{"id":"https://openalex.org/W3140273112","doi":"https://doi.org/10.1109/aspdac.2011.5722223","title":"Exploration of VLSI CAD researches for early design rule evaluation","display_name":"Exploration of VLSI CAD researches for early design rule evaluation","publication_year":2011,"publication_date":"2011-01-01","ids":{"openalex":"https://openalex.org/W3140273112","doi":"https://doi.org/10.1109/aspdac.2011.5722223","mag":"3140273112"},"language":"en","primary_location":{"id":"doi:10.1109/aspdac.2011.5722223","is_oa":false,"landing_page_url":"https://doi.org/10.1109/aspdac.2011.5722223","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"16th Asia and South Pacific Design Automation Conference (ASP-DAC 2011)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5062059569","display_name":"Chul-Hong Park","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Chul-Hong Park","raw_affiliation_strings":["CAE, Semiconductor Research and Development center, Samsung Electronics Company Limited, South Korea"],"affiliations":[{"raw_affiliation_string":"CAE, Semiconductor Research and Development center, Samsung Electronics Company Limited, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5011883763","display_name":"David Z. Pan","orcid":"https://orcid.org/0000-0002-5705-2501"},"institutions":[{"id":"https://openalex.org/I86519309","display_name":"The University of Texas at Austin","ror":"https://ror.org/00hj54h04","country_code":"US","type":"education","lineage":["https://openalex.org/I86519309"]},{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR","US"],"is_corresponding":false,"raw_author_name":"David Z. Pan","raw_affiliation_strings":["CAE, Semiconductor Research and Development center, Samsung Electronics Company Limited, South Korea","ECE Department, University of Texas, Austin, USA"],"affiliations":[{"raw_affiliation_string":"CAE, Semiconductor Research and Development center, Samsung Electronics Company Limited, South Korea","institution_ids":["https://openalex.org/I2250650973"]},{"raw_affiliation_string":"ECE Department, University of Texas, Austin, USA","institution_ids":["https://openalex.org/I86519309"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5108612801","display_name":"Kevin Lucas","orcid":null},"institutions":[{"id":"https://openalex.org/I4210088951","display_name":"Synopsys (United States)","ror":"https://ror.org/013by2m91","country_code":"US","type":"company","lineage":["https://openalex.org/I4210088951"]},{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR","US"],"is_corresponding":false,"raw_author_name":"Kevin Lucas","raw_affiliation_strings":["CAE, Semiconductor Research and Development center, Samsung Electronics Company Limited, South Korea","Silicon Engineering Group, Synopsys, Inc., USA"],"affiliations":[{"raw_affiliation_string":"CAE, Semiconductor Research and Development center, Samsung Electronics Company Limited, South Korea","institution_ids":["https://openalex.org/I2250650973"]},{"raw_affiliation_string":"Silicon Engineering Group, Synopsys, Inc., USA","institution_ids":["https://openalex.org/I4210088951"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5062059569"],"corresponding_institution_ids":["https://openalex.org/I2250650973"],"apc_list":null,"apc_paid":null,"fwci":0.265,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.67170132,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"9","issue":null,"first_page":"405","last_page":"406"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/cad","display_name":"CAD","score":0.6983658075332642},{"id":"https://openalex.org/keywords/very-large-scale-integration","display_name":"Very-large-scale integration","score":0.6771496534347534},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6014673709869385},{"id":"https://openalex.org/keywords/metric","display_name":"Metric (unit)","score":0.502363920211792},{"id":"https://openalex.org/keywords/key","display_name":"Key (lock)","score":0.49773791432380676},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.49066245555877686},{"id":"https://openalex.org/keywords/integrated-circuit-design","display_name":"Integrated circuit design","score":0.4444623291492462},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.3996224105358124},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.3702027201652527},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.34662961959838867},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.3170170783996582},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.31078508496284485},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.1436128318309784},{"id":"https://openalex.org/keywords/operations-management","display_name":"Operations management","score":0.10006842017173767}],"concepts":[{"id":"https://openalex.org/C194789388","wikidata":"https://www.wikidata.org/wiki/Q17855283","display_name":"CAD","level":2,"score":0.6983658075332642},{"id":"https://openalex.org/C14580979","wikidata":"https://www.wikidata.org/wiki/Q876049","display_name":"Very-large-scale integration","level":2,"score":0.6771496534347534},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6014673709869385},{"id":"https://openalex.org/C176217482","wikidata":"https://www.wikidata.org/wiki/Q860554","display_name":"Metric (unit)","level":2,"score":0.502363920211792},{"id":"https://openalex.org/C26517878","wikidata":"https://www.wikidata.org/wiki/Q228039","display_name":"Key (lock)","level":2,"score":0.49773791432380676},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.49066245555877686},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.4444623291492462},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.3996224105358124},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.3702027201652527},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.34662961959838867},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.3170170783996582},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.31078508496284485},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.1436128318309784},{"id":"https://openalex.org/C21547014","wikidata":"https://www.wikidata.org/wiki/Q1423657","display_name":"Operations management","level":1,"score":0.10006842017173767},{"id":"https://openalex.org/C38652104","wikidata":"https://www.wikidata.org/wiki/Q3510521","display_name":"Computer security","level":1,"score":0.0},{"id":"https://openalex.org/C153349607","wikidata":"https://www.wikidata.org/wiki/Q36649","display_name":"Visual arts","level":1,"score":0.0},{"id":"https://openalex.org/C142362112","wikidata":"https://www.wikidata.org/wiki/Q735","display_name":"Art","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/aspdac.2011.5722223","is_oa":false,"landing_page_url":"https://doi.org/10.1109/aspdac.2011.5722223","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"16th Asia and South Pacific Design Automation Conference (ASP-DAC 2011)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320332195","display_name":"Samsung","ror":"https://ror.org/04w3jy968"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W2032768606","https://openalex.org/W2066716951","https://openalex.org/W2082235446","https://openalex.org/W2128997425","https://openalex.org/W2152190733","https://openalex.org/W6671263028"],"related_works":["https://openalex.org/W2334610590","https://openalex.org/W2320366403","https://openalex.org/W3204197061","https://openalex.org/W4251350712","https://openalex.org/W637098845","https://openalex.org/W2410116073","https://openalex.org/W4283025278","https://openalex.org/W3044972437","https://openalex.org/W61292821","https://openalex.org/W2082432309"],"abstract_inverted_index":{"Design":[0],"rule":[1,52],"has":[2],"been":[3],"a":[4,77],"primary":[5],"metric":[6],"to":[7,15,26],"link":[8],"design":[9,51,72],"and":[10,12,29,34,43,68],"technology,":[11],"is":[13],"likely":[14],"be":[16,76],"considered":[17],"as":[18],"IC":[19,85],"manufacturer's":[20],"role":[21],"for":[22,66,80],"the":[23,27,46,50,82],"generation":[24],"due":[25],"empirical":[28],"unsystematic":[30],"in":[31,37,45,54,84],"nature.":[32],"Disruptive":[33],"radical":[35],"changes":[36],"terms":[38],"of":[39,71],"layout":[40],"style,":[41],"lithography":[42],"device":[44],"next":[47],"decade":[48],"require":[49],"evaluation":[53,70],"early":[55,67],"development":[56],"stage.":[57],"In":[58],"this":[59],"paper,":[60],"we":[61],"explore":[62],"VLSI":[63],"CAD":[64],"researches":[65],"systematic":[69],"rule,":[73],"which":[74],"will":[75],"key":[78],"technique":[79],"enhancing":[81],"competitiveness":[83],"market.":[86]},"counts_by_year":[{"year":2020,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}