{"id":"https://openalex.org/W1993113865","doi":"https://doi.org/10.1109/aspdac.2012.6164995","title":"Thermal-aware power network design for IR drop reduction in 3D ICs","display_name":"Thermal-aware power network design for IR drop reduction in 3D ICs","publication_year":2012,"publication_date":"2012-01-01","ids":{"openalex":"https://openalex.org/W1993113865","doi":"https://doi.org/10.1109/aspdac.2012.6164995","mag":"1993113865"},"language":"en","primary_location":{"id":"doi:10.1109/aspdac.2012.6164995","is_oa":false,"landing_page_url":"https://doi.org/10.1109/aspdac.2012.6164995","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"17th Asia and South Pacific Design Automation Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5007655349","display_name":"Zuowei Li","orcid":null},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Zuowei Li","raw_affiliation_strings":["Department of Computer Science and Technology, Tsinghua National Laboratory for Information Science and Technology, Beijing, China","Tsinghua National Laboratory for Information Science and Technology, Department of Computer Science and Technology, University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"Department of Computer Science and Technology, Tsinghua National Laboratory for Information Science and Technology, Beijing, China","institution_ids":["https://openalex.org/I99065089"]},{"raw_affiliation_string":"Tsinghua National Laboratory for Information Science and Technology, Department of Computer Science and Technology, University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102025379","display_name":"Yuchun Ma","orcid":"https://orcid.org/0000-0003-3160-6681"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuchun Ma","raw_affiliation_strings":["Department of Computer Science and Technology, Tsinghua National Laboratory for Information Science and Technology, Beijing, China","Tsinghua National Laboratory for Information Science and Technology, Department of Computer Science and Technology, University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"Department of Computer Science and Technology, Tsinghua National Laboratory for Information Science and Technology, Beijing, China","institution_ids":["https://openalex.org/I99065089"]},{"raw_affiliation_string":"Tsinghua National Laboratory for Information Science and Technology, Department of Computer Science and Technology, University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101929509","display_name":"Qiang Zhou","orcid":"https://orcid.org/0000-0003-1348-8861"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Qiang Zhou","raw_affiliation_strings":["Department of Computer Science and Technology, Tsinghua National Laboratory for Information Science and Technology, Beijing, China","Tsinghua National Laboratory for Information Science and Technology, Department of Computer Science and Technology, University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"Department of Computer Science and Technology, Tsinghua National Laboratory for Information Science and Technology, Beijing, China","institution_ids":["https://openalex.org/I99065089"]},{"raw_affiliation_string":"Tsinghua National Laboratory for Information Science and Technology, Department of Computer Science and Technology, University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100894724","display_name":"Yici Cai","orcid":null},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yici Cai","raw_affiliation_strings":["Department of Computer Science and Technology, Tsinghua National Laboratory for Information Science and Technology, Beijing, China","Tsinghua National Laboratory for Information Science and Technology, Department of Computer Science and Technology, University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"Department of Computer Science and Technology, Tsinghua National Laboratory for Information Science and Technology, Beijing, China","institution_ids":["https://openalex.org/I99065089"]},{"raw_affiliation_string":"Tsinghua National Laboratory for Information Science and Technology, Department of Computer Science and Technology, University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100445061","display_name":"Yu Wang","orcid":"https://orcid.org/0000-0001-6108-5157"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yu Wang","raw_affiliation_strings":["Department of Computer Science and Technology, Tsinghua National Laboratory for Information Science and Technology, Beijing, China","Tsinghua National Laboratory for Information Science and Technology, Department of Computer Science and Technology, University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"Department of Computer Science and Technology, Tsinghua National Laboratory for Information Science and Technology, Beijing, China","institution_ids":["https://openalex.org/I99065089"]},{"raw_affiliation_string":"Tsinghua National Laboratory for Information Science and Technology, Department of Computer Science and Technology, University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108223601","display_name":"Tingting Huang","orcid":null},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]},{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN","TW"],"is_corresponding":false,"raw_author_name":"Tingting Huang","raw_affiliation_strings":["National Tsinghua University, Taiwan","National Tsinghua Univ., Taiwan, China"],"affiliations":[{"raw_affiliation_string":"National Tsinghua University, Taiwan","institution_ids":["https://openalex.org/I25846049"]},{"raw_affiliation_string":"National Tsinghua Univ., Taiwan, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100385336","display_name":"Yuan Xie","orcid":"https://orcid.org/0000-0003-2093-1788"},"institutions":[{"id":"https://openalex.org/I130769515","display_name":"Pennsylvania State University","ror":"https://ror.org/04p491231","country_code":"US","type":"education","lineage":["https://openalex.org/I130769515"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yuan Xie","raw_affiliation_strings":["Pennsylvania State University, USA","Pennsylvania State University \u2013 USA"],"affiliations":[{"raw_affiliation_string":"Pennsylvania State University, USA","institution_ids":["https://openalex.org/I130769515"]},{"raw_affiliation_string":"Pennsylvania State University \u2013 USA","institution_ids":["https://openalex.org/I130769515"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5007655349"],"corresponding_institution_ids":["https://openalex.org/I99065089"],"apc_list":null,"apc_paid":null,"fwci":2.946,"has_fulltext":false,"cited_by_count":18,"citation_normalized_percentile":{"value":0.91239118,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"47","last_page":"52"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9940999746322632,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/power-network-design","display_name":"Power network design","score":0.7067471742630005},{"id":"https://openalex.org/keywords/thermal-resistance","display_name":"Thermal resistance","score":0.6143693923950195},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.5501589775085449},{"id":"https://openalex.org/keywords/network-topology","display_name":"Network topology","score":0.5498948693275452},{"id":"https://openalex.org/keywords/leakage","display_name":"Leakage (economics)","score":0.5478408932685852},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.5212719440460205},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4999840259552002},{"id":"https://openalex.org/keywords/drop","display_name":"Drop (telecommunication)","score":0.4967959225177765},{"id":"https://openalex.org/keywords/topology","display_name":"Topology (electrical circuits)","score":0.49167782068252563},{"id":"https://openalex.org/keywords/power-grid","display_name":"Power grid","score":0.4794667959213257},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4626404345035553},{"id":"https://openalex.org/keywords/voltage-drop","display_name":"Voltage drop","score":0.43097975850105286},{"id":"https://openalex.org/keywords/grid","display_name":"Grid","score":0.4274221658706665},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.4248756766319275},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3949076533317566},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3742672801017761},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.36405637860298157},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2800186276435852},{"id":"https://openalex.org/keywords/current","display_name":"Current (fluid)","score":0.24686458706855774},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.11465251445770264},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.09249675273895264},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.09198170900344849},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.0852448046207428}],"concepts":[{"id":"https://openalex.org/C164565468","wikidata":"https://www.wikidata.org/wiki/Q7236535","display_name":"Power network design","level":3,"score":0.7067471742630005},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.6143693923950195},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5501589775085449},{"id":"https://openalex.org/C199845137","wikidata":"https://www.wikidata.org/wiki/Q145490","display_name":"Network topology","level":2,"score":0.5498948693275452},{"id":"https://openalex.org/C2777042071","wikidata":"https://www.wikidata.org/wiki/Q6509304","display_name":"Leakage (economics)","level":2,"score":0.5478408932685852},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.5212719440460205},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4999840259552002},{"id":"https://openalex.org/C2781345722","wikidata":"https://www.wikidata.org/wiki/Q5308388","display_name":"Drop (telecommunication)","level":2,"score":0.4967959225177765},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.49167782068252563},{"id":"https://openalex.org/C2983254600","wikidata":"https://www.wikidata.org/wiki/Q1096907","display_name":"Power grid","level":3,"score":0.4794667959213257},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4626404345035553},{"id":"https://openalex.org/C82178898","wikidata":"https://www.wikidata.org/wiki/Q166839","display_name":"Voltage drop","level":3,"score":0.43097975850105286},{"id":"https://openalex.org/C187691185","wikidata":"https://www.wikidata.org/wiki/Q2020720","display_name":"Grid","level":2,"score":0.4274221658706665},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.4248756766319275},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3949076533317566},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3742672801017761},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.36405637860298157},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2800186276435852},{"id":"https://openalex.org/C148043351","wikidata":"https://www.wikidata.org/wiki/Q4456944","display_name":"Current (fluid)","level":2,"score":0.24686458706855774},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.11465251445770264},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.09249675273895264},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.09198170900344849},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0852448046207428},{"id":"https://openalex.org/C139719470","wikidata":"https://www.wikidata.org/wiki/Q39680","display_name":"Macroeconomics","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C162324750","wikidata":"https://www.wikidata.org/wiki/Q8134","display_name":"Economics","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/aspdac.2012.6164995","is_oa":false,"landing_page_url":"https://doi.org/10.1109/aspdac.2012.6164995","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"17th Asia and South Pacific Design Automation Conference","raw_type":"proceedings-article"},{"id":"pmh:oai:repository.hkust.edu.hk:1783.1-133738","is_oa":false,"landing_page_url":"http://www.scopus.com/record/display.url?eid=2-s2.0-84859961031&origin=inward","pdf_url":null,"source":{"id":"https://openalex.org/S4306401796","display_name":"Rare & Special e-Zone (The Hong Kong University of Science and Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I200769079","host_organization_name":"Hong Kong University of Science and Technology","host_organization_lineage":["https://openalex.org/I200769079"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Conference paper"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":28,"referenced_works":["https://openalex.org/W1541633348","https://openalex.org/W1596457778","https://openalex.org/W1983067779","https://openalex.org/W1990935421","https://openalex.org/W1993700253","https://openalex.org/W2041644560","https://openalex.org/W2043548604","https://openalex.org/W2060870267","https://openalex.org/W2097913753","https://openalex.org/W2098219569","https://openalex.org/W2100807766","https://openalex.org/W2112696331","https://openalex.org/W2114910421","https://openalex.org/W2118955652","https://openalex.org/W2129664231","https://openalex.org/W2139311958","https://openalex.org/W2148385942","https://openalex.org/W2149033245","https://openalex.org/W2150956258","https://openalex.org/W2151734895","https://openalex.org/W2167067643","https://openalex.org/W2168938583","https://openalex.org/W2331843820","https://openalex.org/W3143608171","https://openalex.org/W3146779744","https://openalex.org/W4232892799","https://openalex.org/W4236454027","https://openalex.org/W4254470553"],"related_works":["https://openalex.org/W2108172432","https://openalex.org/W121910558","https://openalex.org/W2004937362","https://openalex.org/W2140746294","https://openalex.org/W2119232911","https://openalex.org/W1987230547","https://openalex.org/W2146176401","https://openalex.org/W2626423140","https://openalex.org/W2519714880","https://openalex.org/W1972380363"],"abstract_inverted_index":{"Due":[0],"to":[1,40,54,163,168],"the":[2,15,23,26,41,56,63,79,87,97,107,138,154,165,196,203,226,238,254,266],"high":[3,184],"integration":[4],"on":[5,36,67,124,214,253],"vertical":[6],"stacked":[7],"layers,":[8],"power/ground":[9],"network":[10,158],"design":[11],"becomes":[12],"one":[13],"of":[14,78,82,99,140,149,156,205,268],"critical":[16],"challenges":[17],"in":[18,30,92,171,186],"3D":[19,31,187],"IC":[20],"design.":[21],"With":[22],"leakage-thermal":[24],"dependency,":[25],"increasing":[27],"on-chip":[28,64],"temperature":[29,185],"designs":[32],"has":[33],"serious":[34],"impact":[35],"IR":[37,57,219,228,260],"drop":[38,58,220,229,261],"due":[39],"increased":[42,46,179],"wire":[43],"resistance":[44,100,176],"and":[45,102,145,178,199,264],"leakage":[47,103,130,180],"current.":[48],"Power/ground":[49],"(P/G)":[50],"TSVs":[51,84,120,151,167,234],"can":[52,136,192,217,257],"help":[53],"relieve":[55,225],"violation":[59],"by":[60,159,183,221,262,271],"vertically":[61],"connecting":[62],"P/G":[65,88,119,142,150,157,166,169,233,249],"networks":[66],"different":[68],"layers.":[69],"However,":[70],"most":[71],"previous":[72],"work":[73],"only":[74],"fulfills":[75],"a":[76,93,125],"margin":[77],"full":[80,147],"potential":[81],"PG":[83],"planning":[85,121,152,251],"since":[86],"grids":[89,170],"are":[90,235],"restricted":[91],"uniform":[94,141],"topology.":[95,173],"Besides,":[96],"overlook":[98],"variation":[101,177],"current":[104,131,181],"will":[105],"make":[106,146],"results":[108,201],"less":[109],"accurate.":[110],"In":[111],"this":[112],"paper,":[113],"we":[114],"present":[115],"an":[116],"efficient":[117],"thermal-aware":[118],"algorithm":[122],"based":[123,252],"sensitivity":[126,255],"model":[127,256],"with":[128,175],"temperature-dependent":[129],"considered.":[132,243],"The":[133],"proposed":[134],"method":[135],"overcome":[137],"limitation":[139],"grid":[143],"topology":[144],"use":[148],"for":[153],"optimization":[155],"allowing":[160],"short":[161],"wires":[162],"connect":[164],"non-uniform":[172],"Moreover,":[174],"caused":[182],"ICs,":[188],"more":[189,232],"accurate":[190],"result":[191],"be":[193],"obtained.":[194],"Both":[195],"theoretical":[197],"analysis":[198],"experimental":[200],"show":[202,209,246],"efficiency":[204],"our":[206,248],"approach.":[207],"Results":[208,244],"that":[210,247],"neglecting":[211],"thermal":[212,241],"impacts":[213,242],"power":[215],"delivery":[216],"underestimate":[218],"about":[222],"11%.":[223],"To":[224],"severe":[227],"violation,":[230],"51.8%":[231],"needed":[236],"than":[237],"cases":[239],"without":[240],"also":[245],"TSV":[250],"reduce":[258,265],"max":[259],"42.3%":[263],"number":[267],"violated":[269],"nodes":[270],"82.4%.":[272]},"counts_by_year":[{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":3},{"year":2015,"cited_by_count":5},{"year":2014,"cited_by_count":4},{"year":2013,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}