{"id":"https://openalex.org/W3117697980","doi":"https://doi.org/10.1109/ats49688.2020.9301580","title":"Heuristic Approach for Identification of Random TSV Defects in 3D IC During Pre-bond Testing","display_name":"Heuristic Approach for Identification of Random TSV Defects in 3D IC During Pre-bond Testing","publication_year":2020,"publication_date":"2020-11-23","ids":{"openalex":"https://openalex.org/W3117697980","doi":"https://doi.org/10.1109/ats49688.2020.9301580","mag":"3117697980"},"language":"en","primary_location":{"id":"doi:10.1109/ats49688.2020.9301580","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ats49688.2020.9301580","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE 29th Asian Test Symposium (ATS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5004506417","display_name":"Tanusree Kaibartta","orcid":"https://orcid.org/0000-0001-5115-5350"},"institutions":[{"id":"https://openalex.org/I189109744","display_name":"Indian Institute of Technology Dhanbad","ror":"https://ror.org/013v3cc28","country_code":"IN","type":"education","lineage":["https://openalex.org/I189109744"]}],"countries":["IN"],"is_corresponding":true,"raw_author_name":"Tanusree Kaibartta","raw_affiliation_strings":["Computer Science and Engineering Department, IIT(ISM), Dhanbad"],"affiliations":[{"raw_affiliation_string":"Computer Science and Engineering Department, IIT(ISM), Dhanbad","institution_ids":["https://openalex.org/I189109744"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051150754","display_name":"Gautam Biswas","orcid":"https://orcid.org/0000-0002-2752-3878"},"institutions":[{"id":"https://openalex.org/I189109744","display_name":"Indian Institute of Technology Dhanbad","ror":"https://ror.org/013v3cc28","country_code":"IN","type":"education","lineage":["https://openalex.org/I189109744"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"G P Biswas","raw_affiliation_strings":["Computer Science and Engineering Department, IIT(ISM), Dhanbad"],"affiliations":[{"raw_affiliation_string":"Computer Science and Engineering Department, IIT(ISM), Dhanbad","institution_ids":["https://openalex.org/I189109744"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5059700720","display_name":"Debesh K. Das","orcid":"https://orcid.org/0000-0003-1736-1497"},"institutions":[{"id":"https://openalex.org/I170979836","display_name":"Jadavpur University","ror":"https://ror.org/02af4h012","country_code":"IN","type":"education","lineage":["https://openalex.org/I170979836"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Debesh K Das","raw_affiliation_strings":["Computer Science and Engineering Department, Jadavpur University"],"affiliations":[{"raw_affiliation_string":"Computer Science and Engineering Department, Jadavpur University","institution_ids":["https://openalex.org/I170979836"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5004506417"],"corresponding_institution_ids":["https://openalex.org/I189109744"],"apc_list":null,"apc_paid":null,"fwci":0.2055,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.53226693,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9973000288009644,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.8261355757713318},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7308029532432556},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.6101429462432861},{"id":"https://openalex.org/keywords/identification","display_name":"Identification (biology)","score":0.5219159126281738},{"id":"https://openalex.org/keywords/power-consumption","display_name":"Power consumption","score":0.5190656781196594},{"id":"https://openalex.org/keywords/heuristic","display_name":"Heuristic","score":0.49858951568603516},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.46822330355644226},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.45761436223983765},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.4427148699760437},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4255819320678711},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4236510694026947},{"id":"https://openalex.org/keywords/bond","display_name":"Bond","score":0.4136989712715149},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.39391496777534485},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.37532809376716614},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.29079121351242065},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.15737205743789673},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.07729366421699524},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.07443231344223022}],"concepts":[{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.8261355757713318},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7308029532432556},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.6101429462432861},{"id":"https://openalex.org/C116834253","wikidata":"https://www.wikidata.org/wiki/Q2039217","display_name":"Identification (biology)","level":2,"score":0.5219159126281738},{"id":"https://openalex.org/C2984118289","wikidata":"https://www.wikidata.org/wiki/Q29954","display_name":"Power consumption","level":3,"score":0.5190656781196594},{"id":"https://openalex.org/C173801870","wikidata":"https://www.wikidata.org/wiki/Q201413","display_name":"Heuristic","level":2,"score":0.49858951568603516},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.46822330355644226},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.45761436223983765},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.4427148699760437},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4255819320678711},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4236510694026947},{"id":"https://openalex.org/C69738904","wikidata":"https://www.wikidata.org/wiki/Q11693","display_name":"Bond","level":2,"score":0.4136989712715149},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.39391496777534485},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.37532809376716614},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.29079121351242065},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.15737205743789673},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.07729366421699524},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.07443231344223022},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C59822182","wikidata":"https://www.wikidata.org/wiki/Q441","display_name":"Botany","level":1,"score":0.0},{"id":"https://openalex.org/C162324750","wikidata":"https://www.wikidata.org/wiki/Q8134","display_name":"Economics","level":0,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C10138342","wikidata":"https://www.wikidata.org/wiki/Q43015","display_name":"Finance","level":1,"score":0.0},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/ats49688.2020.9301580","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ats49688.2020.9301580","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE 29th Asian Test Symposium (ATS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.8600000143051147,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W2056176281","https://openalex.org/W2063772879","https://openalex.org/W2070914725","https://openalex.org/W2082046960","https://openalex.org/W2100516830","https://openalex.org/W2126763328","https://openalex.org/W2150113875","https://openalex.org/W2159112907","https://openalex.org/W2168584827","https://openalex.org/W2169739755","https://openalex.org/W2474451066","https://openalex.org/W2984203517","https://openalex.org/W3143398174","https://openalex.org/W6678858565"],"related_works":["https://openalex.org/W2016970881","https://openalex.org/W2027159884","https://openalex.org/W1990828594","https://openalex.org/W2333804548","https://openalex.org/W2534942874","https://openalex.org/W3093450488","https://openalex.org/W2016589506","https://openalex.org/W2376702355","https://openalex.org/W4385062230","https://openalex.org/W2084347051"],"abstract_inverted_index":{"The":[0],"possibility":[1],"of":[2,58,65,76,90],"3D":[3,33],"integrated":[4,21],"circuit":[5],"(3D":[6],"IC)":[7],"has":[8],"been":[9],"considered":[10],"as":[11,118,120],"a":[12],"choice":[13],"to":[14,28,48,111,134],"overcome":[15],"the":[16,30,42,59,84,86,113,136],"difficulties":[17],"faced":[18],"by":[19],"two-dimensional":[20],"circuits":[22],"(2D":[23],"IC).":[24],"Several":[25],"technologies":[26,37],"exist":[27],"connect":[29],"layers":[31],"in":[32,103],"IC.":[34],"Among":[35],"these":[36],"through-silicon":[38],"vias":[39],"(TSVs)":[40],"is":[41,78,110],"promising":[43],"one":[44],"since":[45],"it":[46,61],"helps":[47],"reduce":[49,112,129,135],"interconnect":[50],"length,":[51],"delays":[52],"and":[53,94,140],"power":[54],"consumption.":[55],"In":[56,96,105],"spite":[57],"advantages":[60],"introduces":[62],"different":[63],"types":[64,92],"defects":[66],"which":[67],"ultimately":[68],"make":[69],"an":[70,79],"entire":[71],"IC":[72],"faulty.":[73],"Thus,":[74],"testing":[75,87,99,125,139],"TSVs":[77,100],"important":[80],"necessity.":[81],"Depending":[82],"on":[83],"timing,":[85],"may":[88],"be":[89],"two":[91],"-pre-bond":[93],"post-bond.":[95],"pre-bond":[97,114],"TSV":[98,115,138,144],"are":[101],"tested":[102],"sessions.":[104],"this":[106],"paper":[107],"our":[108],"objective":[109],"test":[116,130],"sessions":[117,131],"much":[119],"possible,":[121],"so":[122],"that":[123],"overall":[124],"time":[126],"decreases.":[127],"To":[128],"we":[132],"need":[133],"individual":[137],"increase":[141],"group":[142],"wise":[143],"testing.":[145]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2021,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}