{"id":"https://openalex.org/W1540266922","doi":"https://doi.org/10.1109/cicc.2003.1249455","title":"Silicon-on-organic integration of a 2.4GHz VCO using high Q copper inductors and solder-bumped flip chip technology","display_name":"Silicon-on-organic integration of a 2.4GHz VCO using high Q copper inductors and solder-bumped flip chip technology","publication_year":2004,"publication_date":"2004-02-03","ids":{"openalex":"https://openalex.org/W1540266922","doi":"https://doi.org/10.1109/cicc.2003.1249455","mag":"1540266922"},"language":"en","primary_location":{"id":"doi:10.1109/cicc.2003.1249455","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2003.1249455","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE 2003 Custom Integrated Circuits Conference, 2003.","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"X. Huo","orcid":null},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"X. Huo","raw_affiliation_strings":["Department of Electrical and Electronic Engineering, Hong Kong University of Science and Technology, Hong Kong, China","Dept. of Electr. & Electron. Eng. Hong Kong Univ. of Sci. & Technol., China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Electronic Engineering, Hong Kong University of Science and Technology, Hong Kong, China","institution_ids":["https://openalex.org/I200769079"]},{"raw_affiliation_string":"Dept. of Electr. & Electron. Eng. Hong Kong Univ. of Sci. & Technol., China","institution_ids":["https://openalex.org/I200769079"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073334986","display_name":"Guowei Xiao","orcid":"https://orcid.org/0000-0001-8956-482X"},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Guo-Wei Xiao","raw_affiliation_strings":["Department of Electrical and Electronic Engineering, Hong Kong University of Science and Technology, Hong Kong, China","Dept. of Electr. & Electron. Eng. Hong Kong Univ. of Sci. & Technol., China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Electronic Engineering, Hong Kong University of Science and Technology, Hong Kong, China","institution_ids":["https://openalex.org/I200769079"]},{"raw_affiliation_string":"Dept. of Electr. & Electron. Eng. Hong Kong Univ. of Sci. & Technol., China","institution_ids":["https://openalex.org/I200769079"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085053354","display_name":"Kevin J. Chen","orcid":"https://orcid.org/0000-0002-0659-2022"},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"K.J. Chen","raw_affiliation_strings":["Department of Electrical and Electronic Engineering, Hong Kong University of Science and Technology, Hong Kong, China","Dept. of Electr. & Electron. Eng. Hong Kong Univ. of Sci. & Technol., China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Electronic Engineering, Hong Kong University of Science and Technology, Hong Kong, China","institution_ids":["https://openalex.org/I200769079"]},{"raw_affiliation_string":"Dept. of Electr. & Electron. Eng. Hong Kong Univ. of Sci. & Technol., China","institution_ids":["https://openalex.org/I200769079"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5103556635","display_name":"P.C.H. Chan","orcid":null},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"P.C.H. Chan","raw_affiliation_strings":["Department of Electrical and Electronic Engineering, Hong Kong University of Science and Technology, Hong Kong, China","Dept. of Electr. & Electron. Eng. Hong Kong Univ. of Sci. & Technol., China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Electronic Engineering, Hong Kong University of Science and Technology, Hong Kong, China","institution_ids":["https://openalex.org/I200769079"]},{"raw_affiliation_string":"Dept. of Electr. & Electron. Eng. Hong Kong Univ. of Sci. & Technol., China","institution_ids":["https://openalex.org/I200769079"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I200769079"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":"42","issue":null,"first_page":"537","last_page":"540"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/inductor","display_name":"Inductor","score":0.8811773061752319},{"id":"https://openalex.org/keywords/dbc","display_name":"dBc","score":0.821873664855957},{"id":"https://openalex.org/keywords/flip-chip","display_name":"Flip chip","score":0.789204478263855},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7732853889465332},{"id":"https://openalex.org/keywords/voltage-controlled-oscillator","display_name":"Voltage-controlled oscillator","score":0.6856440305709839},{"id":"https://openalex.org/keywords/q-factor","display_name":"Q factor","score":0.6158798336982727},{"id":"https://openalex.org/keywords/phase-noise","display_name":"Phase noise","score":0.6120983958244324},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5582780838012695},{"id":"https://openalex.org/keywords/electroplating","display_name":"Electroplating","score":0.5118374228477478},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.4761386215686798},{"id":"https://openalex.org/keywords/copper","display_name":"Copper","score":0.44278591871261597},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.4200751483440399},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.38455840945243835},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.12744855880737305},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.11542651057243347},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.1127103865146637},{"id":"https://openalex.org/keywords/resonator","display_name":"Resonator","score":0.09724435210227966},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.06670406460762024}],"concepts":[{"id":"https://openalex.org/C144534570","wikidata":"https://www.wikidata.org/wiki/Q5325","display_name":"Inductor","level":3,"score":0.8811773061752319},{"id":"https://openalex.org/C193523891","wikidata":"https://www.wikidata.org/wiki/Q1771950","display_name":"dBc","level":3,"score":0.821873664855957},{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.789204478263855},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7732853889465332},{"id":"https://openalex.org/C5291336","wikidata":"https://www.wikidata.org/wiki/Q852341","display_name":"Voltage-controlled oscillator","level":3,"score":0.6856440305709839},{"id":"https://openalex.org/C187725362","wikidata":"https://www.wikidata.org/wiki/Q830521","display_name":"Q factor","level":3,"score":0.6158798336982727},{"id":"https://openalex.org/C89631360","wikidata":"https://www.wikidata.org/wiki/Q1428766","display_name":"Phase noise","level":2,"score":0.6120983958244324},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5582780838012695},{"id":"https://openalex.org/C51807945","wikidata":"https://www.wikidata.org/wiki/Q3503392","display_name":"Electroplating","level":3,"score":0.5118374228477478},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.4761386215686798},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.44278591871261597},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.4200751483440399},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.38455840945243835},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.12744855880737305},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.11542651057243347},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.1127103865146637},{"id":"https://openalex.org/C97126364","wikidata":"https://www.wikidata.org/wiki/Q349669","display_name":"Resonator","level":2,"score":0.09724435210227966},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.06670406460762024},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/cicc.2003.1249455","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2003.1249455","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE 2003 Custom Integrated Circuits Conference, 2003.","raw_type":"proceedings-article"},{"id":"pmh:oai:repository.hkust.edu.hk:1783.1-37462","is_oa":false,"landing_page_url":"http://repository.hkust.edu.hk/ir/Record/1783.1-37462","pdf_url":null,"source":{"id":"https://openalex.org/S4306401796","display_name":"Rare & Special e-Zone (The Hong Kong University of Science and Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I200769079","host_organization_name":"Hong Kong University of Science and Technology","host_organization_lineage":["https://openalex.org/I200769079"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"Conference paper"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.6600000262260437,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320323537","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":22,"referenced_works":["https://openalex.org/W1512139919","https://openalex.org/W1873369789","https://openalex.org/W1963808541","https://openalex.org/W2011960389","https://openalex.org/W2082211203","https://openalex.org/W2098180314","https://openalex.org/W2102500205","https://openalex.org/W2109832933","https://openalex.org/W2110332835","https://openalex.org/W2116460217","https://openalex.org/W2117325391","https://openalex.org/W2120358100","https://openalex.org/W2125377543","https://openalex.org/W2139260039","https://openalex.org/W2144546776","https://openalex.org/W2158883764","https://openalex.org/W2160329059","https://openalex.org/W2160428624","https://openalex.org/W2167004581","https://openalex.org/W2494593326","https://openalex.org/W2788994432","https://openalex.org/W6683425246"],"related_works":["https://openalex.org/W2141726610","https://openalex.org/W2061664740","https://openalex.org/W2540766993","https://openalex.org/W2619153394","https://openalex.org/W2911266525","https://openalex.org/W4242529045","https://openalex.org/W2086169776","https://openalex.org/W2081457870","https://openalex.org/W2100673396","https://openalex.org/W1970939492"],"abstract_inverted_index":{"High":[0],"Q":[1,28],"copper":[2,64],"inductors":[3,29,51,65],"were":[4,38],"fabricated":[5],"on":[6,45,66],"low-cost":[7],"and":[8,11,35,47,68],"low-loss":[9],"BT":[10,46,67],"glass":[12,48,69],"substrates":[13,70],"using":[14,25],"an":[15],"electroplating":[16],"process.":[17],"A":[18],"differential":[19],"LC":[20],"VCO":[21],"circuit":[22],"was":[23],"designed":[24],"these":[26],"high":[27,56],"at":[30,59,78],"2.4":[31,60,84],"GHz.":[32,61],"Flip":[33],"chip":[34],"MCM":[36],"technology":[37],"applied":[39],"to":[40],"assemble":[41],"the":[42,95],"active":[43],"chips":[44],"substrates.":[49],"The":[50],"exhibited":[52],"a":[53,72,83,89],"Q-factor":[54],"as":[55,57],"30":[58],"VCOs":[62],"with":[63,94,97],"had":[71],"phase":[73],"noise":[74],"of":[75],"-108":[76],"dBc/Hz":[77],"600":[79],"kHz":[80],"offset":[81],"for":[82],"GHz":[85],"carrier,":[86],"which":[87],"is":[88],"6":[90],"dB":[91],"improvement":[92],"compared":[93],"one":[96],"on-chip":[98],"Al":[99],"inductors.":[100]},"counts_by_year":[{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}