{"id":"https://openalex.org/W2144358170","doi":"https://doi.org/10.1109/cicc.2004.1358750","title":"An overview of automated macromodelling techniques for mixed-signal systems","display_name":"An overview of automated macromodelling techniques for mixed-signal systems","publication_year":2004,"publication_date":"2004-11-30","ids":{"openalex":"https://openalex.org/W2144358170","doi":"https://doi.org/10.1109/cicc.2004.1358750","mag":"2144358170"},"language":"en","primary_location":{"id":"doi:10.1109/cicc.2004.1358750","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2004.1358750","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE 2004 Custom Integrated Circuits Conference (IEEE Cat. No.04CH37571)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5086798203","display_name":"Jaijeet Roychowdhury","orcid":"https://orcid.org/0000-0002-2684-2279"},"institutions":[{"id":"https://openalex.org/I130238516","display_name":"University of Minnesota","ror":"https://ror.org/017zqws13","country_code":"US","type":"education","lineage":["https://openalex.org/I130238516"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"J. Roychowdhury","raw_affiliation_strings":["ECE Department, University of Minnesota, USA","[Dept. of Electr. & Comput. Eng., Minnesota Univ., minneapolis, MN, USA]"],"affiliations":[{"raw_affiliation_string":"ECE Department, University of Minnesota, USA","institution_ids":["https://openalex.org/I130238516"]},{"raw_affiliation_string":"[Dept. of Electr. & Comput. Eng., Minnesota Univ., minneapolis, MN, USA]","institution_ids":["https://openalex.org/I130238516"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5086798203"],"corresponding_institution_ids":["https://openalex.org/I130238516"],"apc_list":null,"apc_paid":null,"fwci":1.3166,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.81753338,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"109","last_page":"116"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9975000023841858,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12810","display_name":"Real-time simulation and control systems","score":0.9965999722480774,"subfield":{"id":"https://openalex.org/subfields/2207","display_name":"Control and Systems Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/mixed-signal-integrated-circuit","display_name":"Mixed-signal integrated circuit","score":0.8468559384346008},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.7220139503479004},{"id":"https://openalex.org/keywords/spice","display_name":"Spice","score":0.6427520513534546},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.5515558123588562},{"id":"https://openalex.org/keywords/signal","display_name":"SIGNAL (programming language)","score":0.4905063509941101},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.4580402076244354},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.44916966557502747},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4206928014755249},{"id":"https://openalex.org/keywords/component","display_name":"Component (thermodynamics)","score":0.41796547174453735},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4099968671798706},{"id":"https://openalex.org/keywords/computer-engineering","display_name":"Computer engineering","score":0.36732813715934753},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3562246561050415},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.18766331672668457},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.08003777265548706}],"concepts":[{"id":"https://openalex.org/C62907940","wikidata":"https://www.wikidata.org/wiki/Q1541329","display_name":"Mixed-signal integrated circuit","level":3,"score":0.8468559384346008},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7220139503479004},{"id":"https://openalex.org/C2780077345","wikidata":"https://www.wikidata.org/wiki/Q16891888","display_name":"Spice","level":2,"score":0.6427520513534546},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.5515558123588562},{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.4905063509941101},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.4580402076244354},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.44916966557502747},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4206928014755249},{"id":"https://openalex.org/C168167062","wikidata":"https://www.wikidata.org/wiki/Q1117970","display_name":"Component (thermodynamics)","level":2,"score":0.41796547174453735},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4099968671798706},{"id":"https://openalex.org/C113775141","wikidata":"https://www.wikidata.org/wiki/Q428691","display_name":"Computer engineering","level":1,"score":0.36732813715934753},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3562246561050415},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.18766331672668457},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.08003777265548706},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/cicc.2004.1358750","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2004.1358750","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE 2004 Custom Integrated Circuits Conference (IEEE Cat. No.04CH37571)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":60,"referenced_works":["https://openalex.org/W110690611","https://openalex.org/W1495851026","https://openalex.org/W1506342804","https://openalex.org/W1515569264","https://openalex.org/W1597839575","https://openalex.org/W1601580514","https://openalex.org/W1973104828","https://openalex.org/W1986851782","https://openalex.org/W1991777572","https://openalex.org/W1998129635","https://openalex.org/W1998133603","https://openalex.org/W2016226822","https://openalex.org/W2037579718","https://openalex.org/W2058608814","https://openalex.org/W2060707164","https://openalex.org/W2079063703","https://openalex.org/W2097777449","https://openalex.org/W2101723010","https://openalex.org/W2110207912","https://openalex.org/W2113236374","https://openalex.org/W2113377690","https://openalex.org/W2117377214","https://openalex.org/W2117538235","https://openalex.org/W2119721135","https://openalex.org/W2122608783","https://openalex.org/W2123947147","https://openalex.org/W2128919817","https://openalex.org/W2133428059","https://openalex.org/W2136907476","https://openalex.org/W2137534401","https://openalex.org/W2138908842","https://openalex.org/W2144501572","https://openalex.org/W2145320787","https://openalex.org/W2158864279","https://openalex.org/W2159651350","https://openalex.org/W2162313341","https://openalex.org/W2163626738","https://openalex.org/W2164710736","https://openalex.org/W2169028264","https://openalex.org/W2170217485","https://openalex.org/W2477244626","https://openalex.org/W2542270486","https://openalex.org/W3150176780","https://openalex.org/W4238607819","https://openalex.org/W4240488901","https://openalex.org/W4243667334","https://openalex.org/W4245827549","https://openalex.org/W4246538414","https://openalex.org/W4252378425","https://openalex.org/W4252785977","https://openalex.org/W4254329463","https://openalex.org/W4285719527","https://openalex.org/W6649851160","https://openalex.org/W6649889231","https://openalex.org/W6659693719","https://openalex.org/W6665284538","https://openalex.org/W6674694181","https://openalex.org/W6674975923","https://openalex.org/W6684522442","https://openalex.org/W6729074126"],"related_works":["https://openalex.org/W2031235560","https://openalex.org/W2161335888","https://openalex.org/W2114773158","https://openalex.org/W2548106609","https://openalex.org/W1852277090","https://openalex.org/W1957521530","https://openalex.org/W2125423773","https://openalex.org/W1607309093","https://openalex.org/W2266281062","https://openalex.org/W2170610805"],"abstract_inverted_index":{"On-chip":[0],"and":[1,9,20,36,76,82],"on-package":[2],"integrated":[3],"systems,":[4],"such":[5,25,88],"as":[6],"systems-on-chip":[7],"(SoCs)":[8],"systems-in-packages":[10],"(SiPs),":[11],"are":[12],"composed":[13],"of":[14,18,47,56,69,79,87],"a":[15],"complex":[16],"mix":[17],"digital":[19],"mixed-signal":[21,80],"circuit":[22,48],"blocks.":[23],"Verifying":[24],"systems":[26],"prior":[27],"to":[28,33],"fabrication":[29],"is":[30,50],"challenging":[31],"due":[32],"their":[34],"size":[35],"complexity.":[37],"Automated":[38],"approaches":[39],"towards":[40],"extracting":[41,74],"system-level":[42],"macromodels":[43,78],"from":[44],"SPICE-level":[45],"descriptions":[46],"blocks":[49],"becoming":[51],"an":[52,67],"increasingly":[53],"important":[54],"component":[55],"sustainable":[57],"methodologies":[58],"for":[59,73],"system":[60],"verification.":[61],"In":[62],"this":[63],"paper,":[64],"we":[65],"present":[66],"overview":[68],"recent":[70],"algorithmic":[71],"methods":[72],"linear":[75],"nonlinear":[77],"circuits,":[81],"highlight":[83],"the":[84],"potential":[85],"impact":[86],"techniques.":[89]},"counts_by_year":[{"year":2014,"cited_by_count":2},{"year":2012,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}