{"id":"https://openalex.org/W2113408037","doi":"https://doi.org/10.1109/cicc.2002.1012823","title":"Design integration, DFT, and verification methodology for an MPEG 1/2 audio layer 3 (MP3) SoC device","display_name":"Design integration, DFT, and verification methodology for an MPEG 1/2 audio layer 3 (MP3) SoC device","publication_year":2003,"publication_date":"2003-06-25","ids":{"openalex":"https://openalex.org/W2113408037","doi":"https://doi.org/10.1109/cicc.2002.1012823","mag":"2113408037"},"language":"en","primary_location":{"id":"doi:10.1109/cicc.2002.1012823","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2002.1012823","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE 2002 Custom Integrated Circuits Conference (Cat. No.02CH37285)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5013973622","display_name":"B. Birkl","orcid":null},"institutions":[{"id":"https://openalex.org/I1333370159","display_name":"Motorola (United States)","ror":"https://ror.org/01hafxd32","country_code":"US","type":"company","lineage":["https://openalex.org/I1333370159"]},{"id":"https://openalex.org/I4210138973","display_name":"Motorola (Germany)","ror":"https://ror.org/045193y93","country_code":"DE","type":"company","lineage":["https://openalex.org/I1333370159","https://openalex.org/I4210138973"]}],"countries":["DE","US"],"is_corresponding":false,"raw_author_name":"B. Birkl","raw_affiliation_strings":["Broadband and Entertainment Solutions Division, Semiconductor Products Sector, Motorola Munich, Germany","Semicond. Products Sector, Motorola, Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Broadband and Entertainment Solutions Division, Semiconductor Products Sector, Motorola Munich, Germany","institution_ids":["https://openalex.org/I1333370159"]},{"raw_affiliation_string":"Semicond. Products Sector, Motorola, Munich, Germany","institution_ids":["https://openalex.org/I4210138973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088889798","display_name":"B. Hooser","orcid":null},"institutions":[{"id":"https://openalex.org/I1333370159","display_name":"Motorola (United States)","ror":"https://ror.org/01hafxd32","country_code":"US","type":"company","lineage":["https://openalex.org/I1333370159"]},{"id":"https://openalex.org/I4210138973","display_name":"Motorola (Germany)","ror":"https://ror.org/045193y93","country_code":"DE","type":"company","lineage":["https://openalex.org/I1333370159","https://openalex.org/I4210138973"]}],"countries":["DE","US"],"is_corresponding":false,"raw_author_name":"B. Hooser","raw_affiliation_strings":["Broadband and Entertainment Solutions Division, Semiconductor Products Sector, Motorola Munich, Germany","Semicond. Products Sector, Motorola, Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Broadband and Entertainment Solutions Division, Semiconductor Products Sector, Motorola Munich, Germany","institution_ids":["https://openalex.org/I1333370159"]},{"raw_affiliation_string":"Semicond. Products Sector, Motorola, Munich, Germany","institution_ids":["https://openalex.org/I4210138973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039967293","display_name":"M. Janssens","orcid":null},"institutions":[{"id":"https://openalex.org/I1333370159","display_name":"Motorola (United States)","ror":"https://ror.org/01hafxd32","country_code":"US","type":"company","lineage":["https://openalex.org/I1333370159"]},{"id":"https://openalex.org/I4210138973","display_name":"Motorola (Germany)","ror":"https://ror.org/045193y93","country_code":"DE","type":"company","lineage":["https://openalex.org/I1333370159","https://openalex.org/I4210138973"]}],"countries":["DE","US"],"is_corresponding":false,"raw_author_name":"M. Janssens","raw_affiliation_strings":["Broadband and Entertainment Solutions Division, Semiconductor Products Sector, Motorola Munich, Germany","Semicond. Products Sector, Motorola, Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Broadband and Entertainment Solutions Division, Semiconductor Products Sector, Motorola Munich, Germany","institution_ids":["https://openalex.org/I1333370159"]},{"raw_affiliation_string":"Semicond. Products Sector, Motorola, Munich, Germany","institution_ids":["https://openalex.org/I4210138973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5056063990","display_name":"F. Lenke","orcid":null},"institutions":[{"id":"https://openalex.org/I1333370159","display_name":"Motorola (United States)","ror":"https://ror.org/01hafxd32","country_code":"US","type":"company","lineage":["https://openalex.org/I1333370159"]},{"id":"https://openalex.org/I4210138973","display_name":"Motorola (Germany)","ror":"https://ror.org/045193y93","country_code":"DE","type":"company","lineage":["https://openalex.org/I1333370159","https://openalex.org/I4210138973"]}],"countries":["DE","US"],"is_corresponding":false,"raw_author_name":"F. Lenke","raw_affiliation_strings":["Broadband and Entertainment Solutions Division, Semiconductor Products Sector, Motorola Munich, Germany","Semicond. Products Sector, Motorola, Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Broadband and Entertainment Solutions Division, Semiconductor Products Sector, Motorola Munich, Germany","institution_ids":["https://openalex.org/I1333370159"]},{"raw_affiliation_string":"Semicond. Products Sector, Motorola, Munich, Germany","institution_ids":["https://openalex.org/I4210138973"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5075028078","display_name":"Ji\u0159\u00ed Vo\u0159\u00ed\u0161ek","orcid":"https://orcid.org/0000-0001-9307-2756"},"institutions":[{"id":"https://openalex.org/I1333370159","display_name":"Motorola (United States)","ror":"https://ror.org/01hafxd32","country_code":"US","type":"company","lineage":["https://openalex.org/I1333370159"]},{"id":"https://openalex.org/I4210138973","display_name":"Motorola (Germany)","ror":"https://ror.org/045193y93","country_code":"DE","type":"company","lineage":["https://openalex.org/I1333370159","https://openalex.org/I4210138973"]}],"countries":["DE","US"],"is_corresponding":false,"raw_author_name":"V. Vorisek","raw_affiliation_strings":["Broadband and Entertainment Solutions Division, Semiconductor Products Sector, Motorola Munich, Germany","Semicond. Products Sector, Motorola, Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Broadband and Entertainment Solutions Division, Semiconductor Products Sector, Motorola Munich, Germany","institution_ids":["https://openalex.org/I1333370159"]},{"raw_affiliation_string":"Semicond. Products Sector, Motorola, Munich, Germany","institution_ids":["https://openalex.org/I4210138973"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.4308,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.60465566,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"303","last_page":"306"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11417","display_name":"Advancements in PLL and VCO Technologies","score":0.9889000058174133,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11417","display_name":"Advancements in PLL and VCO Technologies","score":0.9889000058174133,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9886000156402588,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10741","display_name":"Video Coding and Compression Technologies","score":0.9869999885559082,"subfield":{"id":"https://openalex.org/subfields/1711","display_name":"Signal Processing"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.7067927718162537},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.6252999901771545},{"id":"https://openalex.org/keywords/mpeg-4","display_name":"MPEG-4","score":0.48918774724006653},{"id":"https://openalex.org/keywords/audio-signal-processing","display_name":"Audio signal processing","score":0.45902639627456665},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.4307381808757782},{"id":"https://openalex.org/keywords/audio-signal","display_name":"Audio signal","score":0.2921845018863678},{"id":"https://openalex.org/keywords/speech-coding","display_name":"Speech coding","score":0.27483201026916504},{"id":"https://openalex.org/keywords/speech-recognition","display_name":"Speech recognition","score":0.2619320750236511},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.09238198399543762}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7067927718162537},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.6252999901771545},{"id":"https://openalex.org/C97501218","wikidata":"https://www.wikidata.org/wiki/Q219763","display_name":"MPEG-4","level":3,"score":0.48918774724006653},{"id":"https://openalex.org/C127220857","wikidata":"https://www.wikidata.org/wiki/Q2719318","display_name":"Audio signal processing","level":4,"score":0.45902639627456665},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.4307381808757782},{"id":"https://openalex.org/C64922751","wikidata":"https://www.wikidata.org/wiki/Q4650799","display_name":"Audio signal","level":3,"score":0.2921845018863678},{"id":"https://openalex.org/C13895895","wikidata":"https://www.wikidata.org/wiki/Q3270773","display_name":"Speech coding","level":2,"score":0.27483201026916504},{"id":"https://openalex.org/C28490314","wikidata":"https://www.wikidata.org/wiki/Q189436","display_name":"Speech recognition","level":1,"score":0.2619320750236511},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.09238198399543762},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C179518139","wikidata":"https://www.wikidata.org/wiki/Q5140297","display_name":"Coding (social sciences)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/cicc.2002.1012823","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2002.1012823","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE 2002 Custom Integrated Circuits Conference (Cat. No.02CH37285)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.5299999713897705}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W603405442","https://openalex.org/W2163533049","https://openalex.org/W2936804578"],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W2358668433","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W2382290278","https://openalex.org/W2478288626","https://openalex.org/W4391913857","https://openalex.org/W2350741829","https://openalex.org/W2530322880"],"abstract_inverted_index":{"This":[0],"paper":[1],"describes":[2],"the":[3,31],"SoC":[4],"design":[5,38],"and":[6,37,47,68],"integration":[7,55],"methodology":[8,33],"of":[9,30,52,78,95,102,114],"a":[10,20,53,64,98,111],"MPEG1/2":[11],"Audio":[12],"Layer":[13],"3":[14],"(MP3)":[15],"decoder":[16],"chip.":[17],"Due":[18],"to":[19,27,44,74],"very":[21],"tight":[22],"development":[23],"cycle":[24,77],"we":[25],"decided":[26],"use":[28],"state":[29],"art":[32],"for":[34,39],"integration,":[35],"verification,":[36],"test":[40],"(DFT)":[41],"in":[42,86],"order":[43],"minimize":[45],"risk":[46],"problem":[48],"areas.":[49],"The":[50,82,106],"combination":[51],"top-down":[54],"flow,":[56],"strong":[57],"focus":[58],"on":[59],"constraint":[60],"driven":[61],"timing":[62],"analysis,":[63],"modular":[65],"simulation":[66],"environment,":[67],"leading":[69],"edge":[70],"DFT":[71],"solutions":[72],"led":[73],"an":[75,87],"implementation":[76],"only":[79],"8":[80],"weeks.":[81],"chip":[83],"is":[84],"realized":[85],"0.18":[88],"/spl":[89],"mu/m":[90],"technology":[91],"using":[92],"5":[93],"layers":[94],"metal,":[96],"achieving":[97],"final":[99],"die":[100],"size":[101],"16":[103],"mm/sup":[104],"2/.":[105],"central":[107],"processor":[108],"runs":[109],"at":[110],"minimal":[112],"speed":[113],"140":[115],"MHz.":[116]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2022,"cited_by_count":1}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}