{"id":"https://openalex.org/W2708677274","doi":"https://doi.org/10.1109/ccece.2017.7946665","title":"A new scheme for high frequency ultrasound generation","display_name":"A new scheme for high frequency ultrasound generation","publication_year":2017,"publication_date":"2017-04-01","ids":{"openalex":"https://openalex.org/W2708677274","doi":"https://doi.org/10.1109/ccece.2017.7946665","mag":"2708677274"},"language":"en","primary_location":{"id":"doi:10.1109/ccece.2017.7946665","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ccece.2017.7946665","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE 30th Canadian Conference on Electrical and Computer Engineering (CCECE)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5090352787","display_name":"Varshitha Yashvanth","orcid":null},"institutions":[{"id":"https://openalex.org/I74413500","display_name":"University of Windsor","ror":"https://ror.org/01gw3d370","country_code":"CA","type":"education","lineage":["https://openalex.org/I74413500"]}],"countries":["CA"],"is_corresponding":true,"raw_author_name":"Varshitha Yashvanth","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Windsor, Windsor, ON, Canada"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Windsor, Windsor, ON, Canada","institution_ids":["https://openalex.org/I74413500"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5047208692","display_name":"Sazzadur Chowdhury","orcid":"https://orcid.org/0000-0003-2635-2525"},"institutions":[{"id":"https://openalex.org/I74413500","display_name":"University of Windsor","ror":"https://ror.org/01gw3d370","country_code":"CA","type":"education","lineage":["https://openalex.org/I74413500"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Sazzadur Chowdhury","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Windsor, Windsor, ON, Canada"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Windsor, Windsor, ON, Canada","institution_ids":["https://openalex.org/I74413500"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5090352787"],"corresponding_institution_ids":["https://openalex.org/I74413500"],"apc_list":null,"apc_paid":null,"fwci":0.4147,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.5958793,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":97},"biblio":{"volume":"24","issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11160","display_name":"Acoustic Wave Resonator Technologies","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11160","display_name":"Acoustic Wave Resonator Technologies","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9965000152587891,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.7211135625839233},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7082533836364746},{"id":"https://openalex.org/keywords/capacitive-micromachined-ultrasonic-transducers","display_name":"Capacitive micromachined ultrasonic transducers","score":0.6040335893630981},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5585148930549622},{"id":"https://openalex.org/keywords/ultrasound","display_name":"Ultrasound","score":0.5476592183113098},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.4863736927509308},{"id":"https://openalex.org/keywords/semiconductor","display_name":"Semiconductor","score":0.4768296778202057},{"id":"https://openalex.org/keywords/high-frequency-ultrasound","display_name":"High frequency ultrasound","score":0.47260716557502747},{"id":"https://openalex.org/keywords/dielectric","display_name":"Dielectric","score":0.4696749150753021},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.43198639154434204},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4017331898212433},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3281424641609192},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.23481062054634094},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1408589482307434},{"id":"https://openalex.org/keywords/piezoelectricity","display_name":"Piezoelectricity","score":0.13031736016273499}],"concepts":[{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.7211135625839233},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7082533836364746},{"id":"https://openalex.org/C58772458","wikidata":"https://www.wikidata.org/wiki/Q5034480","display_name":"Capacitive micromachined ultrasonic transducers","level":3,"score":0.6040335893630981},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5585148930549622},{"id":"https://openalex.org/C143753070","wikidata":"https://www.wikidata.org/wiki/Q162564","display_name":"Ultrasound","level":2,"score":0.5476592183113098},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.4863736927509308},{"id":"https://openalex.org/C108225325","wikidata":"https://www.wikidata.org/wiki/Q11456","display_name":"Semiconductor","level":2,"score":0.4768296778202057},{"id":"https://openalex.org/C3017458007","wikidata":"https://www.wikidata.org/wiki/Q7239554","display_name":"High frequency ultrasound","level":3,"score":0.47260716557502747},{"id":"https://openalex.org/C133386390","wikidata":"https://www.wikidata.org/wiki/Q184996","display_name":"Dielectric","level":2,"score":0.4696749150753021},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.43198639154434204},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4017331898212433},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3281424641609192},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.23481062054634094},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1408589482307434},{"id":"https://openalex.org/C100082104","wikidata":"https://www.wikidata.org/wiki/Q183759","display_name":"Piezoelectricity","level":2,"score":0.13031736016273499},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/ccece.2017.7946665","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ccece.2017.7946665","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE 30th Canadian Conference on Electrical and Computer Engineering (CCECE)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6600000262260437,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320310709","display_name":"CMC Microsystems","ror":"https://ror.org/03k70ea39"},{"id":"https://openalex.org/F4320334593","display_name":"Natural Sciences and Engineering Research Council of Canada","ror":"https://ror.org/01h531d29"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":12,"referenced_works":["https://openalex.org/W1762156512","https://openalex.org/W2042149779","https://openalex.org/W2045549635","https://openalex.org/W2048331001","https://openalex.org/W2110422666","https://openalex.org/W2115079039","https://openalex.org/W2123695937","https://openalex.org/W2150266890","https://openalex.org/W2520870725","https://openalex.org/W2559273088","https://openalex.org/W6727225292","https://openalex.org/W7058447363"],"related_works":["https://openalex.org/W2387058089","https://openalex.org/W2371537149","https://openalex.org/W2368729589","https://openalex.org/W2391366512","https://openalex.org/W2358963571","https://openalex.org/W2367128714","https://openalex.org/W2353820532","https://openalex.org/W2374996454","https://openalex.org/W2373439795","https://openalex.org/W2062973909"],"abstract_inverted_index":{"A":[0,106],"new":[1,13],"scheme":[2],"for":[3,119],"high":[4,25,125],"frequency":[5,26],"ultrasound":[6,27,50,85],"generation":[7],"has":[8,110],"been":[9,112],"proposed.":[10],"In":[11],"the":[12,38,45,83],"scheme,":[14],"a":[15,24,29,56,62,87,97,102],"CMUT":[16],"like":[17],"geometry":[18],"will":[19,51],"be":[20,53,94,117],"used":[21,118],"to":[22,33,61,81,86,123],"generate":[23],"using":[28,96],"low":[30,57],"actuation":[31],"voltage":[32],"avoid":[34],"nonlinear":[35],"effects":[36],"of":[37,44,66,69,73],"electrostatic":[39],"force":[40],"and":[41,79],"dielectric":[42],"charging":[43],"insulating":[46],"layers.":[47],"The":[48,91,114],"generated":[49,84],"then":[52],"coupled":[54],"through":[55],"loss":[58],"polymeric":[59],"layer":[60],"semiconductor":[63],"superlattice":[64],"comprised":[65],"multiple":[67],"periods":[68],"alternate":[70],"thin":[71],"layers":[72],"compound":[74],"semiconductors":[75],"such":[76],"as":[77],"AlAs":[78],"GaAs":[80],"amplify":[82],"desired":[88],"pressure":[89],"range.":[90],"device":[92,115],"can":[93,116],"fabricated":[95],"conventional":[98],"fabrication":[99,108],"processes":[100],"in":[101],"cost":[103],"effective":[104],"manner.":[105],"conceptual":[107],"process":[109],"also":[111],"presented.":[113],"biomedical":[120],"diagnostic":[121],"applications":[122],"obtain":[124],"resolution":[126],"images.":[127]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2018,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}