{"id":"https://openalex.org/W2122107503","doi":"https://doi.org/10.1109/cicc.2002.1012885","title":"Sea of leads (SoL) characterization and design for compatibility with board-level optical waveguide interconnection","display_name":"Sea of leads (SoL) characterization and design for compatibility with board-level optical waveguide interconnection","publication_year":2003,"publication_date":"2003-06-25","ids":{"openalex":"https://openalex.org/W2122107503","doi":"https://doi.org/10.1109/cicc.2002.1012885","mag":"2122107503"},"language":"en","primary_location":{"id":"doi:10.1109/cicc.2002.1012885","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2002.1012885","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE 2002 Custom Integrated Circuits Conference (Cat. No.02CH37285)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5044507102","display_name":"Muhannad S. Bakir","orcid":"https://orcid.org/0000-0002-0380-0842"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M.S. Bakir","raw_affiliation_strings":["School of Electrical and Computer Engineering","School of Electrical and Computer Engineering, Microelectronics Research Center, Georgia Institute of Technology, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering","institution_ids":[]},{"raw_affiliation_string":"School of Electrical and Computer Engineering, Microelectronics Research Center, Georgia Institute of Technology, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063287064","display_name":"H.A. Reed","orcid":null},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"H.A. Reed","raw_affiliation_strings":["School of Chemical Engineering Microelectronics Research Center, Georgia Institute of Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Chemical Engineering Microelectronics Research Center, Georgia Institute of Technology","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109886575","display_name":"A.V. Mule","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"A.V. Mule","raw_affiliation_strings":["School of Electrical and Computer Engineering"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051789763","display_name":"Paul A. Kohl","orcid":"https://orcid.org/0000-0001-6267-3647"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"P.A. Kohl","raw_affiliation_strings":["School of Chemical Engineering Microelectronics Research Center, Georgia Institute of Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Chemical Engineering Microelectronics Research Center, Georgia Institute of Technology","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021569915","display_name":"K. P. Martin","orcid":"https://orcid.org/0000-0002-6980-4125"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"K.P. Martin","raw_affiliation_strings":["School of Electrical and Computer Engineering","School of Electrical and Computer Engineering, Microelectronics Research Center, Georgia Institute of Technology, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering","institution_ids":[]},{"raw_affiliation_string":"School of Electrical and Computer Engineering, Microelectronics Research Center, Georgia Institute of Technology, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5041468877","display_name":"J.D. Meindl","orcid":null},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J.D. Meindl","raw_affiliation_strings":["School of Electrical and Computer Engineering","School of Electrical and Computer Engineering, Microelectronics Research Center, Georgia Institute of Technology, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering","institution_ids":[]},{"raw_affiliation_string":"School of Electrical and Computer Engineering, Microelectronics Research Center, Georgia Institute of Technology, USA","institution_ids":["https://openalex.org/I130701444"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.3543,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.65173435,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"39","issue":null,"first_page":"491","last_page":"494"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10299","display_name":"Photonic and Optical Devices","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6502254605293274},{"id":"https://openalex.org/keywords/insertion-loss","display_name":"Insertion loss","score":0.6288838386535645},{"id":"https://openalex.org/keywords/parasitic-extraction","display_name":"Parasitic extraction","score":0.5989677906036377},{"id":"https://openalex.org/keywords/compatibility","display_name":"Compatibility (geochemistry)","score":0.51259845495224},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5057122707366943},{"id":"https://openalex.org/keywords/wafer-level-packaging","display_name":"Wafer-level packaging","score":0.48874974250793457},{"id":"https://openalex.org/keywords/signal-integrity","display_name":"Signal integrity","score":0.4867253601551056},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4836793839931488},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.47557273507118225},{"id":"https://openalex.org/keywords/electronic-packaging","display_name":"Electronic packaging","score":0.4629451036453247},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.44906866550445557},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4053765535354614},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3142675757408142},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2996382713317871},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2647240459918976},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.17148500680923462}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6502254605293274},{"id":"https://openalex.org/C90327742","wikidata":"https://www.wikidata.org/wiki/Q947396","display_name":"Insertion loss","level":2,"score":0.6288838386535645},{"id":"https://openalex.org/C159818811","wikidata":"https://www.wikidata.org/wiki/Q7135947","display_name":"Parasitic extraction","level":2,"score":0.5989677906036377},{"id":"https://openalex.org/C2778648169","wikidata":"https://www.wikidata.org/wiki/Q967768","display_name":"Compatibility (geochemistry)","level":2,"score":0.51259845495224},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5057122707366943},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.48874974250793457},{"id":"https://openalex.org/C44938667","wikidata":"https://www.wikidata.org/wiki/Q4503810","display_name":"Signal integrity","level":3,"score":0.4867253601551056},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4836793839931488},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.47557273507118225},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.4629451036453247},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.44906866550445557},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4053765535354614},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3142675757408142},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2996382713317871},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2647240459918976},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.17148500680923462},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/cicc.2002.1012885","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2002.1012885","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE 2002 Custom Integrated Circuits Conference (Cat. No.02CH37285)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/14","display_name":"Life below water","score":0.8500000238418579}],"awards":[],"funders":[{"id":"https://openalex.org/F4320309321","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44"},{"id":"https://openalex.org/F4320332180","display_name":"Defense Advanced Research Projects Agency","ror":"https://ror.org/02caytj08"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W1604992389","https://openalex.org/W1997472774","https://openalex.org/W2049273813","https://openalex.org/W2101998766","https://openalex.org/W2487482518","https://openalex.org/W4285719527","https://openalex.org/W6722900247"],"related_works":["https://openalex.org/W2056605939","https://openalex.org/W2019635822","https://openalex.org/W1970480028","https://openalex.org/W2287031256","https://openalex.org/W1877066771","https://openalex.org/W2022259386","https://openalex.org/W2521942680","https://openalex.org/W2011986249","https://openalex.org/W1969921064","https://openalex.org/W2811251486"],"abstract_inverted_index":{"Sea":[0],"of":[1,27,42,55,61],"leads":[2,17,38,71],"(SoL)":[3],"is":[4,64],"a":[5],"novel":[6],"ultra-high-density":[7],"compliant":[8,14,70],"wafer-level":[9,24],"packaging":[10],"technology.":[11,91],"The":[12],"x-y-z":[13],"input/output":[15],"(I/O)":[16],"are":[18,72,77,86,106],"batch":[19,25],"fabricated":[20],"by":[21],"simply":[22],"extending":[23],"fabrication":[26],"on-chip":[28],"multilevel":[29],"interconnect":[30,90],"networks.":[31],"Two-port":[32],"microwave":[33],"measurements":[34],"reveal":[35],"that":[36,85],"the":[37,47,62,69],"exhibit":[39],"an":[40],"insertion-loss":[41,54],"less":[43],"than":[44],"0.4dB":[45],"in":[46],"0.1-45GHz":[48],"frequency":[49],"range.":[50],"In":[51],"addition,":[52],"worst-case":[53],"signal":[56,102],"propagation":[57],"into":[58],"and":[59],"out":[60],"package":[63],"1.15dB":[65],"at":[66],"45GHz.":[67],"Because":[68],"short,":[73],"their":[74],"electrical":[75],"parasitics":[76],"minimal.":[78],"A":[79],"mixed-signal":[80],"system-on-a-chip":[81],"(SoC)":[82],"requires":[83],"packages":[84],"compatible":[87],"with":[88,99],"optical":[89,101],"Physical":[92],"design":[93,97],"rules":[94],"describing":[95],"SoL":[96],"compatibility":[98],"board-level":[100],"distribution":[103],"via":[104],"waveguides":[105],"derived.":[107]},"counts_by_year":[],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}