{"id":"https://openalex.org/W1985776139","doi":"https://doi.org/10.1109/aspdac.2014.6742870","title":"3DCoB: A new design approach for Monolithic 3D Integrated circuits","display_name":"3DCoB: A new design approach for Monolithic 3D Integrated circuits","publication_year":2014,"publication_date":"2014-01-01","ids":{"openalex":"https://openalex.org/W1985776139","doi":"https://doi.org/10.1109/aspdac.2014.6742870","mag":"1985776139"},"language":"en","primary_location":{"id":"doi:10.1109/aspdac.2014.6742870","is_oa":false,"landing_page_url":"https://doi.org/10.1109/aspdac.2014.6742870","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 19th Asia and South Pacific Design Automation Conference (ASP-DAC)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111502478","display_name":"Hossam Sarhan","orcid":null},"institutions":[{"id":"https://openalex.org/I106785703","display_name":"Institut polytechnique de Grenoble","ror":"https://ror.org/05sbt2524","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Hossam Sarhan","raw_affiliation_strings":["CEA-LETI Minatec Campus, Grenoble, France","CEA-LETI, Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CEA-LETI Minatec Campus, Grenoble, France","institution_ids":["https://openalex.org/I106785703","https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210150049","https://openalex.org/I899635006"]},{"raw_affiliation_string":"CEA-LETI, Grenoble, France","institution_ids":["https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210150049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037060249","display_name":"S\u00e9bastien Thuries","orcid":null},"institutions":[{"id":"https://openalex.org/I106785703","display_name":"Institut polytechnique de Grenoble","ror":"https://ror.org/05sbt2524","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Sebastien Thuries","raw_affiliation_strings":["CEA-LETI Minatec Campus, Grenoble, France","CEA-LETI, Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CEA-LETI Minatec Campus, Grenoble, France","institution_ids":["https://openalex.org/I106785703","https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210150049","https://openalex.org/I899635006"]},{"raw_affiliation_string":"CEA-LETI, Grenoble, France","institution_ids":["https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210150049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073233302","display_name":"Olivier Billoint","orcid":null},"institutions":[{"id":"https://openalex.org/I106785703","display_name":"Institut polytechnique de Grenoble","ror":"https://ror.org/05sbt2524","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Olivier Billoint","raw_affiliation_strings":["CEA-LETI Minatec Campus, Grenoble, France","CEA-LETI, Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CEA-LETI Minatec Campus, Grenoble, France","institution_ids":["https://openalex.org/I106785703","https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210150049","https://openalex.org/I899635006"]},{"raw_affiliation_string":"CEA-LETI, Grenoble, France","institution_ids":["https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210150049"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5112314416","display_name":"Fabien Clermidy","orcid":null},"institutions":[{"id":"https://openalex.org/I106785703","display_name":"Institut polytechnique de Grenoble","ror":"https://ror.org/05sbt2524","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Fabien Clermidy","raw_affiliation_strings":["CEA-LETI Minatec Campus, Grenoble, France","CEA-LETI, Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CEA-LETI Minatec Campus, Grenoble, France","institution_ids":["https://openalex.org/I106785703","https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210150049","https://openalex.org/I899635006"]},{"raw_affiliation_string":"CEA-LETI, Grenoble, France","institution_ids":["https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210150049"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"79","last_page":"84"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.993399977684021,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5656924247741699},{"id":"https://openalex.org/keywords/physical-design","display_name":"Physical design","score":0.4946844279766083},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4925692677497864},{"id":"https://openalex.org/keywords/integrated-circuit-design","display_name":"Integrated circuit design","score":0.47381630539894104},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.44986724853515625},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.3889520764350891},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.38602858781814575},{"id":"https://openalex.org/keywords/circuit-design","display_name":"Circuit design","score":0.3648800849914551},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2251441776752472},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.22012335062026978},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.21209844946861267}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5656924247741699},{"id":"https://openalex.org/C188817802","wikidata":"https://www.wikidata.org/wiki/Q13426855","display_name":"Physical design","level":3,"score":0.4946844279766083},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4925692677497864},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.47381630539894104},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.44986724853515625},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.3889520764350891},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.38602858781814575},{"id":"https://openalex.org/C190560348","wikidata":"https://www.wikidata.org/wiki/Q3245116","display_name":"Circuit design","level":2,"score":0.3648800849914551},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2251441776752472},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.22012335062026978},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.21209844946861267},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/aspdac.2014.6742870","is_oa":false,"landing_page_url":"https://doi.org/10.1109/aspdac.2014.6742870","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 19th Asia and South Pacific Design Automation Conference (ASP-DAC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.4099999964237213}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":16,"referenced_works":["https://openalex.org/W1751600266","https://openalex.org/W1993632150","https://openalex.org/W2001045118","https://openalex.org/W2015183175","https://openalex.org/W2027942484","https://openalex.org/W2046574526","https://openalex.org/W2089979174","https://openalex.org/W2097069052","https://openalex.org/W2116984716","https://openalex.org/W2132321891","https://openalex.org/W2141248142","https://openalex.org/W2144149750","https://openalex.org/W2160007566","https://openalex.org/W4246766117","https://openalex.org/W4254609597","https://openalex.org/W6637775719"],"related_works":["https://openalex.org/W4389672975","https://openalex.org/W1553422968","https://openalex.org/W2078506771","https://openalex.org/W2007385019","https://openalex.org/W1955236059","https://openalex.org/W1965232212","https://openalex.org/W2109207559","https://openalex.org/W1987513258","https://openalex.org/W2168458994","https://openalex.org/W1974416117"],"abstract_inverted_index":{"3D":[0,29],"Monolithic":[1],"Integration":[2],"(3DMI)":[3],"technology":[4],"provides":[5,41],"very":[6],"high":[7],"dense":[8],"vertical":[9],"interconnects":[10],"with":[11,49],"low":[12],"parasitics.":[13],"Previous":[14],"3DMI":[15],"design":[16,35],"approaches":[17],"provide":[18],"either":[19],"cell-on-cell":[20],"or":[21],"transistor-on-transistor":[22],"integration.":[23],"In":[24],"this":[25],"paper":[26],"we":[27],"present":[28],"Cell-on-Buffer":[30],"(3DCoB)":[31],"as":[32],"a":[33,42,59],"novel":[34],"approach":[36,40,57],"for":[37],"3DMI.":[38],"Our":[39],"fully":[43],"compatible":[44],"sign-off":[45,68],"physical":[46],"implementation":[47],"flow":[48],"the":[50,76],"conventional":[51],"2D":[52,78],"tools.":[53],"We":[54],"implement":[55],"our":[56],"on":[58],"set":[60],"of":[61],"benchmark":[62],"circuits":[63],"using":[64],"28nm-FDSOI":[65],"technology.":[66],"The":[67],"performance":[69],"results":[70],"show":[71],"35%":[72],"improvement":[73],"compared":[74],"to":[75],"same":[77],"design.":[79]},"counts_by_year":[{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2015,"cited_by_count":3},{"year":2014,"cited_by_count":2}],"updated_date":"2026-07-22T07:51:19.307946","created_date":"2025-10-10T00:00:00"}