw_affiliation_string":"UCLA","institution_ids":["https://openalex.org/I2799798094"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035837681","display_name":"H. Shichijo","orcid":"https://orcid.org/0000-0002-7593-388X"},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"H. Shichijo","raw_affiliation_strings":["Texas Instruments"],"affiliations":[{"raw_affiliation_string":"Texas Instruments","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5112846061","display_name":"Alice Wang","orcid":null},"institutions":[{"id":"https://openalex.org/I180949307","display_name":"Illinois Institute of Technology","ror":"https://ror.org/037t3ry66","country_code":"US","type":"education","lineage":["https://openalex.org/I180949307"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. Wang","raw_affiliation_strings":["Illinois Institute of Technology"],"affiliations":[{"raw_affiliation_string":"Illinois Institute of Technology","institution_ids":["https://openalex.org/I180949307"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":9,"corresponding_author_ids":["https://openalex.org/A5030960326"],"corresponding_institution_ids":["https://openalex.org/I64003239"],"apc_list":null,"apc_paid":null,"fwci":0.3761,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.61561834,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"616","last_page":"617"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9976999759674072,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9976999759674072,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9908999800682068,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10624","display_name":"Silicon and Solar Cell Technologies","score":0.9825999736785889,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.6798272728919983},{"id":"https://openalex.org/keywords/node","display_name":"Node (physics)","score":0.5678680539131165},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5641223788261414},{"id":"https://openalex.org/keywords/process-design","display_name":"Process design","score":0.4177214205265045},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.32405805587768555},{"id":"https://openalex.org/keywords/work-in-process","display_name":"Work in process","score":0.3175945281982422},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20698890089988708},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.09169080853462219},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.07481494545936584}],"concepts":[{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.6798272728919983},{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.5678680539131165},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5641223788261414},{"id":"https://openalex.org/C55396564","wikidata":"https://www.wikidata.org/wiki/Q3084971","display_name":"Process design","level":3,"score":0.4177214205265045},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.32405805587768555},{"id":"https://openalex.org/C174998907","wikidata":"https://www.wikidata.org/wiki/Q357662","display_name":"Work in process","level":2,"score":0.3175945281982422},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20698890089988708},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.09169080853462219},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.07481494545936584},{"id":"https://openalex.org/C21547014","wikidata":"https://www.wikidata.org/wiki/Q1423657","display_name":"Operations management","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/cicc.2005.1568744","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2005.1568744","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005.","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W3158741686","https://openalex.org/W2332467275","https://openalex.org/W2467867374","https://openalex.org/W147312233","https://openalex.org/W1987693969","https://openalex.org/W1552022284","https://openalex.org/W2224343096","https://openalex.org/W2077158186","https://openalex.org/W182682748","https://openalex.org/W1558182557"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}