{"id":"https://openalex.org/W2015853970","doi":"https://doi.org/10.1109/cca.2012.6402409","title":"Least angle regression for semiconductor manufacturing modeling","display_name":"Least angle regression for semiconductor manufacturing modeling","publication_year":2012,"publication_date":"2012-10-01","ids":{"openalex":"https://openalex.org/W2015853970","doi":"https://doi.org/10.1109/cca.2012.6402409","mag":"2015853970"},"language":"en","primary_location":{"id":"doi:10.1109/cca.2012.6402409","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cca.2012.6402409","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 IEEE International Conference on Control Applications","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5026617079","display_name":"Gian Antonio Susto","orcid":"https://orcid.org/0000-0001-5739-9639"},"institutions":[{"id":"https://openalex.org/I138689650","display_name":"University of Padua","ror":"https://ror.org/00240q980","country_code":"IT","type":"education","lineage":["https://openalex.org/I138689650"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Gian Antonio Susto","raw_affiliation_strings":["Department of Information Engineering, University of Padova, Italy","Department of Information Engineering University of Padova  Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Information Engineering, University of Padova, Italy","institution_ids":["https://openalex.org/I138689650"]},{"raw_affiliation_string":"Department of Information Engineering University of Padova  Italy","institution_ids":["https://openalex.org/I138689650"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5043391732","display_name":"Alessandro Beghi","orcid":"https://orcid.org/0000-0003-2252-2179"},"institutions":[{"id":"https://openalex.org/I138689650","display_name":"University of Padua","ror":"https://ror.org/00240q980","country_code":"IT","type":"education","lineage":["https://openalex.org/I138689650"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Alessandro Beghi","raw_affiliation_strings":["Department of Information Engineering, University of Padova, Italy","Department of Information Engineering University of Padova  Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Information Engineering, University of Padova, Italy","institution_ids":["https://openalex.org/I138689650"]},{"raw_affiliation_string":"Department of Information Engineering University of Padova  Italy","institution_ids":["https://openalex.org/I138689650"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I138689650"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":25,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"658","last_page":"663"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11583","display_name":"Advanced Measurement and Metrology Techniques","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11583","display_name":"Advanced Measurement and Metrology Techniques","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10638","display_name":"Optical measurement and interference techniques","score":0.996399998664856,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/metrology","display_name":"Metrology","score":0.9013843536376953},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.7557781934738159},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.7437631487846375},{"id":"https://openalex.org/keywords/interpretability","display_name":"Interpretability","score":0.7318153977394104},{"id":"https://openalex.org/keywords/semiconductor-device-modeling","display_name":"Semiconductor device modeling","score":0.5052536129951477},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.494265079498291},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.4399755001068115},{"id":"https://openalex.org/keywords/process-engineering","display_name":"Process engineering","score":0.36339181661605835},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.34973400831222534},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.29037976264953613},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2840328812599182},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.17016229033470154},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.09976759552955627},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.08749297261238098},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.08432480692863464},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.07841405272483826}],"concepts":[{"id":"https://openalex.org/C195766429","wikidata":"https://www.wikidata.org/wiki/Q394","display_name":"Metrology","level":2,"score":0.9013843536376953},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.7557781934738159},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.7437631487846375},{"id":"https://openalex.org/C2781067378","wikidata":"https://www.wikidata.org/wiki/Q17027399","display_name":"Interpretability","level":2,"score":0.7318153977394104},{"id":"https://openalex.org/C4775677","wikidata":"https://www.wikidata.org/wiki/Q7449393","display_name":"Semiconductor device modeling","level":3,"score":0.5052536129951477},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.494265079498291},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4399755001068115},{"id":"https://openalex.org/C21880701","wikidata":"https://www.wikidata.org/wiki/Q2144042","display_name":"Process engineering","level":1,"score":0.36339181661605835},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.34973400831222534},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.29037976264953613},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2840328812599182},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.17016229033470154},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.09976759552955627},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.08749297261238098},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.08432480692863464},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.07841405272483826},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/cca.2012.6402409","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cca.2012.6402409","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 IEEE International Conference on Control Applications","raw_type":"proceedings-article"},{"id":"pmh:oai:www.research.unipd.it:11577/2532290","is_oa":false,"landing_page_url":"http://hdl.handle.net/11577/2532290","pdf_url":null,"source":{"id":"https://openalex.org/S4306402547","display_name":"Padua Research Archive (University of Padova)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I138689650","host_organization_name":"University of Padua","host_organization_lineage":["https://openalex.org/I138689650"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"info:eu-repo/semantics/conferenceObject"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.49000000953674316,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":21,"referenced_works":["https://openalex.org/W1480376833","https://openalex.org/W2020580381","https://openalex.org/W2033872649","https://openalex.org/W2063978378","https://openalex.org/W2066567429","https://openalex.org/W2070963892","https://openalex.org/W2071861244","https://openalex.org/W2075067011","https://openalex.org/W2105355692","https://openalex.org/W2120130912","https://openalex.org/W2132797624","https://openalex.org/W2135046866","https://openalex.org/W2140758165","https://openalex.org/W2147973445","https://openalex.org/W2166774870","https://openalex.org/W2171136185","https://openalex.org/W2346456480","https://openalex.org/W4298304654","https://openalex.org/W6628633436","https://openalex.org/W6684743159","https://openalex.org/W6704782557"],"related_works":["https://openalex.org/W2151505334","https://openalex.org/W2992897358","https://openalex.org/W2507812949","https://openalex.org/W2115540908","https://openalex.org/W4256167503","https://openalex.org/W2631724279","https://openalex.org/W2600422794","https://openalex.org/W2060880752","https://openalex.org/W1876981296","https://openalex.org/W1980441280"],"abstract_inverted_index":{"In":[0,54,69],"semiconductor":[1],"manufacturing":[2],"plants,":[3],"monitoring":[4],"physical":[5,52],"properties":[6],"of":[7,51,87,93,99,121],"all":[8],"wafers":[9,34],"is":[10,26,103],"fundamental":[11],"in":[12,30,35],"order":[13],"to":[14,46,62,105,117],"maintain":[15],"good":[16],"yield":[17],"and":[18,29,92,124],"high":[19,122],"quality":[20],"standards.":[21],"However,":[22],"such":[23],"an":[24],"approach":[25],"too":[27],"costly":[28],"practice":[31],"only":[32],"few":[33],"a":[36,55,74,78,111],"lot":[37],"are":[38,60],"actually":[39],"monitored.":[40],"Virtual":[41],"Metrology":[42],"(VM)":[43],"systems":[44],"allow":[45],"partly":[47],"overcome":[48,118],"the":[49,85,88,94,119],"lack":[50],"metrology.":[53],"VM":[56,75,112,129],"scheme,":[57],"tool":[58],"data":[59,137],"used":[61],"predict,":[63],"for":[64,77,96],"every":[65,97],"wafer,":[66,98],"metrology":[67,90],"measurements.":[68],"this":[70],"paper,":[71],"we":[72],"present":[73],"system":[76],"Chemical":[79],"Vapor":[80],"Deposition":[81],"(CVD)":[82],"process.":[83],"On":[84],"basis":[86],"available":[89],"results":[91],"knowledge,":[95],"equipment":[100],"variables,":[101],"it":[102],"possible":[104],"predict":[106],"CVD":[107],"thickness.":[108],"We":[109],"propose":[110],"module":[113],"based":[114],"on":[115,134],"LARS":[116],"problem":[120],"dimensionality":[123],"model":[125],"interpretability.":[126],"The":[127],"proposed":[128],"models":[130],"have":[131],"been":[132],"tested":[133],"industrial":[135],"production":[136],"sets.":[138]},"counts_by_year":[{"year":2021,"cited_by_count":3},{"year":2020,"cited_by_count":3},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":5},{"year":2017,"cited_by_count":2},{"year":2014,"cited_by_count":5},{"year":2013,"cited_by_count":2},{"year":2012,"cited_by_count":2}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}