{"id":"https://openalex.org/W2134737856","doi":"https://doi.org/10.1109/cicc.2002.1012783","title":"4 Gbps high-density AC coupled interconnection","display_name":"4 Gbps high-density AC coupled interconnection","publication_year":2003,"publication_date":"2003-06-25","ids":{"openalex":"https://openalex.org/W2134737856","doi":"https://doi.org/10.1109/cicc.2002.1012783","mag":"2134737856"},"language":"en","primary_location":{"id":"doi:10.1109/cicc.2002.1012783","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2002.1012783","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE 2002 Custom Integrated Circuits Conference (Cat. No.02CH37285)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113703706","display_name":"Stephen Mick","orcid":null},"institutions":[{"id":"https://openalex.org/I137902535","display_name":"North Carolina State University","ror":"https://ror.org/04tj63d06","country_code":"US","type":"education","lineage":["https://openalex.org/I137902535"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. Mick","raw_affiliation_strings":["Dept. of Electr. & Comput. Eng, North Carolina State Univ., Raleigh, NC, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dept. of Electr. & Comput. Eng, North Carolina State Univ., Raleigh, NC, USA","institution_ids":["https://openalex.org/I137902535"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078387936","display_name":"John Wilson","orcid":"https://orcid.org/0000-0001-8488-3020"},"institutions":[{"id":"https://openalex.org/I137902535","display_name":"North Carolina State University","ror":"https://ror.org/04tj63d06","country_code":"US","type":"education","lineage":["https://openalex.org/I137902535"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. Wilson","raw_affiliation_strings":["Dept. of Electr. & Comput. Eng, North Carolina State Univ., Raleigh, NC, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dept. of Electr. & Comput. Eng, North Carolina State Univ., Raleigh, NC, USA","institution_ids":["https://openalex.org/I137902535"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5074605796","display_name":"Paul D. Franzon","orcid":"https://orcid.org/0000-0002-6048-5770"},"institutions":[{"id":"https://openalex.org/I137902535","display_name":"North Carolina State University","ror":"https://ror.org/04tj63d06","country_code":"US","type":"education","lineage":["https://openalex.org/I137902535"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"P. Franzon","raw_affiliation_strings":["Dept. of Electr. & Comput. Eng, North Carolina State Univ., Raleigh, NC, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dept. of Electr. & Comput. Eng, North Carolina State Univ., Raleigh, NC, USA","institution_ids":["https://openalex.org/I137902535"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I137902535"],"apc_list":null,"apc_paid":null,"fwci":15.9271,"has_fulltext":false,"cited_by_count":82,"citation_normalized_percentile":{"value":0.99543644,"is_in_top_1_percent":true,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"133","last_page":"140"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11417","display_name":"Advancements in PLL and VCO Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/capacitive-coupling","display_name":"Capacitive coupling","score":0.7847797870635986},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7067959308624268},{"id":"https://openalex.org/keywords/capacitor","display_name":"Capacitor","score":0.6591330766677856},{"id":"https://openalex.org/keywords/coupling","display_name":"Coupling (piping)","score":0.6235488057136536},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.5918110013008118},{"id":"https://openalex.org/keywords/capacitive-sensing","display_name":"Capacitive sensing","score":0.5885478258132935},{"id":"https://openalex.org/keywords/electrical-impedance","display_name":"Electrical impedance","score":0.5407465100288391},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4958513677120209},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.49575933814048767},{"id":"https://openalex.org/keywords/direct-coupling","display_name":"Direct coupling","score":0.4295714497566223},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.36955103278160095},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.34352946281433105},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.31127822399139404},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.19523239135742188},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.1777399182319641},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.1678159534931183}],"concepts":[{"id":"https://openalex.org/C68278764","wikidata":"https://www.wikidata.org/wiki/Q444167","display_name":"Capacitive coupling","level":3,"score":0.7847797870635986},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7067959308624268},{"id":"https://openalex.org/C52192207","wikidata":"https://www.wikidata.org/wiki/Q5322","display_name":"Capacitor","level":3,"score":0.6591330766677856},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.6235488057136536},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.5918110013008118},{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.5885478258132935},{"id":"https://openalex.org/C17829176","wikidata":"https://www.wikidata.org/wiki/Q179043","display_name":"Electrical impedance","level":2,"score":0.5407465100288391},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4958513677120209},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.49575933814048767},{"id":"https://openalex.org/C165738657","wikidata":"https://www.wikidata.org/wiki/Q3000860","display_name":"Direct coupling","level":2,"score":0.4295714497566223},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.36955103278160095},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.34352946281433105},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.31127822399139404},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.19523239135742188},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.1777399182319641},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.1678159534931183},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/cicc.2002.1012783","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2002.1012783","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE 2002 Custom Integrated Circuits Conference (Cat. No.02CH37285)","raw_type":"proceedings-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.875.5904","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.875.5904","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www.ece.ncsu.edu/erl/faculty/paul_data/Mar02/Documents/CICC_May2002.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.8899999856948853,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1554123512","https://openalex.org/W1603934303","https://openalex.org/W1964359743","https://openalex.org/W2108030033","https://openalex.org/W2127206901","https://openalex.org/W2131738061","https://openalex.org/W2137398654","https://openalex.org/W2187914719","https://openalex.org/W2305372179","https://openalex.org/W2565378567","https://openalex.org/W6698168488"],"related_works":["https://openalex.org/W2291633415","https://openalex.org/W2768092448","https://openalex.org/W2044770004","https://openalex.org/W1966070768","https://openalex.org/W1994341348","https://openalex.org/W1629988628","https://openalex.org/W2953512238","https://openalex.org/W2288895023","https://openalex.org/W2895758062","https://openalex.org/W2048683560"],"abstract_inverted_index":{"AC":[0,20,34,72,116],"coupled":[1,155],"interconnects":[2],"enable":[3],"multi-gigabit-per-second":[4],"communication":[5],"data":[6],"rates":[7],"between":[8],"integrated":[9],"circuits":[10],"with":[11,25,122],"very":[12],"high":[13],"pin":[14],"counts":[15],"and":[16,46,85,107,125,141],"low":[17,40],"power":[18,41,106],"consumption.":[19],"coupling":[21,31,35,55,73],"can":[22,74,132],"be":[23,75,133],"realized":[24],"either":[26],"series":[27],"capacitive":[28],"or":[29],"inductive":[30,71],"elements.":[32],"Capacitive":[33],"offers":[36],"better":[37],"performance":[38],"when":[39,47],"I/O":[42,79],"buffers":[43],"are":[44,98,149],"required":[45],"there":[48],"is":[49],"sufficient":[50],"area":[51],"to":[52,54,77,83],"dedicate":[53],"capacitors":[56],"in":[57,120],"the":[58,111,115],"top-level":[59],"metal":[60],"of":[61,68,144],"each":[62],"IC.":[63],"At":[64],"a":[65,87,101],"slight":[66],"expense":[67],"circuit":[69,142],"complexity,":[70],"used":[76,99,119],"bring":[78],"pad":[80],"pitches":[81],"down":[82],"75\u00b5m":[84],"maintain":[86],"controlled":[88],"impedance":[89],"connection.":[90],"A":[91],"novel":[92],"physical":[93,140],"structure,":[94],"buried":[95],"solder":[96],"bumps,":[97],"as":[100,114,137],"solution":[102],"for":[103],"providing":[104],"DC":[105],"ground":[108],"connections":[109],"across":[110],"same":[112],"surface":[113],"connections.":[117],"When":[118],"conjunction":[121],"NRZ-tolerate":[123],"receivers,":[124],"current-mode":[126],"signaling,":[127],"highly":[128],"effective":[129],"interconnect":[130],"structures":[131],"built.":[134],"As":[135],"well":[136],"presenting":[138],"both":[139],"aspects":[143],"this":[145],"work,":[146],"experimental":[147],"results":[148],"shown.":[150],"Figure":[151],"1":[152],"Basic":[153],"capacitively":[154],"interconnection":[156]},"counts_by_year":[{"year":2022,"cited_by_count":2},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":2},{"year":2015,"cited_by_count":3},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":3},{"year":2012,"cited_by_count":2}],"updated_date":"2026-08-26T07:47:46.906454","created_date":"2025-10-10T00:00:00"}