{"id":"https://openalex.org/W3151180892","doi":"https://doi.org/10.1109/aspdac.2010.5419886","title":"Low-cost design for repair with circuit partitioning","display_name":"Low-cost design for repair with circuit partitioning","publication_year":2010,"publication_date":"2010-01-01","ids":{"openalex":"https://openalex.org/W3151180892","doi":"https://doi.org/10.1109/aspdac.2010.5419886","mag":"3151180892"},"language":"en","primary_location":{"id":"doi:10.1109/aspdac.2010.5419886","is_oa":false,"landing_page_url":"https://doi.org/10.1109/aspdac.2010.5419886","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5072068792","display_name":"Kyung\u2010Ho Kim","orcid":"https://orcid.org/0000-0002-8154-2041"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Kyungho Kim","raw_affiliation_strings":["Modem Research and Development Team, DMC Research and Development Center, Digital Media Communication Business, Samsung Electronics Company Limited, South Korea"],"affiliations":[{"raw_affiliation_string":"Modem Research and Development Team, DMC Research and Development Center, Digital Media Communication Business, Samsung Electronics Company Limited, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049755932","display_name":"Byung-tae Kang","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Byungtae Kang","raw_affiliation_strings":["Modem Research and Development Team, DMC Research and Development Center, Digital Media Communication Business, Samsung Electronics Company Limited, South Korea"],"affiliations":[{"raw_affiliation_string":"Modem Research and Development Team, DMC Research and Development Center, Digital Media Communication Business, Samsung Electronics Company Limited, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061262495","display_name":"Dongyun Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Dongyun Kim","raw_affiliation_strings":["Modem Research and Development Team, DMC Research and Development Center, Digital Media Communication Business, Samsung Electronics Company Limited, South Korea"],"affiliations":[{"raw_affiliation_string":"Modem Research and Development Team, DMC Research and Development Center, Digital Media Communication Business, Samsung Electronics Company Limited, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064293175","display_name":"Sungchul Lee","orcid":"https://orcid.org/0009-0009-5549-7265"},"institutions":[{"id":"https://openalex.org/I4575257","display_name":"Hanyang University","ror":"https://ror.org/046865y68","country_code":"KR","type":"education","lineage":["https://openalex.org/I4575257"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sungchul Lee","raw_affiliation_strings":["School of Electrical and Electronics Engineering, Hanyang University, South Korea"],"affiliations":[{"raw_affiliation_string":"School of Electrical and Electronics Engineering, Hanyang University, South Korea","institution_ids":["https://openalex.org/I4575257"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055505638","display_name":"Juyong Shin","orcid":null},"institutions":[{"id":"https://openalex.org/I4575257","display_name":"Hanyang University","ror":"https://ror.org/046865y68","country_code":"KR","type":"education","lineage":["https://openalex.org/I4575257"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Juyong Shin","raw_affiliation_strings":["School of Electrical and Electronics Engineering, Hanyang University, South Korea"],"affiliations":[{"raw_affiliation_string":"School of Electrical and Electronics Engineering, Hanyang University, South Korea","institution_ids":["https://openalex.org/I4575257"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5023681581","display_name":"Hyunchul Shin","orcid":"https://orcid.org/0000-0003-3020-5130"},"institutions":[{"id":"https://openalex.org/I4575257","display_name":"Hanyang University","ror":"https://ror.org/046865y68","country_code":"KR","type":"education","lineage":["https://openalex.org/I4575257"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hyunchul Shin","raw_affiliation_strings":["School of Electrical and Electronics Engineering, Hanyang University, South Korea"],"affiliations":[{"raw_affiliation_string":"School of Electrical and Electronics Engineering, Hanyang University, South Korea","institution_ids":["https://openalex.org/I4575257"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5072068792"],"corresponding_institution_ids":["https://openalex.org/I2250650973"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.40992417,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"259","last_page":"261"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/extension","display_name":"Extension (predicate logic)","score":0.5922666192054749},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.576176643371582},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.5263510942459106},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.48839181661605835},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.4733695387840271},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.46858924627304077},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.45437902212142944},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.4405769109725952},{"id":"https://openalex.org/keywords/integrated-circuit-design","display_name":"Integrated circuit design","score":0.41018903255462646},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3722997307777405},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.264376163482666},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.22603803873062134},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.22191104292869568},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.19778302311897278},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.14943775534629822},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.14060890674591064},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.10797488689422607}],"concepts":[{"id":"https://openalex.org/C2778029271","wikidata":"https://www.wikidata.org/wiki/Q5421931","display_name":"Extension (predicate logic)","level":2,"score":0.5922666192054749},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.576176643371582},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.5263510942459106},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.48839181661605835},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.4733695387840271},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.46858924627304077},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.45437902212142944},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.4405769109725952},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.41018903255462646},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3722997307777405},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.264376163482666},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.22603803873062134},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.22191104292869568},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19778302311897278},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.14943775534629822},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.14060890674591064},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.10797488689422607},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/aspdac.2010.5419886","is_oa":false,"landing_page_url":"https://doi.org/10.1109/aspdac.2010.5419886","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC)","raw_type":"proceedings-article"},{"id":"pmh:oai:repository.hanyang.ac.kr:20.500.11754/89296","is_oa":false,"landing_page_url":"http://repository.hanyang.ac.kr/handle/20.500.11754/89296","pdf_url":null,"source":{"id":"https://openalex.org/S4306401328","display_name":"The Royal Society of Chemistry\u2019s Journals, Books and Databases (The Royal Society of Chemistry)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I2751430930","host_organization_name":"Royal Society of Chemistry","host_organization_lineage":["https://openalex.org/I2751430930"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.4000000059604645}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W2109539905","https://openalex.org/W3139542001","https://openalex.org/W4240143320","https://openalex.org/W6644658493","https://openalex.org/W6678329786"],"related_works":["https://openalex.org/W3215142653","https://openalex.org/W1487051936","https://openalex.org/W2115579119","https://openalex.org/W3094423394","https://openalex.org/W1553422968","https://openalex.org/W2007385019","https://openalex.org/W2046159858","https://openalex.org/W2338273177","https://openalex.org/W2168458994","https://openalex.org/W1955236059"],"abstract_inverted_index":{"Silicon":[0],"validation":[1],"becomes":[2],"difficult":[3],"because":[4],"of":[5,12,63],"rapidly":[6],"increasing":[7],"complexity":[8],"and":[9,37,102],"operation":[10],"speed":[11],"integrated":[13],"circuits.":[14],"When":[15,66],"an":[16,67],"error":[17,68],"is":[18,23,27,84],"found":[19],"after":[20],"a":[21],"chip":[22],"fabricated,":[24],"post-silicon":[25],"repair":[26],"necessary.":[28,85],"Full":[29],"mask":[30,82],"revision":[31,46,79,83],"may":[32],"significantly":[33,109],"increase":[34,62],"the":[35,64,111],"cost":[36],"time-to-market.":[38],"In":[39],"this":[40],"paper,":[41],"we":[42],"describe":[43],"partial":[44,73,96],"metal":[45,52,74,78,97,106,116],"techniques":[47],"in":[48],"which":[49],"only":[50],"top-level":[51,105,115],"layers":[53,107],"are":[54,89],"revised":[55],"to":[56,92,104],"fix":[57],"\u00bfsmall\u00bf":[58],"errors":[59,88],"with":[60],"minimal":[61],"cost.":[65],"cannot":[69],"be":[70,93],"fixed":[71,94],"by":[72,95,113],"layer":[75,98],"revision,":[76],"full":[77,81],"or":[80],"However,":[86],"frequently":[87],"small":[90],"enough":[91],"revision.":[99,117],"Effective":[100],"partitioning":[101],"pin-extension":[103],"can":[108],"improve":[110],"repairability":[112],"using":[114]},"counts_by_year":[],"updated_date":"2026-03-20T23:20:44.827607","created_date":"2021-04-13T00:00:00"}