{"id":"https://openalex.org/W4254912988","doi":"https://doi.org/10.1109/aspdac.2008.4484055","title":"Symmetry constraint based on mismatch analysis for analog layout in SOI technology","display_name":"Symmetry constraint based on mismatch analysis for analog layout in SOI technology","publication_year":2008,"publication_date":"2008-01-01","ids":{"openalex":"https://openalex.org/W4254912988","doi":"https://doi.org/10.1109/aspdac.2008.4484055"},"language":"en","primary_location":{"id":"doi:10.1109/aspdac.2008.4484055","is_oa":false,"landing_page_url":"https://doi.org/10.1109/aspdac.2008.4484055","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2008 Asia and South Pacific Design Automation Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100370767","display_name":"Jiayi Liu","orcid":"https://orcid.org/0000-0002-6995-0747"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Jiayi Liu","raw_affiliation_strings":["EDA Laboratory, Tsinghua University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"EDA Laboratory, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110234701","display_name":"Sheqin Dong","orcid":null},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Sheqin Dong","raw_affiliation_strings":["EDA Laboratory, Tsinghua University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"EDA Laboratory, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111768666","display_name":"Xianlong Hong","orcid":null},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xianlong Hong","raw_affiliation_strings":["EDA Laboratory, Tsinghua University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"EDA Laboratory, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100354982","display_name":"Yibo Wang","orcid":"https://orcid.org/0000-0003-2302-5684"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yibo Wang","raw_affiliation_strings":["EDA Laboratory, Tsinghua University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"EDA Laboratory, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5071177359","display_name":"Ou He","orcid":null},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ou He","raw_affiliation_strings":["EDA Laboratory, Tsinghua University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"EDA Laboratory, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101825973","display_name":"Satoshi Goto","orcid":"https://orcid.org/0000-0002-6387-048X"},"institutions":[{"id":"https://openalex.org/I150744194","display_name":"Waseda University","ror":"https://ror.org/00ntfnx83","country_code":"JP","type":"education","lineage":["https://openalex.org/I150744194"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Satoshi Goto","raw_affiliation_strings":["Graduate School of IPS, Waseda University, Kitakyushu, Japan"],"affiliations":[{"raw_affiliation_string":"Graduate School of IPS, Waseda University, Kitakyushu, Japan","institution_ids":["https://openalex.org/I150744194"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5100370767"],"corresponding_institution_ids":["https://openalex.org/I99065089"],"apc_list":null,"apc_paid":null,"fwci":0.3329,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.69923108,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"772","last_page":"775"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9950000047683716,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9950000047683716,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9922000169754028,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9864000082015991,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/silicon-on-insulator","display_name":"Silicon on insulator","score":0.7811250686645508},{"id":"https://openalex.org/keywords/spice","display_name":"Spice","score":0.6478987336158752},{"id":"https://openalex.org/keywords/floorplan","display_name":"Floorplan","score":0.603158712387085},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5827957391738892},{"id":"https://openalex.org/keywords/context","display_name":"Context (archaeology)","score":0.5260369777679443},{"id":"https://openalex.org/keywords/centroid","display_name":"Centroid","score":0.5211206078529358},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.4917807877063751},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.46391311287879944},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.44567301869392395},{"id":"https://openalex.org/keywords/constraint","display_name":"Constraint (computer-aided design)","score":0.43595802783966064},{"id":"https://openalex.org/keywords/symmetry","display_name":"Symmetry (geometry)","score":0.4355137050151825},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.4268481135368347},{"id":"https://openalex.org/keywords/very-large-scale-integration","display_name":"Very-large-scale integration","score":0.41393446922302246},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.2547922730445862},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.20678529143333435},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.19480514526367188},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.1933439075946808},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.18383589386940002},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.11756926774978638},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.11552655696868896},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.10126170516014099},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.09456619620323181}],"concepts":[{"id":"https://openalex.org/C53143962","wikidata":"https://www.wikidata.org/wiki/Q1478788","display_name":"Silicon on insulator","level":3,"score":0.7811250686645508},{"id":"https://openalex.org/C2780077345","wikidata":"https://www.wikidata.org/wiki/Q16891888","display_name":"Spice","level":2,"score":0.6478987336158752},{"id":"https://openalex.org/C130145326","wikidata":"https://www.wikidata.org/wiki/Q1553985","display_name":"Floorplan","level":2,"score":0.603158712387085},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5827957391738892},{"id":"https://openalex.org/C2779343474","wikidata":"https://www.wikidata.org/wiki/Q3109175","display_name":"Context (archaeology)","level":2,"score":0.5260369777679443},{"id":"https://openalex.org/C146599234","wikidata":"https://www.wikidata.org/wiki/Q511093","display_name":"Centroid","level":2,"score":0.5211206078529358},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4917807877063751},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.46391311287879944},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.44567301869392395},{"id":"https://openalex.org/C2776036281","wikidata":"https://www.wikidata.org/wiki/Q48769818","display_name":"Constraint (computer-aided design)","level":2,"score":0.43595802783966064},{"id":"https://openalex.org/C2779886137","wikidata":"https://www.wikidata.org/wiki/Q21030012","display_name":"Symmetry (geometry)","level":2,"score":0.4355137050151825},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.4268481135368347},{"id":"https://openalex.org/C14580979","wikidata":"https://www.wikidata.org/wiki/Q876049","display_name":"Very-large-scale integration","level":2,"score":0.41393446922302246},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.2547922730445862},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.20678529143333435},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19480514526367188},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.1933439075946808},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.18383589386940002},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.11756926774978638},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.11552655696868896},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.10126170516014099},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.09456619620323181},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/aspdac.2008.4484055","is_oa":false,"landing_page_url":"https://doi.org/10.1109/aspdac.2008.4484055","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2008 Asia and South Pacific Design Automation Conference","raw_type":"proceedings-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.662.6483","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.662.6483","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www.cecs.uci.edu/%7Epapers/aspdac08/pdf/p772_9A-4.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":19,"referenced_works":["https://openalex.org/W1577184453","https://openalex.org/W1873200617","https://openalex.org/W1964817818","https://openalex.org/W1974278299","https://openalex.org/W2086034031","https://openalex.org/W2106241469","https://openalex.org/W2109320948","https://openalex.org/W2117324805","https://openalex.org/W2125447762","https://openalex.org/W2140823559","https://openalex.org/W2145458600","https://openalex.org/W2476061309","https://openalex.org/W2490765418","https://openalex.org/W2497389460","https://openalex.org/W4237705761","https://openalex.org/W4247078132","https://openalex.org/W6641328371","https://openalex.org/W6681583066","https://openalex.org/W6720764238"],"related_works":["https://openalex.org/W2055008360","https://openalex.org/W1500063550","https://openalex.org/W215057456","https://openalex.org/W2135118255","https://openalex.org/W2165891825","https://openalex.org/W2133901311","https://openalex.org/W4311031373","https://openalex.org/W2136768364","https://openalex.org/W4386643835","https://openalex.org/W2120361800"],"abstract_inverted_index":{"The":[0,124],"conventional":[1],"tools":[2],"for":[3],"mismatch":[4,26,38,81,84,86],"elimination":[5],"such":[6],"as":[7],"geometric":[8],"symmetry":[9,101],"and":[10,27,42,82,88,107],"common":[11],"centroid":[12],"technology":[13],"can":[14,20,73],"only":[15],"eliminate":[16],"systematic":[17],"mismatch,":[18],"but":[19],"do":[21],"little":[22],"to":[23,58,94],"reduce":[24],"random":[25,37,80],"thermal-induced":[28,60,83],"mismatch.":[29,61],"As":[30],"the":[31,36,47,54,75,96,121,129],"development":[32],"of":[33,49,78,99,116,131],"VLSI":[34],"technology,":[35],"is":[39],"becoming":[40],"more":[41,43],"serious.":[44],"And":[45,91],"in":[46,63,92,120],"context":[48],"Silicon":[50],"on":[51],"Insulator":[52],"(SOI),":[53],"self-heating":[55],"effect":[56,77],"leads":[57],"unbearable":[59],"Therefore,":[62],"this":[64],"paper,":[65],"we":[66],"first":[67],"propose":[68],"a":[69,108],"new":[70],"model":[71],"which":[72],"estimate":[74],"combination":[76],"both":[79],"by":[85],"analysis":[87],"SPICE":[89],"simulation.":[90],"order":[93],"meet":[95],"different":[97,100],"sensitivities":[98],"pairs,":[102],"an":[103],"automatic":[104],"classification":[105],"tool":[106],"configurable":[109],"optimization":[110],"process":[111],"are":[112,118],"also":[113],"introduced.":[114],"All":[115],"these":[117],"embedded":[119],"floorplanning":[122],"process.":[123],"final":[125],"experimental":[126],"results":[127],"prove":[128],"effectiveness":[130],"our":[132],"method.":[133]},"counts_by_year":[{"year":2025,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}