{"id":"https://openalex.org/W2588815053","doi":"https://doi.org/10.1109/aspdac.2017.7858351","title":"Flexible interconnect in 2.5D ICs to minimize the interposer's metal layers","display_name":"Flexible interconnect in 2.5D ICs to minimize the interposer's metal layers","publication_year":2017,"publication_date":"2017-01-01","ids":{"openalex":"https://openalex.org/W2588815053","doi":"https://doi.org/10.1109/aspdac.2017.7858351","mag":"2588815053"},"language":"en","primary_location":{"id":"doi:10.1109/aspdac.2017.7858351","is_oa":false,"landing_page_url":"https://doi.org/10.1109/aspdac.2017.7858351","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 22nd Asia and South Pacific Design Automation Conference (ASP-DAC)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5037031468","display_name":"Daniel P. Seemuth","orcid":null},"institutions":[{"id":"https://openalex.org/I135310074","display_name":"University of Wisconsin\u2013Madison","ror":"https://ror.org/01y2jtd41","country_code":"US","type":"education","lineage":["https://openalex.org/I135310074"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Daniel P. Seemuth","raw_affiliation_strings":["University of Wisconsin-Madison, Madison, WI, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Wisconsin-Madison, Madison, WI, USA","institution_ids":["https://openalex.org/I135310074"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072204999","display_name":"Azadeh Davoodi","orcid":"https://orcid.org/0000-0001-5213-2556"},"institutions":[{"id":"https://openalex.org/I135310074","display_name":"University of Wisconsin\u2013Madison","ror":"https://ror.org/01y2jtd41","country_code":"US","type":"education","lineage":["https://openalex.org/I135310074"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Azadeh Davoodi","raw_affiliation_strings":["University of Wisconsin-Madison, Madison, WI, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Wisconsin-Madison, Madison, WI, USA","institution_ids":["https://openalex.org/I135310074"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5061323191","display_name":"Katherine Morrow","orcid":null},"institutions":[{"id":"https://openalex.org/I135310074","display_name":"University of Wisconsin\u2013Madison","ror":"https://ror.org/01y2jtd41","country_code":"US","type":"education","lineage":["https://openalex.org/I135310074"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Katherine Morrow","raw_affiliation_strings":["University of Wisconsin-Madison, Madison, WI, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Wisconsin-Madison, Madison, WI, USA","institution_ids":["https://openalex.org/I135310074"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I135310074"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":"32","issue":null,"first_page":"372","last_page":"377"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9847999811172485,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9713000059127808,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.9267070293426514},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.83225417137146},{"id":"https://openalex.org/keywords/field-programmable-gate-array","display_name":"Field-programmable gate array","score":0.5356136560440063},{"id":"https://openalex.org/keywords/routing","display_name":"Routing (electronic design automation)","score":0.5170367360115051},{"id":"https://openalex.org/keywords/leverage","display_name":"Leverage (statistics)","score":0.5132293701171875},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.41606777906417847},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3720773458480835},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.34477150440216064},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.11590889096260071},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.08694338798522949},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.06936612725257874}],"concepts":[{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.9267070293426514},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.83225417137146},{"id":"https://openalex.org/C42935608","wikidata":"https://www.wikidata.org/wiki/Q190411","display_name":"Field-programmable gate array","level":2,"score":0.5356136560440063},{"id":"https://openalex.org/C74172769","wikidata":"https://www.wikidata.org/wiki/Q1446839","display_name":"Routing (electronic design automation)","level":2,"score":0.5170367360115051},{"id":"https://openalex.org/C153083717","wikidata":"https://www.wikidata.org/wiki/Q6535263","display_name":"Leverage (statistics)","level":2,"score":0.5132293701171875},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.41606777906417847},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3720773458480835},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.34477150440216064},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.11590889096260071},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.08694338798522949},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.06936612725257874},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.0},{"id":"https://openalex.org/C119857082","wikidata":"https://www.wikidata.org/wiki/Q2539","display_name":"Machine learning","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/aspdac.2017.7858351","is_oa":false,"landing_page_url":"https://doi.org/10.1109/aspdac.2017.7858351","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 22nd Asia and South Pacific Design Automation Conference (ASP-DAC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.4099999964237213}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":26,"referenced_works":["https://openalex.org/W131866035","https://openalex.org/W1972007088","https://openalex.org/W1982795686","https://openalex.org/W2011912079","https://openalex.org/W2046079692","https://openalex.org/W2051611158","https://openalex.org/W2053902150","https://openalex.org/W2057469119","https://openalex.org/W2094976766","https://openalex.org/W2108721910","https://openalex.org/W2110827694","https://openalex.org/W2133317979","https://openalex.org/W2185926888","https://openalex.org/W2295318563","https://openalex.org/W2503361011","https://openalex.org/W3148937850","https://openalex.org/W4240463753","https://openalex.org/W4247567994","https://openalex.org/W4248699322","https://openalex.org/W4254855014","https://openalex.org/W4255202267","https://openalex.org/W4285719527","https://openalex.org/W6662252400","https://openalex.org/W6674367261","https://openalex.org/W6676636679","https://openalex.org/W6679753625"],"related_works":["https://openalex.org/W2073725000","https://openalex.org/W2037416628","https://openalex.org/W2789752821","https://openalex.org/W2528892790","https://openalex.org/W3146360095","https://openalex.org/W2110265185","https://openalex.org/W2002559064","https://openalex.org/W2117988687","https://openalex.org/W2336648157","https://openalex.org/W2184011203"],"abstract_inverted_index":{"In":[0,81],"2.5D":[1,21,39,55],"ICs,":[2],"the":[3,9,38,43,63,78,86,96],"number":[4,87,97],"of":[5,88,98],"metal":[6,60,89],"layers":[7,61,90,99],"in":[8,50,62,77],"interposer":[10],"contributes":[11],"strongly":[12],"to":[13,46,57,93],"its":[14],"manufacturing":[15],"costs.":[16],"Many":[17],"systems":[18],"implemented":[19],"as":[20],"ICs":[22],"include":[23],"component":[24],"dies,":[25,28],"e.g.":[26],"FPGA":[27,51,79],"that":[29,33],"have":[30],"flexible":[31,48,75,103],"interconnect":[32,49],"increase":[34],"connectivity":[35],"options":[36],"within":[37,53],"IC.":[40],"We":[41],"present":[42],"first":[44],"work":[45],"leverage":[47],"dies":[52],"a":[54],"IC":[56],"decrease":[58],"routing":[59,72],"interposer.":[64],"This":[65],"is":[66],"done":[67],"by":[68,91],"performing":[69],"3D":[70],"global":[71],"and":[73],"reassigning":[74,102],"pins":[76],"dies.":[80],"our":[82],"experiments,":[83],"we":[84],"reduce":[85],"up":[92],"33%":[94],"versus":[95],"required":[100],"before":[101],"pins.":[104]},"counts_by_year":[{"year":2021,"cited_by_count":1},{"year":2018,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}