{"id":"https://openalex.org/W2025304056","doi":"https://doi.org/10.1109/aspdac.2012.6165047","title":"Hybrid lithography optimization with E-Beam and immersion processes for 16nm 1D gridded design","display_name":"Hybrid lithography optimization with E-Beam and immersion processes for 16nm 1D gridded design","publication_year":2012,"publication_date":"2012-01-01","ids":{"openalex":"https://openalex.org/W2025304056","doi":"https://doi.org/10.1109/aspdac.2012.6165047","mag":"2025304056"},"language":"en","primary_location":{"id":"doi:10.1109/aspdac.2012.6165047","is_oa":false,"landing_page_url":"https://doi.org/10.1109/aspdac.2012.6165047","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"17th Asia and South Pacific Design Automation Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5069931478","display_name":"Yuelin Du","orcid":null},"institutions":[{"id":"https://openalex.org/I157725225","display_name":"University of Illinois Urbana-Champaign","ror":"https://ror.org/047426m28","country_code":"US","type":"education","lineage":["https://openalex.org/I157725225"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Yuelin Du","raw_affiliation_strings":["Department of ECE, University of Illinois, Urbana-Champaign, USA","Department of ECE, Univ. of Illinois at Urbana-Champaign, USA"],"affiliations":[{"raw_affiliation_string":"Department of ECE, University of Illinois, Urbana-Champaign, USA","institution_ids":["https://openalex.org/I157725225"]},{"raw_affiliation_string":"Department of ECE, Univ. of Illinois at Urbana-Champaign, USA","institution_ids":["https://openalex.org/I157725225"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100461085","display_name":"Hongbo Zhang","orcid":"https://orcid.org/0000-0001-7259-5419"},"institutions":[{"id":"https://openalex.org/I157725225","display_name":"University of Illinois Urbana-Champaign","ror":"https://ror.org/047426m28","country_code":"US","type":"education","lineage":["https://openalex.org/I157725225"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Hongbo Zhang","raw_affiliation_strings":["Department of ECE, University of Illinois, Urbana-Champaign, USA","Department of ECE, Univ. of Illinois at Urbana-Champaign, USA"],"affiliations":[{"raw_affiliation_string":"Department of ECE, University of Illinois, Urbana-Champaign, USA","institution_ids":["https://openalex.org/I157725225"]},{"raw_affiliation_string":"Department of ECE, Univ. of Illinois at Urbana-Champaign, USA","institution_ids":["https://openalex.org/I157725225"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5053378706","display_name":"Martin D. F. Wong","orcid":"https://orcid.org/0000-0001-8274-9688"},"institutions":[{"id":"https://openalex.org/I157725225","display_name":"University of Illinois Urbana-Champaign","ror":"https://ror.org/047426m28","country_code":"US","type":"education","lineage":["https://openalex.org/I157725225"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Martin D.F. Wong","raw_affiliation_strings":["Department of ECE, University of Illinois, Urbana-Champaign, USA","Department of ECE, Univ. of Illinois at Urbana-Champaign, USA"],"affiliations":[{"raw_affiliation_string":"Department of ECE, University of Illinois, Urbana-Champaign, USA","institution_ids":["https://openalex.org/I157725225"]},{"raw_affiliation_string":"Department of ECE, Univ. of Illinois at Urbana-Champaign, USA","institution_ids":["https://openalex.org/I157725225"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5061862022","display_name":"Kai-Yuan Chao","orcid":"https://orcid.org/0009-0006-1057-1319"},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Kai-Yuan Chao","raw_affiliation_strings":["Intel Corporation, USA","Intel Corp., USA#TAB#"],"affiliations":[{"raw_affiliation_string":"Intel Corporation, USA","institution_ids":["https://openalex.org/I1343180700"]},{"raw_affiliation_string":"Intel Corp., USA#TAB#","institution_ids":["https://openalex.org/I1343180700"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5069931478"],"corresponding_institution_ids":["https://openalex.org/I157725225"],"apc_list":null,"apc_paid":null,"fwci":6.6286,"has_fulltext":false,"cited_by_count":54,"citation_normalized_percentile":{"value":0.97058765,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":100},"biblio":{"volume":null,"issue":null,"first_page":"707","last_page":"712"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9972000122070312,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.9962000250816345,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.7844369411468506},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6734947562217712},{"id":"https://openalex.org/keywords/immersion-lithography","display_name":"Immersion lithography","score":0.6160526275634766},{"id":"https://openalex.org/keywords/solver","display_name":"Solver","score":0.5483345985412598},{"id":"https://openalex.org/keywords/electron-beam-lithography","display_name":"Electron-beam lithography","score":0.5311188697814941},{"id":"https://openalex.org/keywords/throughput","display_name":"Throughput","score":0.5231805443763733},{"id":"https://openalex.org/keywords/scaling","display_name":"Scaling","score":0.5189680457115173},{"id":"https://openalex.org/keywords/optical-proximity-correction","display_name":"Optical proximity correction","score":0.4943883419036865},{"id":"https://openalex.org/keywords/resist","display_name":"Resist","score":0.3648604154586792},{"id":"https://openalex.org/keywords/computational-science","display_name":"Computational science","score":0.34323614835739136},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3345763087272644},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.25929760932922363},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.17286166548728943},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.16669365763664246},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.15608227252960205},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.12212160229682922},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.0869286060333252}],"concepts":[{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.7844369411468506},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6734947562217712},{"id":"https://openalex.org/C94263209","wikidata":"https://www.wikidata.org/wiki/Q1076175","display_name":"Immersion lithography","level":4,"score":0.6160526275634766},{"id":"https://openalex.org/C2778770139","wikidata":"https://www.wikidata.org/wiki/Q1966904","display_name":"Solver","level":2,"score":0.5483345985412598},{"id":"https://openalex.org/C200274948","wikidata":"https://www.wikidata.org/wiki/Q256845","display_name":"Electron-beam lithography","level":4,"score":0.5311188697814941},{"id":"https://openalex.org/C157764524","wikidata":"https://www.wikidata.org/wiki/Q1383412","display_name":"Throughput","level":3,"score":0.5231805443763733},{"id":"https://openalex.org/C99844830","wikidata":"https://www.wikidata.org/wiki/Q102441924","display_name":"Scaling","level":2,"score":0.5189680457115173},{"id":"https://openalex.org/C78371743","wikidata":"https://www.wikidata.org/wiki/Q1672829","display_name":"Optical proximity correction","level":3,"score":0.4943883419036865},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.3648604154586792},{"id":"https://openalex.org/C459310","wikidata":"https://www.wikidata.org/wiki/Q117801","display_name":"Computational science","level":1,"score":0.34323614835739136},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3345763087272644},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.25929760932922363},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.17286166548728943},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.16669365763664246},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.15608227252960205},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.12212160229682922},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0869286060333252},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/aspdac.2012.6165047","is_oa":false,"landing_page_url":"https://doi.org/10.1109/aspdac.2012.6165047","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"17th Asia and South Pacific Design Automation Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.6100000143051147}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W1975356894","https://openalex.org/W1983069902","https://openalex.org/W1995812847","https://openalex.org/W2012552926","https://openalex.org/W2016669084","https://openalex.org/W2017784955","https://openalex.org/W2058788538","https://openalex.org/W2087543316","https://openalex.org/W2091275358","https://openalex.org/W2093529248","https://openalex.org/W2153778369","https://openalex.org/W3144063603","https://openalex.org/W6653931798"],"related_works":["https://openalex.org/W4226323632","https://openalex.org/W2085093259","https://openalex.org/W2015326664","https://openalex.org/W4321454142","https://openalex.org/W2376495194","https://openalex.org/W4307818291","https://openalex.org/W2802459864","https://openalex.org/W2050847819","https://openalex.org/W2064613305","https://openalex.org/W1982361390"],"abstract_inverted_index":{"Since":[0],"some":[1],"of":[2,42,50],"major":[3],"IC":[4],"industry":[5],"participants":[6],"are":[7],"moving":[8],"to":[9,16,19,23,68,97,101,114,155],"the":[10,25,40,59,116,129,134,140,157,164,170,178,188],"highly":[11],"regular":[12],"1D":[13],"gridded":[14],"designs":[15],"enable":[17],"scaling":[18],"sub-20nm":[20],"nodes,":[21],"how":[22],"manufacture":[24],"randomly":[26],"distributed":[27],"cuts":[28,100],"with":[29,82,106],"reasonable":[30],"throughput":[31,165],"and":[32,79,86,149],"process":[33,180],"variation":[34],"becomes":[35],"a":[36,94,144,152],"big":[37],"challenge.":[38],"With":[39],"help":[41],"hybrid":[43,80],"lithography,":[44],"people":[45],"can":[46,64,181],"apply":[47],"different":[48,62],"types":[49],"processes":[51,105],"for":[52,175],"one":[53],"single":[54],"layer":[55],"manufacturing":[56],"such":[57],"that":[58,163],"advantages":[60],"from":[61,133],"technologies":[63],"be":[65,182],"combined":[66],"together":[67],"further":[69],"benefit":[70],"manufacturing.":[71],"In":[72],"this":[73],"paper,":[74],"targeting":[75],"cut":[76,110,171],"printing":[77],"difficulties":[78],"lithography":[81],"electron":[83],"beam":[84],"(E-Beam)":[85],"193":[87],"nm":[88],"immersion":[89],"(193i)":[90],"processes,":[91],"we":[92,123,138],"propose":[93],"novel":[95],"algorithm":[96,126],"optimally":[98],"assign":[99],"193i":[102],"or":[103],"E-Beam":[104],"proper":[107],"modifications":[108],"on":[109,128],"distribution,":[111],"in":[112],"order":[113],"maximize":[115],"overall":[117],"throughput.":[118],"To":[119],"validate":[120],"our":[121,125],"method,":[122],"construct":[124],"based":[127],"forbidden":[130],"patterns":[131],"obtained":[132],"optical":[135],"simulation;":[136],"then":[137],"formulate":[139],"redistribution":[141],"problem":[142,148],"into":[143],"well":[145],"defined":[146],"ILP":[147],"finally":[150],"call":[151],"reliable":[153],"solver":[154],"solve":[156],"whole":[158],"problem.":[159],"Experimental":[160],"results":[161],"show":[162],"is":[166],"dramatically":[167],"improved":[168],"by":[169],"redistribution.":[172],"Besides":[173],"that,":[174],"sparser":[176],"layers,":[177],"EBL":[179],"totaly":[183],"saved,":[184],"which":[185],"largely":[186],"reduces":[187],"fabrication":[189],"cost.":[190]},"counts_by_year":[{"year":2021,"cited_by_count":2},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":6},{"year":2017,"cited_by_count":10},{"year":2016,"cited_by_count":8},{"year":2015,"cited_by_count":13},{"year":2014,"cited_by_count":6},{"year":2013,"cited_by_count":5},{"year":2012,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}