{"id":"https://openalex.org/W1988354418","doi":"https://doi.org/10.1109/aspdac.2012.6165055","title":"Design for manufacturability and reliability for TSV-based 3D ICs","display_name":"Design for manufacturability and reliability for TSV-based 3D ICs","publication_year":2012,"publication_date":"2012-01-01","ids":{"openalex":"https://openalex.org/W1988354418","doi":"https://doi.org/10.1109/aspdac.2012.6165055","mag":"1988354418"},"language":"en","primary_location":{"id":"doi:10.1109/aspdac.2012.6165055","is_oa":false,"landing_page_url":"https://doi.org/10.1109/aspdac.2012.6165055","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"17th Asia and South Pacific Design Automation Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5011883763","display_name":"David Z. Pan","orcid":"https://orcid.org/0000-0002-5705-2501"},"institutions":[{"id":"https://openalex.org/I86519309","display_name":"The University of Texas at Austin","ror":"https://ror.org/00hj54h04","country_code":"US","type":"education","lineage":["https://openalex.org/I86519309"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"David Z. Pan","raw_affiliation_strings":["Department of ECE, University of Texas, Austin, Austin, TX, USA","Dept. of ECE, Univ. of Texas at Austin, USA"],"affiliations":[{"raw_affiliation_string":"Department of ECE, University of Texas, Austin, Austin, TX, USA","institution_ids":["https://openalex.org/I86519309"]},{"raw_affiliation_string":"Dept. of ECE, Univ. of Texas at Austin, USA","institution_ids":["https://openalex.org/I86519309"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052950521","display_name":"Sung Kyu Lim","orcid":"https://orcid.org/0000-0002-2267-5282"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sung Kyu Lim","raw_affiliation_strings":["School of ECE, Georgia Institute of Technology, Atlanta, GA, USA","School of ECE, Georgia Institute of Technology, Atlanta, USA"],"affiliations":[{"raw_affiliation_string":"School of ECE, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"School of ECE, Georgia Institute of Technology, Atlanta, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067424365","display_name":"Krit Athikulwongse","orcid":"https://orcid.org/0000-0002-4092-8634"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Krit Athikulwongse","raw_affiliation_strings":["School of ECE, Georgia Institute of Technology, Atlanta, GA, USA","School of ECE, Georgia Institute of Technology, Atlanta, USA"],"affiliations":[{"raw_affiliation_string":"School of ECE, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"School of ECE, Georgia Institute of Technology, Atlanta, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036856363","display_name":"Moongon Jung","orcid":"https://orcid.org/0000-0003-1059-2823"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Moongon Jung","raw_affiliation_strings":["School of ECE, Georgia Institute of Technology, Atlanta, GA, USA","School of ECE, Georgia Institute of Technology, Atlanta, USA"],"affiliations":[{"raw_affiliation_string":"School of ECE, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"School of ECE, Georgia Institute of Technology, Atlanta, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035972401","display_name":"Joydeep Mitra","orcid":"https://orcid.org/0000-0001-9287-0983"},"institutions":[{"id":"https://openalex.org/I86519309","display_name":"The University of Texas at Austin","ror":"https://ror.org/00hj54h04","country_code":"US","type":"education","lineage":["https://openalex.org/I86519309"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Joydeep Mitra","raw_affiliation_strings":["Department of ECE, University of Texas, Austin, Austin, TX, USA","Dept. of ECE, Univ. of Texas at Austin, USA"],"affiliations":[{"raw_affiliation_string":"Department of ECE, University of Texas, Austin, Austin, TX, USA","institution_ids":["https://openalex.org/I86519309"]},{"raw_affiliation_string":"Dept. of ECE, Univ. of Texas at Austin, USA","institution_ids":["https://openalex.org/I86519309"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108395667","display_name":"Jiwoo Pak","orcid":null},"institutions":[{"id":"https://openalex.org/I86519309","display_name":"The University of Texas at Austin","ror":"https://ror.org/00hj54h04","country_code":"US","type":"education","lineage":["https://openalex.org/I86519309"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jiwoo Pak","raw_affiliation_strings":["Department of ECE, University of Texas, Austin, Austin, TX, USA","Dept. of ECE, Univ. of Texas at Austin, USA"],"affiliations":[{"raw_affiliation_string":"Department of ECE, University of Texas, Austin, Austin, TX, USA","institution_ids":["https://openalex.org/I86519309"]},{"raw_affiliation_string":"Dept. of ECE, Univ. of Texas at Austin, USA","institution_ids":["https://openalex.org/I86519309"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012434757","display_name":"Mohit Pathak","orcid":"https://orcid.org/0000-0002-2109-7759"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mohit Pathak","raw_affiliation_strings":["School of ECE, Georgia Institute of Technology, Atlanta, GA, USA","School of ECE, Georgia Institute of Technology, Atlanta, USA"],"affiliations":[{"raw_affiliation_string":"School of ECE, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"School of ECE, Georgia Institute of Technology, Atlanta, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5102460504","display_name":"Jae-Seok Yang","orcid":null},"institutions":[{"id":"https://openalex.org/I86519309","display_name":"The University of Texas at Austin","ror":"https://ror.org/00hj54h04","country_code":"US","type":"education","lineage":["https://openalex.org/I86519309"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jae-seok Yang","raw_affiliation_strings":["Department of ECE, University of Texas, Austin, Austin, TX, USA","Dept. of ECE, Univ. of Texas at Austin, USA"],"affiliations":[{"raw_affiliation_string":"Department of ECE, University of Texas, Austin, Austin, TX, USA","institution_ids":["https://openalex.org/I86519309"]},{"raw_affiliation_string":"Dept. of ECE, Univ. of Texas at Austin, USA","institution_ids":["https://openalex.org/I86519309"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":8,"corresponding_author_ids":["https://openalex.org/A5011883763"],"corresponding_institution_ids":["https://openalex.org/I86519309"],"apc_list":null,"apc_paid":null,"fwci":4.4191,"has_fulltext":false,"cited_by_count":31,"citation_normalized_percentile":{"value":0.94652028,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"750","last_page":"755"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9973999857902527,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/design-for-manufacturability","display_name":"Design for manufacturability","score":0.9404559135437012},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.8170303106307983},{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.7584035396575928},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.6973010301589966},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.6117027401924133},{"id":"https://openalex.org/keywords/integrated-circuit-packaging","display_name":"Integrated circuit packaging","score":0.4613521099090576},{"id":"https://openalex.org/keywords/integrated-circuit-design","display_name":"Integrated circuit design","score":0.459806352853775},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.45139947533607483},{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.4439038634300232},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.43688949942588806},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4315921664237976},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.33342671394348145},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.32572221755981445},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3241635262966156},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.27719414234161377},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.2752857208251953},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.2080601155757904},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.13196024298667908},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.09978082776069641}],"concepts":[{"id":"https://openalex.org/C62064638","wikidata":"https://www.wikidata.org/wiki/Q553878","display_name":"Design for manufacturability","level":2,"score":0.9404559135437012},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.8170303106307983},{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.7584035396575928},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6973010301589966},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.6117027401924133},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.4613521099090576},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.459806352853775},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.45139947533607483},{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.4439038634300232},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.43688949942588806},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4315921664237976},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.33342671394348145},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.32572221755981445},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3241635262966156},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.27719414234161377},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2752857208251953},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.2080601155757904},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.13196024298667908},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.09978082776069641},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/aspdac.2012.6165055","is_oa":false,"landing_page_url":"https://doi.org/10.1109/aspdac.2012.6165055","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"17th Asia and South Pacific Design Automation Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.6499999761581421}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":37,"referenced_works":["https://openalex.org/W1971124352","https://openalex.org/W2013376612","https://openalex.org/W2015941345","https://openalex.org/W2031050377","https://openalex.org/W2043843580","https://openalex.org/W2060637631","https://openalex.org/W2072007551","https://openalex.org/W2082029044","https://openalex.org/W2086481541","https://openalex.org/W2091658290","https://openalex.org/W2103567833","https://openalex.org/W2105154156","https://openalex.org/W2107868198","https://openalex.org/W2118456109","https://openalex.org/W2122915341","https://openalex.org/W2124955733","https://openalex.org/W2126084661","https://openalex.org/W2131875329","https://openalex.org/W2135488595","https://openalex.org/W2138798136","https://openalex.org/W2143584153","https://openalex.org/W2143926454","https://openalex.org/W2147960451","https://openalex.org/W2150620980","https://openalex.org/W2154869256","https://openalex.org/W3140034169","https://openalex.org/W3142235025","https://openalex.org/W3146255990","https://openalex.org/W3148592310","https://openalex.org/W3150374759","https://openalex.org/W4230375614","https://openalex.org/W4245053922","https://openalex.org/W6654486189","https://openalex.org/W6665627939","https://openalex.org/W6677766680","https://openalex.org/W6681121120","https://openalex.org/W6681584141"],"related_works":["https://openalex.org/W2011182927","https://openalex.org/W2310189477","https://openalex.org/W2543304869","https://openalex.org/W1990828594","https://openalex.org/W2019002696","https://openalex.org/W2072269247","https://openalex.org/W2047315796","https://openalex.org/W2010609468","https://openalex.org/W2136838099","https://openalex.org/W2333804548"],"abstract_inverted_index":{"The":[0],"3D":[1,32,41,100,122],"IC":[2,33,42,101,123],"integration":[3],"using":[4],"through-silicon-vias":[5],"(TSV)":[6],"has":[7],"gained":[8],"tremendous":[9],"momentum":[10],"recently":[11],"for":[12,31,112,120],"industry":[13],"adoption.":[14],"However,":[15],"as":[16,65,125,127],"TSV":[17],"involves":[18],"disruptive":[19],"manufacturing":[20],"technologies,":[21],"new":[22,82],"modeling":[23,87],"and":[24,35,77,88,114,117],"design":[25,90,111],"techniques":[26],"need":[27,92],"to":[28,60,81,93,96],"be":[29,94],"developed":[30,95],"manufacturability":[34,113],"reliability.":[36],"In":[37,103],"particular,":[38],"TSVs":[39],"in":[40,53],"may":[43],"cause":[44],"significant":[45],"thermal":[46],"mechanical":[47,61],"stress,":[48],"which":[49],"not":[50],"only":[51],"results":[52],"systematic":[54],"mobility/performance":[55],"variations,":[56],"but":[57],"also":[58],"leads":[59],"reliability":[62,115],"concerns":[63],"such":[64],"interfacial":[66],"cracking.":[67],"Meanwhile,":[68],"the":[69],"huge":[70],"dimensional":[71],"gaps":[72],"between":[73],"TSV,":[74],"on-chip":[75],"wires,":[76],"bonding/packaging":[78],"all":[79],"lead":[80],"electromigration":[83],"concerns.":[84],"Thus":[85],"full-chip/package":[86],"physical":[89],"tools":[91],"achieve":[97],"more":[98],"reliable":[99],"integration.":[102],"this":[104],"paper,":[105],"we":[106],"will":[107],"discuss":[108],"some":[109],"key":[110],"challenges":[116],"possible":[118],"solutions":[119],"TSV-based":[121],"integration,":[124],"well":[126],"future":[128],"research":[129],"directions.":[130]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":5},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":7},{"year":2014,"cited_by_count":8},{"year":2013,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}