{"id":"https://openalex.org/W1591600398","doi":"https://doi.org/10.1109/cdc.2003.1271963","title":"Neural network based uniformity profile control of linear chemical-mechanical planarization","display_name":"Neural network based uniformity profile control of linear chemical-mechanical planarization","publication_year":2003,"publication_date":"2003-01-01","ids":{"openalex":"https://openalex.org/W1591600398","doi":"https://doi.org/10.1109/cdc.2003.1271963","mag":"1591600398"},"language":"en","primary_location":{"id":"doi:10.1109/cdc.2003.1271963","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cdc.2003.1271963","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"42nd IEEE International Conference on Decision and Control (IEEE Cat. No.03CH37475)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5090869394","display_name":"Jingang Yi","orcid":"https://orcid.org/0000-0003-0628-9098"},"institutions":[{"id":"https://openalex.org/I167593883","display_name":"Lam Research (Austria)","ror":"https://ror.org/05d2rrs40","country_code":"AT","type":"company","lineage":["https://openalex.org/I167593883","https://openalex.org/I4210139090"]}],"countries":["AT"],"is_corresponding":false,"raw_author_name":"Jingang Yi","raw_affiliation_strings":["CMP/Div. of Cleaning Technol., Lam Res. Corp., Fremont, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CMP/Div. of Cleaning Technol., Lam Res. Corp., Fremont, CA, USA","institution_ids":["https://openalex.org/I167593883"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103653261","display_name":"Ye Sheng","orcid":null},"institutions":[{"id":"https://openalex.org/I95457486","display_name":"University of California, Berkeley","ror":"https://ror.org/01an7q238","country_code":"US","type":"education","lineage":["https://openalex.org/I95457486"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ye Sheng","raw_affiliation_strings":["Department of Mechanical Engineering, University of California, Berkeley, CA, USA","University of California at Berkeley"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, University of California, Berkeley, CA, USA","institution_ids":["https://openalex.org/I95457486"]},{"raw_affiliation_string":"University of California at Berkeley","institution_ids":["https://openalex.org/I95457486"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5022636178","display_name":"Changsheng Xu","orcid":"https://orcid.org/0000-0001-8343-9665"},"institutions":[{"id":"https://openalex.org/I167593883","display_name":"Lam Research (Austria)","ror":"https://ror.org/05d2rrs40","country_code":"AT","type":"company","lineage":["https://openalex.org/I167593883","https://openalex.org/I4210139090"]},{"id":"https://openalex.org/I4210139090","display_name":"Lam Research (United States)","ror":"https://ror.org/04gecbm52","country_code":"US","type":"company","lineage":["https://openalex.org/I4210139090"]}],"countries":["AT","US"],"is_corresponding":false,"raw_author_name":"C.S. Xu","raw_affiliation_strings":["CMP/Cleaning Technology Division, Lam Research, Corporation, Fremont, CA, USA","Lam Res Corp"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CMP/Cleaning Technology Division, Lam Research, Corporation, Fremont, CA, USA","institution_ids":["https://openalex.org/I4210139090"]},{"raw_affiliation_string":"Lam Res Corp","institution_ids":["https://openalex.org/I167593883"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.06461722,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"5955","last_page":"5960 Vol.6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11583","display_name":"Advanced Measurement and Metrology Techniques","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10188","display_name":"Advanced machining processes and optimization","score":0.9975000023841858,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/chemical-mechanical-planarization","display_name":"Chemical-mechanical planarization","score":0.9603706002235413},{"id":"https://openalex.org/keywords/artificial-neural-network","display_name":"Artificial neural network","score":0.726528525352478},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6394113302230835},{"id":"https://openalex.org/keywords/feed-forward","display_name":"Feed forward","score":0.5429030656814575},{"id":"https://openalex.org/keywords/process-control","display_name":"Process control","score":0.5257914066314697},{"id":"https://openalex.org/keywords/controller","display_name":"Controller (irrigation)","score":0.5096697807312012},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4829482436180115},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.45703378319740295},{"id":"https://openalex.org/keywords/feedforward-neural-network","display_name":"Feedforward neural network","score":0.454983651638031},{"id":"https://openalex.org/keywords/flexibility","display_name":"Flexibility (engineering)","score":0.4213179051876068},{"id":"https://openalex.org/keywords/control-theory","display_name":"Control theory (sociology)","score":0.42007678747177124},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3625949025154114},{"id":"https://openalex.org/keywords/control-engineering","display_name":"Control engineering","score":0.3552210032939911},{"id":"https://openalex.org/keywords/polishing","display_name":"Polishing","score":0.2399466335773468},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.23766818642616272},{"id":"https://openalex.org/keywords/control","display_name":"Control (management)","score":0.2278057038784027},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.20031189918518066},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.18853601813316345},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.12727895379066467},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.11089301109313965}],"concepts":[{"id":"https://openalex.org/C180088628","wikidata":"https://www.wikidata.org/wiki/Q1069404","display_name":"Chemical-mechanical planarization","level":3,"score":0.9603706002235413},{"id":"https://openalex.org/C50644808","wikidata":"https://www.wikidata.org/wiki/Q192776","display_name":"Artificial neural network","level":2,"score":0.726528525352478},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6394113302230835},{"id":"https://openalex.org/C38858127","wikidata":"https://www.wikidata.org/wiki/Q5441228","display_name":"Feed forward","level":2,"score":0.5429030656814575},{"id":"https://openalex.org/C155386361","wikidata":"https://www.wikidata.org/wiki/Q1649571","display_name":"Process control","level":3,"score":0.5257914066314697},{"id":"https://openalex.org/C203479927","wikidata":"https://www.wikidata.org/wiki/Q5165939","display_name":"Controller (irrigation)","level":2,"score":0.5096697807312012},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4829482436180115},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.45703378319740295},{"id":"https://openalex.org/C47702885","wikidata":"https://www.wikidata.org/wiki/Q5441227","display_name":"Feedforward neural network","level":3,"score":0.454983651638031},{"id":"https://openalex.org/C2780598303","wikidata":"https://www.wikidata.org/wiki/Q65921492","display_name":"Flexibility (engineering)","level":2,"score":0.4213179051876068},{"id":"https://openalex.org/C47446073","wikidata":"https://www.wikidata.org/wiki/Q5165890","display_name":"Control theory (sociology)","level":3,"score":0.42007678747177124},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3625949025154114},{"id":"https://openalex.org/C133731056","wikidata":"https://www.wikidata.org/wiki/Q4917288","display_name":"Control engineering","level":1,"score":0.3552210032939911},{"id":"https://openalex.org/C138113353","wikidata":"https://www.wikidata.org/wiki/Q611639","display_name":"Polishing","level":2,"score":0.2399466335773468},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.23766818642616272},{"id":"https://openalex.org/C2775924081","wikidata":"https://www.wikidata.org/wiki/Q55608371","display_name":"Control (management)","level":2,"score":0.2278057038784027},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.20031189918518066},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.18853601813316345},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.12727895379066467},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.11089301109313965},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C6557445","wikidata":"https://www.wikidata.org/wiki/Q173113","display_name":"Agronomy","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/cdc.2003.1271963","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cdc.2003.1271963","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"42nd IEEE International Conference on Decision and Control (IEEE Cat. No.03CH37475)","raw_type":"proceedings-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.711.5719","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.711.5719","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://coewww.rutgers.edu/%7Ejgyi/pdfs/IEEE_SM_2003.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/16","display_name":"Peace, Justice and strong institutions","score":0.7599999904632568}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":12,"referenced_works":["https://openalex.org/W1554663460","https://openalex.org/W1990311138","https://openalex.org/W2118806609","https://openalex.org/W2133416631","https://openalex.org/W2143757128","https://openalex.org/W2154180415","https://openalex.org/W2157415351","https://openalex.org/W2170909262","https://openalex.org/W2541224616","https://openalex.org/W4250223708","https://openalex.org/W4285719527","https://openalex.org/W6729263658"],"related_works":["https://openalex.org/W2058666584","https://openalex.org/W2348452527","https://openalex.org/W2132521340","https://openalex.org/W749211866","https://openalex.org/W1992595509","https://openalex.org/W1991753396","https://openalex.org/W2030799362","https://openalex.org/W2115072676","https://openalex.org/W4311212821","https://openalex.org/W2045727192"],"abstract_inverted_index":{"In":[0],"this":[1],"paper":[2],"a":[3,56],"neural":[4,45,61],"network":[5,46,62],"based":[6],"uniformity":[7,28,103],"controller":[8],"is":[9,47,63],"developed":[10],"for":[11],"the":[12,22,26,32,51,67,70,80,86,95],"linear":[13,40],"chemical-mechanical":[14],"planarization":[15],"(CMP)":[16],"process.":[17],"The":[18],"control":[19,59,81,97],"law":[20],"utilizes":[21],"metrology":[23],"measurements":[24],"of":[25,34],"wafer":[27],"profile":[29],"and":[30,55,73,105],"tunes":[31],"pressures":[33],"different":[35],"air-bearing":[36],"zones":[37],"on":[38],"Lam":[39],"CMP":[41,52],"polishers.":[42],"A":[43],"feedforward":[44],"used":[48],"to":[49,65,69,78],"self-learn":[50],"process":[53,68],"model":[54],"direct":[57],"inverse":[58],"with":[60,85],"utilized":[64],"regulate":[66],"target.":[71],"Simulation":[72],"experimental":[74],"results":[75,87],"are":[76],"presented":[77],"illustrate":[79],"system":[82,98],"performance.":[83],"Compared":[84],"by":[88],"using":[89],"statistical":[90],"surface":[91],"response":[92],"methods":[93],"(SRM),":[94],"proposed":[96],"can":[99],"give":[100],"more":[101,106],"accurate":[102],"profiles":[104],"flexibility.":[107]},"counts_by_year":[{"year":2020,"cited_by_count":1},{"year":2016,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}