{"id":"https://openalex.org/W4322577763","doi":"https://doi.org/10.1109/bcicts53451.2022.10051730","title":"Impact of Layout Parasitics and Thermal Coupling on PA performance and ruggedness in SiGe HBTs","display_name":"Impact of Layout Parasitics and Thermal Coupling on PA performance and ruggedness in SiGe HBTs","publication_year":2022,"publication_date":"2022-10-16","ids":{"openalex":"https://openalex.org/W4322577763","doi":"https://doi.org/10.1109/bcicts53451.2022.10051730"},"language":"en","primary_location":{"id":"doi:10.1109/bcicts53451.2022.10051730","is_oa":false,"landing_page_url":"https://doi.org/10.1109/bcicts53451.2022.10051730","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5022660333","display_name":"Saurabh Sirohi","orcid":null},"institutions":[{"id":"https://openalex.org/I35662394","display_name":"GlobalFoundries (United States)","ror":"https://ror.org/02h0ps145","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Saurabh Sirohi","raw_affiliation_strings":["GLOBALFOUNDRIES,Essex Junction,VT,USA,05452"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES,Essex Junction,VT,USA,05452","institution_ids":["https://openalex.org/I35662394"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075207182","display_name":"Beng Woon Lim","orcid":null},"institutions":[{"id":"https://openalex.org/I35662394","display_name":"GlobalFoundries (United States)","ror":"https://ror.org/02h0ps145","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Beng Woon Lim","raw_affiliation_strings":["GLOBALFOUNDRIES,Malta,NY,USA,12020"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES,Malta,NY,USA,12020","institution_ids":["https://openalex.org/I35662394"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113855121","display_name":"A. Raman","orcid":null},"institutions":[{"id":"https://openalex.org/I35662394","display_name":"GlobalFoundries (United States)","ror":"https://ror.org/02h0ps145","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ajay Raman","raw_affiliation_strings":["GLOBALFOUNDRIES,Essex Junction,VT,USA,05452"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES,Essex Junction,VT,USA,05452","institution_ids":["https://openalex.org/I35662394"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101822676","display_name":"Frederick A. Anderson","orcid":"https://orcid.org/0000-0003-0690-1590"},"institutions":[{"id":"https://openalex.org/I35662394","display_name":"GlobalFoundries (United States)","ror":"https://ror.org/02h0ps145","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Frederick A. Anderson","raw_affiliation_strings":["GLOBALFOUNDRIES,Essex Junction,VT,USA,05452"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES,Essex Junction,VT,USA,05452","institution_ids":["https://openalex.org/I35662394"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I35662394"],"apc_list":null,"apc_paid":null,"fwci":0.8235,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.7068006,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"82","last_page":"85"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11248","display_name":"Advanced Power Amplifier Design","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9937999844551086,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/parasitic-extraction","display_name":"Parasitic extraction","score":0.7626833915710449},{"id":"https://openalex.org/keywords/coupling","display_name":"Coupling (piping)","score":0.5408812165260315},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.46000105142593384},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.4573289155960083},{"id":"https://openalex.org/keywords/amplifier","display_name":"Amplifier","score":0.4472620189189911},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.4406892657279968},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.4144391417503357},{"id":"https://openalex.org/keywords/topology","display_name":"Topology (electrical circuits)","score":0.41385072469711304},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3837825059890747},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.36729198694229126},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.33857735991477966},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.17814484238624573},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.17419806122779846},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.12805360555648804}],"concepts":[{"id":"https://openalex.org/C159818811","wikidata":"https://www.wikidata.org/wiki/Q7135947","display_name":"Parasitic extraction","level":2,"score":0.7626833915710449},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.5408812165260315},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.46000105142593384},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.4573289155960083},{"id":"https://openalex.org/C194257627","wikidata":"https://www.wikidata.org/wiki/Q211554","display_name":"Amplifier","level":3,"score":0.4472620189189911},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.4406892657279968},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.4144391417503357},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.41385072469711304},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3837825059890747},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.36729198694229126},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.33857735991477966},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.17814484238624573},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.17419806122779846},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.12805360555648804},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/bcicts53451.2022.10051730","is_oa":false,"landing_page_url":"https://doi.org/10.1109/bcicts53451.2022.10051730","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.4399999976158142,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W1964575303","https://openalex.org/W2146012394","https://openalex.org/W2166208672","https://openalex.org/W2174162953","https://openalex.org/W2318138962","https://openalex.org/W2770834829","https://openalex.org/W2902478806","https://openalex.org/W3003335695","https://openalex.org/W4210786805"],"related_works":["https://openalex.org/W1905216755","https://openalex.org/W2104218257","https://openalex.org/W2117417104","https://openalex.org/W2534619547","https://openalex.org/W1923048618","https://openalex.org/W1990010037","https://openalex.org/W4255141013","https://openalex.org/W2027218961","https://openalex.org/W4243257095","https://openalex.org/W2967370063"],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"we":[3],"present":[4],"the":[5,20,57,76],"impact":[6],"of":[7,59],"layout":[8,58,87],"parasitics":[9],"and":[10,47,52,70,81,92,101],"thermal":[11,71],"coupling":[12],"on":[13],"a":[14,32],"SiGe":[15,24],"PA":[16,37],"power":[17,60,79],"cell":[18,34,61],"using":[19],"Globalfoundries":[21],"4thgeneration":[22],"350nm":[23],"Power":[25],"Amplifier":[26],"technology.":[27],"Device":[28],"sizes":[29],"varying":[30],"from":[31],"unit":[33],"(120\u03bcm2)":[35],"to":[36,43,65,74],"array":[38],"(720\u03bcm2and":[39],"1440\u03bcm2)":[40],"is":[41,84,90],"used":[42],"compare":[44],"DC,":[45],"AC,":[46],"large":[48,77],"signal":[49,78],"performance.":[50],"Measured":[51],"simulated":[53],"data":[54],"shows":[55],"that":[56,86],"can":[62,93],"be":[63],"optimized":[64],"reduce":[66],"wiring":[67],"parasitic":[68],"non-uniformity":[69],"heat":[72],"dissipation":[73],"improve":[75],"performance":[80],"ruggedness.":[82],"It":[83],"found":[85],"style":[88],"A":[89],"better":[91,96,99],"give":[94],"8%":[95],"PAE,":[97],"0.5dB":[98],"Gain":[100],"20C":[102],"lower":[103],"peak":[104],"delta-temperature":[105],"(\u2206T).":[106]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":2}],"updated_date":"2026-08-11T07:18:39.950985","created_date":"2025-10-10T00:00:00"}