{"id":"https://openalex.org/W2670227363","doi":"https://doi.org/10.1109/ccece.2017.7946767","title":"Correlation method based Bio-composite material temperature estimation utilizing Ultrasound Signals","display_name":"Correlation method based Bio-composite material temperature estimation utilizing Ultrasound Signals","publication_year":2017,"publication_date":"2017-04-01","ids":{"openalex":"https://openalex.org/W2670227363","doi":"https://doi.org/10.1109/ccece.2017.7946767","mag":"2670227363"},"language":"en","primary_location":{"id":"doi:10.1109/ccece.2017.7946767","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ccece.2017.7946767","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE 30th Canadian Conference on Electrical and Computer Engineering (CCECE)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5076603574","display_name":"Ahmed Elseddawy","orcid":null},"institutions":[{"id":"https://openalex.org/I74413500","display_name":"University of Windsor","ror":"https://ror.org/01gw3d370","country_code":"CA","type":"education","lineage":["https://openalex.org/I74413500"]}],"countries":["CA"],"is_corresponding":true,"raw_author_name":"A. Elseddawy","raw_affiliation_strings":["Electrical and Computer Engineering Department, University of Windsor, Ontario, Canada"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering Department, University of Windsor, Ontario, Canada","institution_ids":["https://openalex.org/I74413500"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073662631","display_name":"Inna Seviaryna","orcid":null},"institutions":[{"id":"https://openalex.org/I4403386708","display_name":"Institute for Diagnostic Imaging Research","ror":"https://ror.org/0579c5n38","country_code":null,"type":"facility","lineage":["https://openalex.org/I4403386708","https://openalex.org/I74413500"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"I. Seviaryna","raw_affiliation_strings":["Institute for Diagnostic Imaging Research (IDIR), Ontario, Canada"],"affiliations":[{"raw_affiliation_string":"Institute for Diagnostic Imaging Research (IDIR), Ontario, Canada","institution_ids":["https://openalex.org/I4403386708"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5062270694","display_name":"Volf Leshchynsky","orcid":"https://orcid.org/0000-0003-3807-0701"},"institutions":[{"id":"https://openalex.org/I4403386708","display_name":"Institute for Diagnostic Imaging Research","ror":"https://ror.org/0579c5n38","country_code":null,"type":"facility","lineage":["https://openalex.org/I4403386708","https://openalex.org/I74413500"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"V. Leshchynsky","raw_affiliation_strings":["Institute for Diagnostic Imaging Research (IDIR), Ontario, Canada"],"affiliations":[{"raw_affiliation_string":"Institute for Diagnostic Imaging Research (IDIR), Ontario, Canada","institution_ids":["https://openalex.org/I4403386708"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089471532","display_name":"Jimi Tjong","orcid":"https://orcid.org/0000-0002-3147-1337"},"institutions":[{"id":"https://openalex.org/I21409547","display_name":"Ford Motor Company (Canada)","ror":"https://ror.org/00v84va72","country_code":"CA","type":"company","lineage":["https://openalex.org/I1292974536","https://openalex.org/I21409547"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"J. Tjong","raw_affiliation_strings":["Ford Motor Company (PERDC) Windsor, Ontario, Canada"],"affiliations":[{"raw_affiliation_string":"Ford Motor Company (PERDC) Windsor, Ontario, Canada","institution_ids":["https://openalex.org/I21409547"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5089661313","display_name":"Roman Gr. Maev","orcid":"https://orcid.org/0000-0002-3789-6934"},"institutions":[{"id":"https://openalex.org/I4403386708","display_name":"Institute for Diagnostic Imaging Research","ror":"https://ror.org/0579c5n38","country_code":null,"type":"facility","lineage":["https://openalex.org/I4403386708","https://openalex.org/I74413500"]},{"id":"https://openalex.org/I74413500","display_name":"University of Windsor","ror":"https://ror.org/01gw3d370","country_code":"CA","type":"education","lineage":["https://openalex.org/I74413500"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"R. Maev","raw_affiliation_strings":["Electrical and Computer Engineering Department, University of Windsor, Ontario, Canada","Institute for Diagnostic Imaging Research (IDIR), Ontario, Canada"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering Department, University of Windsor, Ontario, Canada","institution_ids":["https://openalex.org/I74413500"]},{"raw_affiliation_string":"Institute for Diagnostic Imaging Research (IDIR), Ontario, Canada","institution_ids":["https://openalex.org/I4403386708"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5076603574"],"corresponding_institution_ids":["https://openalex.org/I74413500"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.07757138,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"39","issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12537","display_name":"Flow Measurement and Analysis","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12537","display_name":"Flow Measurement and Analysis","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10662","display_name":"Ultrasonics and Acoustic Wave Propagation","score":0.9904000163078308,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12697","display_name":"Water Quality Monitoring Technologies","score":0.9789000153541565,"subfield":{"id":"https://openalex.org/subfields/2312","display_name":"Water Science and Technology"},"field":{"id":"https://openalex.org/fields/23","display_name":"Environmental Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/composite-number","display_name":"Composite number","score":0.741595447063446},{"id":"https://openalex.org/keywords/signal","display_name":"SIGNAL (programming language)","score":0.7239320278167725},{"id":"https://openalex.org/keywords/correlation-coefficient","display_name":"Correlation coefficient","score":0.6639969348907471},{"id":"https://openalex.org/keywords/temperature-measurement","display_name":"Temperature measurement","score":0.6289947032928467},{"id":"https://openalex.org/keywords/signal-processing","display_name":"Signal processing","score":0.5566352009773254},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5222588181495667},{"id":"https://openalex.org/keywords/correlation","display_name":"Correlation","score":0.49857091903686523},{"id":"https://openalex.org/keywords/ultrasound","display_name":"Ultrasound","score":0.46108052134513855},{"id":"https://openalex.org/keywords/temperature-coefficient","display_name":"Temperature coefficient","score":0.444698303937912},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4196946620941162},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.4139839708805084},{"id":"https://openalex.org/keywords/biological-system","display_name":"Biological system","score":0.36060580611228943},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.303150475025177},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.29245418310165405},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.17903590202331543},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1546039879322052},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.13414382934570312},{"id":"https://openalex.org/keywords/machine-learning","display_name":"Machine learning","score":0.11534035205841064},{"id":"https://openalex.org/keywords/digital-signal-processing","display_name":"Digital signal processing","score":0.11517992615699768},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.07823249697685242}],"concepts":[{"id":"https://openalex.org/C104779481","wikidata":"https://www.wikidata.org/wiki/Q50707","display_name":"Composite number","level":2,"score":0.741595447063446},{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.7239320278167725},{"id":"https://openalex.org/C2780092901","wikidata":"https://www.wikidata.org/wiki/Q3433612","display_name":"Correlation coefficient","level":2,"score":0.6639969348907471},{"id":"https://openalex.org/C72293138","wikidata":"https://www.wikidata.org/wiki/Q909741","display_name":"Temperature measurement","level":2,"score":0.6289947032928467},{"id":"https://openalex.org/C104267543","wikidata":"https://www.wikidata.org/wiki/Q208163","display_name":"Signal processing","level":3,"score":0.5566352009773254},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5222588181495667},{"id":"https://openalex.org/C117220453","wikidata":"https://www.wikidata.org/wiki/Q5172842","display_name":"Correlation","level":2,"score":0.49857091903686523},{"id":"https://openalex.org/C143753070","wikidata":"https://www.wikidata.org/wiki/Q162564","display_name":"Ultrasound","level":2,"score":0.46108052134513855},{"id":"https://openalex.org/C16643434","wikidata":"https://www.wikidata.org/wiki/Q898642","display_name":"Temperature coefficient","level":2,"score":0.444698303937912},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4196946620941162},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.4139839708805084},{"id":"https://openalex.org/C186060115","wikidata":"https://www.wikidata.org/wiki/Q30336093","display_name":"Biological system","level":1,"score":0.36060580611228943},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.303150475025177},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.29245418310165405},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.17903590202331543},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1546039879322052},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.13414382934570312},{"id":"https://openalex.org/C119857082","wikidata":"https://www.wikidata.org/wiki/Q2539","display_name":"Machine learning","level":1,"score":0.11534035205841064},{"id":"https://openalex.org/C84462506","wikidata":"https://www.wikidata.org/wiki/Q173142","display_name":"Digital signal processing","level":2,"score":0.11517992615699768},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.07823249697685242},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/ccece.2017.7946767","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ccece.2017.7946767","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE 30th Canadian Conference on Electrical and Computer Engineering (CCECE)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.5099999904632568,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W1684922874","https://openalex.org/W1983930728","https://openalex.org/W1997248037","https://openalex.org/W2010344741","https://openalex.org/W2014883295","https://openalex.org/W2130854347","https://openalex.org/W2131684499","https://openalex.org/W2186114482","https://openalex.org/W2296819191","https://openalex.org/W2298523696","https://openalex.org/W2535206797","https://openalex.org/W2547730687","https://openalex.org/W2552168109"],"related_works":["https://openalex.org/W2372194214","https://openalex.org/W3081640970","https://openalex.org/W4200439127","https://openalex.org/W2021013714","https://openalex.org/W2412250669","https://openalex.org/W2359856669","https://openalex.org/W1488551807","https://openalex.org/W4253009869","https://openalex.org/W2023979854","https://openalex.org/W2560331580"],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"we":[3],"present":[4],"a":[5],"one":[6],"step":[7],"forward":[8],"to":[9,36,51],"online":[10],"monitoring":[11],"of":[12,20],"Bio-composite":[13,21,33],"material":[14,34],"processing":[15],"temperature.":[16],"A":[17],"temperature":[18,38,63,77],"estimation":[19],"utilizing":[22],"Ultrasound":[23],"Signal":[24],"(US)":[25],"is":[26,43,49,74],"investigated.":[27],"First":[28],"US":[29],"were":[30],"applied":[31],"on":[32],"heated":[35],"different":[37],"and":[39,64,80],"the":[40,53,58,65,72],"reflected":[41],"signal":[42,60],"recorded.":[44],"Then":[45],"auto":[46],"correlation":[47,55],"method":[48,73],"used":[50],"address":[52],"max":[54],"coefficient":[56],"between":[57,78],"detected":[59],"at":[61],"certain":[62],"recorded":[66],"data.":[67],"Simulation":[68],"results":[69],"show":[70],"that":[71],"successfully":[75],"detecting":[76],"25\u00b0C":[79],"200\u00b0C.":[81]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}