{"id":"https://openalex.org/W3150848691","doi":"https://doi.org/10.1109/aspdac.2009.4796516","title":"A 3D prototyping chip based on a wafer-level stacking technology","display_name":"A 3D prototyping chip based on a wafer-level stacking technology","publication_year":2009,"publication_date":"2009-01-01","ids":{"openalex":"https://openalex.org/W3150848691","doi":"https://doi.org/10.1109/aspdac.2009.4796516","mag":"3150848691"},"language":"en","primary_location":{"id":"doi:10.1109/aspdac.2009.4796516","is_oa":false,"landing_page_url":"https://doi.org/10.1109/aspdac.2009.4796516","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 Asia and South Pacific Design Automation Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5062400897","display_name":"N. Miyakawa","orcid":"https://orcid.org/0000-0002-7088-2438"},"institutions":[{"id":"https://openalex.org/I1283473643","display_name":"Honda (Japan)","ror":"https://ror.org/03jzay846","country_code":"JP","type":"company","lineage":["https://openalex.org/I1283473643"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Nobuaki Miyakawa","raw_affiliation_strings":["Honda Research Institute Japan Company Limited, Japan"],"affiliations":[{"raw_affiliation_string":"Honda Research Institute Japan Company Limited, Japan","institution_ids":["https://openalex.org/I1283473643"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5062400897"],"corresponding_institution_ids":["https://openalex.org/I1283473643"],"apc_list":null,"apc_paid":null,"fwci":5.6824,"has_fulltext":false,"cited_by_count":31,"citation_normalized_percentile":{"value":0.96336213,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":99},"biblio":{"volume":"3 d","issue":null,"first_page":"416","last_page":"420"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9965999722480774,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.9889000058174133,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/stacking","display_name":"Stacking","score":0.9201713800430298},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.8713231086730957},{"id":"https://openalex.org/keywords/wafer-level-packaging","display_name":"Wafer-level packaging","score":0.6031466126441956},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5405660271644592},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4833197593688965},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.4439942538738251},{"id":"https://openalex.org/keywords/rapid-prototyping","display_name":"Rapid prototyping","score":0.442207396030426},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.43031755089759827},{"id":"https://openalex.org/keywords/yield","display_name":"Yield (engineering)","score":0.4221174716949463},{"id":"https://openalex.org/keywords/wafer-scale-integration","display_name":"Wafer-scale integration","score":0.4180397093296051},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4089471697807312},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.376231849193573},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.35868775844573975},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.26088565587997437},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.17225751280784607},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.08401873707771301},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.08314049243927002},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.06971487402915955}],"concepts":[{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.9201713800430298},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.8713231086730957},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.6031466126441956},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5405660271644592},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4833197593688965},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.4439942538738251},{"id":"https://openalex.org/C2780395129","wikidata":"https://www.wikidata.org/wiki/Q1128971","display_name":"Rapid prototyping","level":2,"score":0.442207396030426},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.43031755089759827},{"id":"https://openalex.org/C134121241","wikidata":"https://www.wikidata.org/wiki/Q899301","display_name":"Yield (engineering)","level":2,"score":0.4221174716949463},{"id":"https://openalex.org/C2778638305","wikidata":"https://www.wikidata.org/wiki/Q7406100","display_name":"Wafer-scale integration","level":3,"score":0.4180397093296051},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4089471697807312},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.376231849193573},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.35868775844573975},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.26088565587997437},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.17225751280784607},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.08401873707771301},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.08314049243927002},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.06971487402915955},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/aspdac.2009.4796516","is_oa":false,"landing_page_url":"https://doi.org/10.1109/aspdac.2009.4796516","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 Asia and South Pacific Design Automation Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W2009195513","https://openalex.org/W2141361504","https://openalex.org/W2164231539","https://openalex.org/W2541409995"],"related_works":["https://openalex.org/W2156194080","https://openalex.org/W2543049871","https://openalex.org/W2171369689","https://openalex.org/W4200597737","https://openalex.org/W2011986249","https://openalex.org/W2096487736","https://openalex.org/W2138063101","https://openalex.org/W2089003336","https://openalex.org/W1969921064","https://openalex.org/W2128696525"],"abstract_inverted_index":{"We":[0,42],"have":[1],"developed":[2],"a":[3,50],"new":[4],"3-dimensional":[5],"stacking":[6,23],"technology":[7,30],"using":[8,28],"wafer-to-wafer":[9],"stacked":[10,52],"method":[11],"and":[12,18,31],"evaluated":[13],"the":[14,32,46],"connectivity":[15],"between":[16],"TSV":[17],"micro-bump.":[19],"The":[20],"prototype":[21],"3-layer":[22],"device":[24],"has":[25],"been":[26],"tried":[27],"our":[29],"functional":[33],"yield":[34],"reached":[35],"more":[36],"than":[37],"60%.":[38],"Using":[39],"8-inch":[40],"wafer.":[41],"propose":[43],"one":[44],"of":[45],"design":[47],"methodologies":[48],"for":[49],"3D":[51],"device.":[53]},"counts_by_year":[{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":2},{"year":2013,"cited_by_count":4},{"year":2012,"cited_by_count":7}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}