{"id":"https://openalex.org/W1973113226","doi":"https://doi.org/10.1109/aspdac.2015.7059059","title":"An efficient 3D-IC on-chip test framework to embed TSV testing in memory BIST","display_name":"An efficient 3D-IC on-chip test framework to embed TSV testing in memory BIST","publication_year":2015,"publication_date":"2015-01-01","ids":{"openalex":"https://openalex.org/W1973113226","doi":"https://doi.org/10.1109/aspdac.2015.7059059","mag":"1973113226"},"language":"en","primary_location":{"id":"doi:10.1109/aspdac.2015.7059059","is_oa":false,"landing_page_url":"https://doi.org/10.1109/aspdac.2015.7059059","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"The 20th Asia and South Pacific Design Automation Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5089981651","display_name":"Liang-Che Li","orcid":null},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"Liang-Che Li","raw_affiliation_strings":["Dept. of Electrical Engineering, National Cheng Kung University, Taiwan","Department of Electrical Engineering, National Cheng Kung University, , Taiwan"],"affiliations":[{"raw_affiliation_string":"Dept. of Electrical Engineering, National Cheng Kung University, Taiwan","institution_ids":["https://openalex.org/I91807558"]},{"raw_affiliation_string":"Department of Electrical Engineering, National Cheng Kung University, , Taiwan","institution_ids":["https://openalex.org/I91807558"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027136761","display_name":"Wen-Hsuan Hsu","orcid":null},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Wen-Hsuan Hsu","raw_affiliation_strings":["Dept. of Electrical Engineering, National Cheng Kung University, Taiwan","Department of Electrical Engineering, National Cheng Kung University, , Taiwan"],"affiliations":[{"raw_affiliation_string":"Dept. of Electrical Engineering, National Cheng Kung University, Taiwan","institution_ids":["https://openalex.org/I91807558"]},{"raw_affiliation_string":"Department of Electrical Engineering, National Cheng Kung University, , Taiwan","institution_ids":["https://openalex.org/I91807558"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079657769","display_name":"Kuen-Jong Lee","orcid":"https://orcid.org/0000-0002-6690-0074"},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Kuen-Jong Lee","raw_affiliation_strings":["Dept. of Electrical Engineering, National Cheng Kung University, Taiwan","Department of Electrical Engineering, National Cheng Kung University, , Taiwan"],"affiliations":[{"raw_affiliation_string":"Dept. of Electrical Engineering, National Cheng Kung University, Taiwan","institution_ids":["https://openalex.org/I91807558"]},{"raw_affiliation_string":"Department of Electrical Engineering, National Cheng Kung University, , Taiwan","institution_ids":["https://openalex.org/I91807558"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5103419215","display_name":"Chun\u2010Lung Hsu","orcid":null},"institutions":[{"id":"https://openalex.org/I142066694","display_name":"ITRI International","ror":"https://ror.org/04wwsbd59","country_code":"US","type":"facility","lineage":["https://openalex.org/I142066694"]},{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW","US"],"is_corresponding":false,"raw_author_name":"Chun-Lung Hsu","raw_affiliation_strings":["Information and Communication Research Laboratories, Industrial Technology Research Institute, Taiwan","[Information and Communication Research Laboratories, Industrial Technology Research Institute, Taiwan]"],"affiliations":[{"raw_affiliation_string":"Information and Communication Research Laboratories, Industrial Technology Research Institute, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"[Information and Communication Research Laboratories, Industrial Technology Research Institute, Taiwan]","institution_ids":["https://openalex.org/I142066694"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5089981651"],"corresponding_institution_ids":["https://openalex.org/I91807558"],"apc_list":null,"apc_paid":null,"fwci":0.83539443,"has_fulltext":false,"cited_by_count":14,"citation_normalized_percentile":{"value":0.79335688,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"520","last_page":"525"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9958000183105469,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9944999814033508,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/overhead","display_name":"Overhead (engineering)","score":0.6177099347114563},{"id":"https://openalex.org/keywords/built-in-self-test","display_name":"Built-in self-test","score":0.6145955324172974},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5846746563911438},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.5409785509109497},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5361089110374451},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.5227668285369873},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.49326246976852417},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.38440561294555664},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.3255994915962219},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.22761651873588562}],"concepts":[{"id":"https://openalex.org/C2779960059","wikidata":"https://www.wikidata.org/wiki/Q7113681","display_name":"Overhead (engineering)","level":2,"score":0.6177099347114563},{"id":"https://openalex.org/C2780980493","wikidata":"https://www.wikidata.org/wiki/Q181142","display_name":"Built-in self-test","level":2,"score":0.6145955324172974},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5846746563911438},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5409785509109497},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5361089110374451},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.5227668285369873},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.49326246976852417},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.38440561294555664},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.3255994915962219},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22761651873588562},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/aspdac.2015.7059059","is_oa":false,"landing_page_url":"https://doi.org/10.1109/aspdac.2015.7059059","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"The 20th Asia and South Pacific Design Automation Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W181729074","https://openalex.org/W1967196629","https://openalex.org/W1972749955","https://openalex.org/W1981022355","https://openalex.org/W2014515940","https://openalex.org/W2094915857","https://openalex.org/W2121926956","https://openalex.org/W2124268206","https://openalex.org/W2150113875","https://openalex.org/W2150153665","https://openalex.org/W2159112907","https://openalex.org/W4242674290","https://openalex.org/W6643686623"],"related_works":["https://openalex.org/W2016970881","https://openalex.org/W1990828594","https://openalex.org/W2333804548","https://openalex.org/W3093450488","https://openalex.org/W2027159884","https://openalex.org/W2016589506","https://openalex.org/W3163301441","https://openalex.org/W2904708802","https://openalex.org/W1522190160","https://openalex.org/W2150113875"],"abstract_inverted_index":{"TSV-based":[0],"3D-IC":[1,39],"design":[2],"can":[3,43,74,90,103],"reduce":[4],"the":[5,20,45,51,57,63,67,99],"connection":[6],"length":[7],"of":[8,15,22,30,48],"stacked":[9,121],"ICs":[10,24],"and":[11,72],"enhance":[12],"I/O":[13],"bandwidth":[14],"heterogeneous":[16],"integrated":[17],"circuits.":[18],"However":[19],"testing":[21,89],"3D":[23],"is":[25],"more":[26],"complicated":[27],"than":[28],"that":[29,42,98],"2D":[31],"ICs.":[32],"This":[33],"paper":[34],"presents":[35],"an":[36],"efficient":[37],"on-chip":[38,88],"test":[40,46,59,82,101,109],"framework":[41,102],"embed":[44],"procedure":[47],"TSVs":[49,73],"into":[50],"memory":[52,64],"BIST":[53,65],"process.":[54],"By":[55],"using":[56],"same":[58],"patterns":[60],"generated":[61],"from":[62],"mechanism,":[66],"faults":[68],"in":[69,108],"both":[70],"memories":[71],"be":[75,92],"detected":[76],"simultaneously":[77],"without":[78],"extra":[79],"time":[80,110],"to":[81],"TSVs.":[83],"The":[84],"area":[85,115],"overhead":[86,116],"for":[87,118],"also":[91],"reduced":[93],"significantly.":[94],"Experimental":[95],"results":[96],"show":[97],"proposed":[100],"gain":[104],"a":[105,119],"good":[106],"performance":[107],"reduction":[111],"with":[112],"very":[113],"low":[114],"penalty":[117],"memory-logic":[120],"IC.":[122]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":3},{"year":2022,"cited_by_count":1},{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":2},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}