{"id":"https://openalex.org/W3003933357","doi":"https://doi.org/10.1109/bcicts45179.2019.8972766","title":"Toward Diamond-Collector Heterojunction Bipolar Transistors via grafted GaAs-Diamond n-p junction","display_name":"Toward Diamond-Collector Heterojunction Bipolar Transistors via grafted GaAs-Diamond n-p junction","publication_year":2019,"publication_date":"2019-11-01","ids":{"openalex":"https://openalex.org/W3003933357","doi":"https://doi.org/10.1109/bcicts45179.2019.8972766","mag":"3003933357"},"language":"en","primary_location":{"id":"doi:10.1109/bcicts45179.2019.8972766","is_oa":false,"landing_page_url":"https://doi.org/10.1109/bcicts45179.2019.8972766","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE BiCMOS and Compound semiconductor Integrated Circuits and Technology Symposium (BCICTS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100407344","display_name":"Dong Liu","orcid":"https://orcid.org/0000-0001-5060-6682"},"institutions":[{"id":"https://openalex.org/I135310074","display_name":"University of Wisconsin\u2013Madison","ror":"https://ror.org/01y2jtd41","country_code":"US","type":"education","lineage":["https://openalex.org/I135310074"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Dong Liu","raw_affiliation_strings":["University of Wisconsin-Madison,Department of Electrical and Computer Engineering,Madison,WI,USA,53706"],"affiliations":[{"raw_affiliation_string":"University of Wisconsin-Madison,Department of Electrical and Computer Engineering,Madison,WI,USA,53706","institution_ids":["https://openalex.org/I135310074"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5048969189","display_name":"Sang Jung Cho","orcid":null},"institutions":[{"id":"https://openalex.org/I135310074","display_name":"University of Wisconsin\u2013Madison","ror":"https://ror.org/01y2jtd41","country_code":"US","type":"education","lineage":["https://openalex.org/I135310074"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sang Jung Cho","raw_affiliation_strings":["University of Wisconsin-Madison,Department of Electrical and Computer Engineering,Madison,WI,USA,53706"],"affiliations":[{"raw_affiliation_string":"University of Wisconsin-Madison,Department of Electrical and Computer Engineering,Madison,WI,USA,53706","institution_ids":["https://openalex.org/I135310074"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5034828431","display_name":"Aaron Hardy","orcid":"https://orcid.org/0000-0001-5056-2229"},"institutions":[{"id":"https://openalex.org/I4210161623","display_name":"Fraunhofer USA","ror":"https://ror.org/05aah2q92","country_code":"US","type":"nonprofit","lineage":["https://openalex.org/I4210161623","https://openalex.org/I4923324"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Aaron Hardy","raw_affiliation_strings":["Fraunhofer USA Center for Coatings and Diamond Technologies,East Lansing,MI,USA,48823"],"affiliations":[{"raw_affiliation_string":"Fraunhofer USA Center for Coatings and Diamond Technologies,East Lansing,MI,USA,48823","institution_ids":["https://openalex.org/I4210161623"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100391608","display_name":"Jisoo Kim","orcid":"https://orcid.org/0000-0001-9540-2800"},"institutions":[{"id":"https://openalex.org/I135310074","display_name":"University of Wisconsin\u2013Madison","ror":"https://ror.org/01y2jtd41","country_code":"US","type":"education","lineage":["https://openalex.org/I135310074"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jisoo Kim","raw_affiliation_strings":["University of Wisconsin-Madison,Department of Electrical and Computer Engineering,Madison,WI,USA,53706"],"affiliations":[{"raw_affiliation_string":"University of Wisconsin-Madison,Department of Electrical and Computer Engineering,Madison,WI,USA,53706","institution_ids":["https://openalex.org/I135310074"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064220045","display_name":"Cristian J. Herrera-Rodriguez","orcid":null},"institutions":[{"id":"https://openalex.org/I87216513","display_name":"Michigan State University","ror":"https://ror.org/05hs6h993","country_code":"US","type":"education","lineage":["https://openalex.org/I87216513"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Cristian J. Herrera-Rodriguez","raw_affiliation_strings":["Michigan State University,Department of Electrical and Computer Engineering,East Lansing,MI,USA,48824"],"affiliations":[{"raw_affiliation_string":"Michigan State University,Department of Electrical and Computer Engineering,East Lansing,MI,USA,48824","institution_ids":["https://openalex.org/I87216513"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5034191638","display_name":"Edward Swinnich","orcid":null},"institutions":[{"id":"https://openalex.org/I63190737","display_name":"University at Buffalo, State University of New York","ror":"https://ror.org/01y64my43","country_code":"US","type":"education","lineage":["https://openalex.org/I63190737"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Edward Swinnich","raw_affiliation_strings":["The State University of New York,Department of Materials Design and Innovation,Buffalo Buffalo,NY,USA,14206"],"affiliations":[{"raw_affiliation_string":"The State University of New York,Department of Materials Design and Innovation,Buffalo Buffalo,NY,USA,14206","institution_ids":["https://openalex.org/I63190737"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5029533716","display_name":"Mohadeseh A. Baboli","orcid":"https://orcid.org/0000-0001-8328-8713"},"institutions":[{"id":"https://openalex.org/I155173764","display_name":"Rochester Institute of Technology","ror":"https://ror.org/00v4yb702","country_code":"US","type":"education","lineage":["https://openalex.org/I155173764"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mohadeseh A. Baboli","raw_affiliation_strings":["Rochester Institute of Technology,Microsystems Engineering and NanoPower Research Laboratories,Rochester,NY,USA,14623"],"affiliations":[{"raw_affiliation_string":"Rochester Institute of Technology,Microsystems Engineering and NanoPower Research Laboratories,Rochester,NY,USA,14623","institution_ids":["https://openalex.org/I155173764"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5002208236","display_name":"Jiarui Gong","orcid":"https://orcid.org/0000-0002-7304-4763"},"institutions":[{"id":"https://openalex.org/I135310074","display_name":"University of Wisconsin\u2013Madison","ror":"https://ror.org/01y2jtd41","country_code":"US","type":"education","lineage":["https://openalex.org/I135310074"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jiarui Gong","raw_affiliation_strings":["University of Wisconsin-Madison,Department of Physics,Madison,WI,USA,53706"],"affiliations":[{"raw_affiliation_string":"University of Wisconsin-Madison,Department of Physics,Madison,WI,USA,53706","institution_ids":["https://openalex.org/I135310074"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5029753718","display_name":"Xenofon Konstantinou","orcid":"https://orcid.org/0000-0001-5701-2019"},"institutions":[{"id":"https://openalex.org/I87216513","display_name":"Michigan State University","ror":"https://ror.org/05hs6h993","country_code":"US","type":"education","lineage":["https://openalex.org/I87216513"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Xenofon Konstantinou","raw_affiliation_strings":["Michigan State University,Department of Electrical and Computer Engineering,East Lansing,MI,USA,48824"],"affiliations":[{"raw_affiliation_string":"Michigan State University,Department of Electrical and Computer Engineering,East Lansing,MI,USA,48824","institution_ids":["https://openalex.org/I87216513"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5031725175","display_name":"John Papapolymerou","orcid":"https://orcid.org/0000-0002-1429-0921"},"institutions":[{"id":"https://openalex.org/I87216513","display_name":"Michigan State University","ror":"https://ror.org/05hs6h993","country_code":"US","type":"education","lineage":["https://openalex.org/I87216513"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"John Papapolymerou","raw_affiliation_strings":["Michigan State University,Department of Electrical and Computer Engineering,East Lansing,MI,USA,48824"],"affiliations":[{"raw_affiliation_string":"Michigan State University,Department of Electrical and Computer Engineering,East Lansing,MI,USA,48824","institution_ids":["https://openalex.org/I87216513"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055854925","display_name":"Parsian K. Mohseni","orcid":"https://orcid.org/0000-0002-9377-7454"},"institutions":[{"id":"https://openalex.org/I155173764","display_name":"Rochester Institute of Technology","ror":"https://ror.org/00v4yb702","country_code":"US","type":"education","lineage":["https://openalex.org/I155173764"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Parsian K. Mohseni","raw_affiliation_strings":["Rochester Institute of Technology,Microsystems Engineering and NanoPower Research Laboratories,Rochester,NY,USA,14623"],"affiliations":[{"raw_affiliation_string":"Rochester Institute of Technology,Microsystems Engineering and NanoPower Research Laboratories,Rochester,NY,USA,14623","institution_ids":["https://openalex.org/I155173764"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101564434","display_name":"Michael Becker","orcid":"https://orcid.org/0000-0003-2300-4250"},"institutions":[{"id":"https://openalex.org/I4210161623","display_name":"Fraunhofer USA","ror":"https://ror.org/05aah2q92","country_code":"US","type":"nonprofit","lineage":["https://openalex.org/I4210161623","https://openalex.org/I4923324"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Michael Becker","raw_affiliation_strings":["Fraunhofer USA Center for Coatings and Diamond Technologies,East Lansing,MI,USA,48824"],"affiliations":[{"raw_affiliation_string":"Fraunhofer USA Center for Coatings and Diamond Technologies,East Lansing,MI,USA,48824","institution_ids":["https://openalex.org/I4210161623"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072960505","display_name":"Jung\u2010Hun Seo","orcid":"https://orcid.org/0000-0002-5039-2503"},"institutions":[{"id":"https://openalex.org/I63190737","display_name":"University at Buffalo, State University of New York","ror":"https://ror.org/01y64my43","country_code":"US","type":"education","lineage":["https://openalex.org/I63190737"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jung-Hun Seo","raw_affiliation_strings":["The State University of New York,Department of Materials Design and Innovation,Buffalo Buffalo,NY,USA,14206"],"affiliations":[{"raw_affiliation_string":"The State University of New York,Department of Materials Design and Innovation,Buffalo Buffalo,NY,USA,14206","institution_ids":["https://openalex.org/I63190737"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079773649","display_name":"John D. Albrecht","orcid":"https://orcid.org/0000-0001-7582-7051"},"institutions":[{"id":"https://openalex.org/I87216513","display_name":"Michigan State University","ror":"https://ror.org/05hs6h993","country_code":"US","type":"education","lineage":["https://openalex.org/I87216513"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"John D. Albrecht","raw_affiliation_strings":["Michigan State University,Department of Electrical and Computer Engineering,East Lansing,MI,USA,48824"],"affiliations":[{"raw_affiliation_string":"Michigan State University,Department of Electrical and Computer Engineering,East Lansing,MI,USA,48824","institution_ids":["https://openalex.org/I87216513"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026899079","display_name":"T.A. Grotjohn","orcid":"https://orcid.org/0000-0003-3500-5381"},"institutions":[{"id":"https://openalex.org/I87216513","display_name":"Michigan State University","ror":"https://ror.org/05hs6h993","country_code":"US","type":"education","lineage":["https://openalex.org/I87216513"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Timothy Grotjohn","raw_affiliation_strings":["Michigan State University,Department of Electrical and Computer Engineering,East Lansing,MI,USA,48824"],"affiliations":[{"raw_affiliation_string":"Michigan State University,Department of Electrical and Computer Engineering,East Lansing,MI,USA,48824","institution_ids":["https://openalex.org/I87216513"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100438490","display_name":"Zhenqiang Ma","orcid":"https://orcid.org/0000-0001-9214-1342"},"institutions":[{"id":"https://openalex.org/I135310074","display_name":"University of Wisconsin\u2013Madison","ror":"https://ror.org/01y2jtd41","country_code":"US","type":"education","lineage":["https://openalex.org/I135310074"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Zhenqiang Ma","raw_affiliation_strings":["University of Wisconsin-Madison,Department of Electrical and Computer Engineering,Madison,WI,USA,53706"],"affiliations":[{"raw_affiliation_string":"University of Wisconsin-Madison,Department of Electrical and Computer Engineering,Madison,WI,USA,53706","institution_ids":["https://openalex.org/I135310074"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":16,"corresponding_author_ids":["https://openalex.org/A5100407344"],"corresponding_institution_ids":["https://openalex.org/I135310074"],"apc_list":null,"apc_paid":null,"fwci":0.1799,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.45910984,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10478","display_name":"Diamond and Carbon-based Materials Research","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10478","display_name":"Diamond and Carbon-based Materials Research","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11272","display_name":"Nanowire Synthesis and Applications","score":0.9987000226974487,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/heterojunction","display_name":"Heterojunction","score":0.6799777746200562},{"id":"https://openalex.org/keywords/diode","display_name":"Diode","score":0.5857651829719543},{"id":"https://openalex.org/keywords/diamond","display_name":"Diamond","score":0.5783281326293945},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5223039984703064},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.503513753414154},{"id":"https://openalex.org/keywords/gallium-arsenide","display_name":"Gallium arsenide","score":0.4872376024723053},{"id":"https://openalex.org/keywords/bipolar-junction-transistor","display_name":"Bipolar junction transistor","score":0.42274898290634155},{"id":"https://openalex.org/keywords/transistor","display_name":"Transistor","score":0.348909854888916},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.29703426361083984},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.24130359292030334},{"id":"https://openalex.org/keywords/quantum-mechanics","display_name":"Quantum mechanics","score":0.06840085983276367}],"concepts":[{"id":"https://openalex.org/C79794668","wikidata":"https://www.wikidata.org/wiki/Q1616270","display_name":"Heterojunction","level":2,"score":0.6799777746200562},{"id":"https://openalex.org/C78434282","wikidata":"https://www.wikidata.org/wiki/Q11656","display_name":"Diode","level":2,"score":0.5857651829719543},{"id":"https://openalex.org/C2776921476","wikidata":"https://www.wikidata.org/wiki/Q5283","display_name":"Diamond","level":2,"score":0.5783281326293945},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5223039984703064},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.503513753414154},{"id":"https://openalex.org/C510052550","wikidata":"https://www.wikidata.org/wiki/Q422819","display_name":"Gallium arsenide","level":2,"score":0.4872376024723053},{"id":"https://openalex.org/C23061349","wikidata":"https://www.wikidata.org/wiki/Q188946","display_name":"Bipolar junction transistor","level":4,"score":0.42274898290634155},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.348909854888916},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.29703426361083984},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.24130359292030334},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.06840085983276367},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1109/bcicts45179.2019.8972766","is_oa":false,"landing_page_url":"https://doi.org/10.1109/bcicts45179.2019.8972766","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE BiCMOS and Compound semiconductor Integrated Circuits and Technology Symposium (BCICTS)","raw_type":"proceedings-article"},{"id":"pmh:oai:fraunhofer.de:N-629197","is_oa":false,"landing_page_url":"http://publica.fraunhofer.de/documents/N-629197.html","pdf_url":null,"source":{"id":"https://openalex.org/S4306400801","display_name":"Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Fraunhofer CCD","raw_type":"Conference Paper"},{"id":"pmh:oai:publica.fraunhofer.de:publica/411104","is_oa":false,"landing_page_url":"https://publica.fraunhofer.de/handle/publica/411104","pdf_url":null,"source":{"id":"https://openalex.org/S4306400318","display_name":"Fraunhofer-Publica (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"conference paper"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":27,"referenced_works":["https://openalex.org/W1547636109","https://openalex.org/W1677269781","https://openalex.org/W1966142983","https://openalex.org/W1966987325","https://openalex.org/W2001008780","https://openalex.org/W2008504291","https://openalex.org/W2019361158","https://openalex.org/W2020179577","https://openalex.org/W2036141534","https://openalex.org/W2048638602","https://openalex.org/W2053338906","https://openalex.org/W2062585468","https://openalex.org/W2065309299","https://openalex.org/W2081375043","https://openalex.org/W2103947167","https://openalex.org/W2118907460","https://openalex.org/W2319043795","https://openalex.org/W2593042084","https://openalex.org/W2601975251","https://openalex.org/W2745523326","https://openalex.org/W2875423546","https://openalex.org/W2887317289","https://openalex.org/W2899424109","https://openalex.org/W2906237855","https://openalex.org/W2912975219","https://openalex.org/W3104405092","https://openalex.org/W6757673541"],"related_works":["https://openalex.org/W1515161531","https://openalex.org/W4379114818","https://openalex.org/W2921865011","https://openalex.org/W1631058538","https://openalex.org/W2383733224","https://openalex.org/W2021859258","https://openalex.org/W1503153895","https://openalex.org/W4323658053","https://openalex.org/W2013924061","https://openalex.org/W4324123959"],"abstract_inverted_index":{"We":[0],"demonstrated":[1],"GaAs/diamond":[2],"(GaAs-C":[3],"<sup":[4,33,70,96],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[5,34,71,97],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">sp3</sup>":[6,35,72,98],")":[7],"np":[8],"diodes":[9,36],"via":[10],"lattice-mismatched":[11],"semiconductor":[12],"grafting:":[13],"forming":[14],"heterostructures":[15],"with":[16,37],"an":[17,68],"ultrathin":[18],"oxide":[19],"(UO)":[20],"layer":[21],"at":[22],"the":[23,31,53,60,64,89,101],"interface.":[24],"High-performance":[25],"rectifying":[26],"characteristics":[27],"were":[28,49,56,80],"measured":[29],"from":[30],"GaAs/C":[32],"sharp":[38],"reverse":[39],"breakdown":[40],"voltage":[41],"(Vb)":[42],"of":[43,63,91,93],"-44.5":[44],"V.":[45],"Capacitance-voltage":[46],"(CV)":[47],"measurements":[48],"carried":[50],"out":[51],"and":[52,77],"measurement":[54],"results":[55,87],"used":[57],"to":[58],"construct":[59],"band":[61],"diagram":[62],"pn":[65],"junction.":[66],"Furthermore,":[67],"AlGaAs/GaAs/C":[69,95],"pnp":[73,94],"structure":[74],"was":[75],"fabricated":[76],"both":[78],"junctions":[79],"characterized":[81],"for":[82],"their":[83],"I-V":[84],"characteristics.":[85],"The":[86],"show":[88],"prospect":[90],"realization":[92],"HBTs":[99],"in":[100],"future.":[102]},"counts_by_year":[{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}