{"id":"https://openalex.org/W7135087792","doi":"https://doi.org/10.1109/asp-dac66049.2026.11420679","title":"Efficient Simulation of IC Packages with TEC Based on Adaptive Segmented Method and Spatially-Aware Thermal Neural Network","display_name":"Efficient Simulation of IC Packages with TEC Based on Adaptive Segmented Method and Spatially-Aware Thermal Neural Network","publication_year":2026,"publication_date":"2026-01-19","ids":{"openalex":"https://openalex.org/W7135087792","doi":"https://doi.org/10.1109/asp-dac66049.2026.11420679"},"language":null,"primary_location":{"id":"doi:10.1109/asp-dac66049.2026.11420679","is_oa":false,"landing_page_url":"https://doi.org/10.1109/asp-dac66049.2026.11420679","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2026 31st Asia and South Pacific Design Automation Conference (ASP-DAC)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5123400209","display_name":"Longfei Li","orcid":null},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Longfei Li","raw_affiliation_strings":["Shanghai Jiao Tong University,State Key Laboratory of Radio Frequency Heterogeneous Integration,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shanghai Jiao Tong University,State Key Laboratory of Radio Frequency Heterogeneous Integration,Shanghai,China","institution_ids":["https://openalex.org/I183067930"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5128918026","display_name":"Xinyue Li","orcid":null},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xinyue Li","raw_affiliation_strings":["Shanghai Jiao Tong University,State Key Laboratory of Radio Frequency Heterogeneous Integration,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shanghai Jiao Tong University,State Key Laboratory of Radio Frequency Heterogeneous Integration,Shanghai,China","institution_ids":["https://openalex.org/I183067930"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113325577","display_name":"Shunxiang Lan","orcid":"https://orcid.org/0009-0007-3727-1460"},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Shunxiang Lan","raw_affiliation_strings":["Shanghai Jiao Tong University,State Key Laboratory of Radio Frequency Heterogeneous Integration,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shanghai Jiao Tong University,State Key Laboratory of Radio Frequency Heterogeneous Integration,Shanghai,China","institution_ids":["https://openalex.org/I183067930"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Liang Chen","orcid":null},"institutions":[{"id":"https://openalex.org/I113940042","display_name":"Shanghai University","ror":"https://ror.org/006teas31","country_code":"CN","type":"education","lineage":["https://openalex.org/I113940042"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Liang Chen","raw_affiliation_strings":["Shanghai University,School of Microelectronics,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shanghai University,School of Microelectronics,Shanghai,China","institution_ids":["https://openalex.org/I113940042"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102896111","display_name":"Haibao Chen","orcid":"https://orcid.org/0000-0002-3771-2971"},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Haibao Chen","raw_affiliation_strings":["Shanghai Jiao Tong University,State Key Laboratory of Radio Frequency Heterogeneous Integration,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shanghai Jiao Tong University,State Key Laboratory of Radio Frequency Heterogeneous Integration,Shanghai,China","institution_ids":["https://openalex.org/I183067930"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5089445782","display_name":"Min Tang","orcid":"https://orcid.org/0000-0002-0716-912X"},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Min Tang","raw_affiliation_strings":["Shanghai Jiao Tong University,State Key Laboratory of Radio Frequency Heterogeneous Integration,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shanghai Jiao Tong University,State Key Laboratory of Radio Frequency Heterogeneous Integration,Shanghai,China","institution_ids":["https://openalex.org/I183067930"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.20080303,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1393","last_page":"1399"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.13580000400543213,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.13580000400543213,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.08900000154972076,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.08349999785423279,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/tec","display_name":"TEC","score":0.7196000218391418},{"id":"https://openalex.org/keywords/artificial-neural-network","display_name":"Artificial neural network","score":0.6122000217437744},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.3675999939441681},{"id":"https://openalex.org/keywords/key","display_name":"Key (lock)","score":0.23819999396800995}],"concepts":[{"id":"https://openalex.org/C176379880","wikidata":"https://www.wikidata.org/wiki/Q18031939","display_name":"TEC","level":3,"score":0.7196000218391418},{"id":"https://openalex.org/C50644808","wikidata":"https://www.wikidata.org/wiki/Q192776","display_name":"Artificial neural network","level":2,"score":0.6122000217437744},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5769000053405762},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.3675999939441681},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.3497999906539917},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.30889999866485596},{"id":"https://openalex.org/C79403827","wikidata":"https://www.wikidata.org/wiki/Q3988","display_name":"Real-time computing","level":1,"score":0.2888000011444092},{"id":"https://openalex.org/C133731056","wikidata":"https://www.wikidata.org/wiki/Q4917288","display_name":"Control engineering","level":1,"score":0.25679999589920044},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2533999979496002},{"id":"https://openalex.org/C26517878","wikidata":"https://www.wikidata.org/wiki/Q228039","display_name":"Key (lock)","level":2,"score":0.23819999396800995}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/asp-dac66049.2026.11420679","is_oa":false,"landing_page_url":"https://doi.org/10.1109/asp-dac66049.2026.11420679","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2026 31st Asia and South Pacific Design Automation Conference (ASP-DAC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320321885","display_name":"Science and Technology Commission of Shanghai Municipality","ror":"https://ror.org/03kt66j61"},{"id":"https://openalex.org/F4320337504","display_name":"Research and Development","ror":"https://ror.org/027s68j25"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":19,"referenced_works":["https://openalex.org/W629361254","https://openalex.org/W1977953124","https://openalex.org/W2005390260","https://openalex.org/W2062820207","https://openalex.org/W2071744309","https://openalex.org/W2126598925","https://openalex.org/W2147606056","https://openalex.org/W2155846323","https://openalex.org/W2167023231","https://openalex.org/W2607235890","https://openalex.org/W2939550625","https://openalex.org/W3205013967","https://openalex.org/W3207655436","https://openalex.org/W4312968147","https://openalex.org/W4319237632","https://openalex.org/W4324130351","https://openalex.org/W4366668749","https://openalex.org/W4400034687","https://openalex.org/W4404133847"],"related_works":[],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2026-03-13T00:00:00"}