{"id":"https://openalex.org/W4391183674","doi":"https://doi.org/10.1109/asicon58565.2023.10396250","title":"A Modeling Study: Applying Carbon-Based Interconnects to BS-PDN Architecture","display_name":"A Modeling Study: Applying Carbon-Based Interconnects to BS-PDN Architecture","publication_year":2023,"publication_date":"2023-10-24","ids":{"openalex":"https://openalex.org/W4391183674","doi":"https://doi.org/10.1109/asicon58565.2023.10396250"},"language":"en","primary_location":{"id":"doi:10.1109/asicon58565.2023.10396250","is_oa":false,"landing_page_url":"http://dx.doi.org/10.1109/asicon58565.2023.10396250","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE 15th International Conference on ASIC (ASICON)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5003501015","display_name":"Baohui Xu","orcid":"https://orcid.org/0000-0002-1061-3930"},"institutions":[{"id":"https://openalex.org/I113940042","display_name":"Shanghai University","ror":"https://ror.org/006teas31","country_code":"CN","type":"education","lineage":["https://openalex.org/I113940042"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Baohui Xu","raw_affiliation_strings":["Shanghai University,School of Microelectronics,Shanghai,China","School of Microelectronics, Shanghai University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Shanghai University,School of Microelectronics,Shanghai,China","institution_ids":["https://openalex.org/I113940042"]},{"raw_affiliation_string":"School of Microelectronics, Shanghai University, Shanghai, China","institution_ids":["https://openalex.org/I113940042"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102796393","display_name":"Rongmei Chen","orcid":"https://orcid.org/0000-0003-1205-0585"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Rongmei Chen","raw_affiliation_strings":["Interuniversity Microelectronics Centre (IMEC),Leuven,Belgium","Interuniversity Microelectronics Centre (IMEC), Leuven, Belgium"],"affiliations":[{"raw_affiliation_string":"Interuniversity Microelectronics Centre (IMEC),Leuven,Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"Interuniversity Microelectronics Centre (IMEC), Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101784190","display_name":"Jie Liang","orcid":"https://orcid.org/0000-0002-0072-2711"},"institutions":[{"id":"https://openalex.org/I113940042","display_name":"Shanghai University","ror":"https://ror.org/006teas31","country_code":"CN","type":"education","lineage":["https://openalex.org/I113940042"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jie Liang","raw_affiliation_strings":["Shanghai University,School of Microelectronics,Shanghai,China","School of Microelectronics, Shanghai University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Shanghai University,School of Microelectronics,Shanghai,China","institution_ids":["https://openalex.org/I113940042"]},{"raw_affiliation_string":"School of Microelectronics, Shanghai University, Shanghai, China","institution_ids":["https://openalex.org/I113940042"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5003501015"],"corresponding_institution_ids":["https://openalex.org/I113940042"],"apc_list":null,"apc_paid":null,"fwci":0.0798,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.30613789,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":97,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10179","display_name":"Supercapacitor Materials and Fabrication","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10179","display_name":"Supercapacitor Materials and Fabrication","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10018","display_name":"Advancements in Battery Materials","score":0.9966999888420105,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10083","display_name":"Graphene research and applications","score":0.9948999881744385,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5283000469207764},{"id":"https://openalex.org/keywords/architecture","display_name":"Architecture","score":0.516342043876648},{"id":"https://openalex.org/keywords/carbon-fibers","display_name":"Carbon fibers","score":0.4208141267299652},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.41150087118148804},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.07682037353515625},{"id":"https://openalex.org/keywords/composite-number","display_name":"Composite number","score":0.06658497452735901}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5283000469207764},{"id":"https://openalex.org/C123657996","wikidata":"https://www.wikidata.org/wiki/Q12271","display_name":"Architecture","level":2,"score":0.516342043876648},{"id":"https://openalex.org/C140205800","wikidata":"https://www.wikidata.org/wiki/Q5860","display_name":"Carbon fibers","level":3,"score":0.4208141267299652},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.41150087118148804},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.07682037353515625},{"id":"https://openalex.org/C104779481","wikidata":"https://www.wikidata.org/wiki/Q50707","display_name":"Composite number","level":2,"score":0.06658497452735901},{"id":"https://openalex.org/C142362112","wikidata":"https://www.wikidata.org/wiki/Q735","display_name":"Art","level":0,"score":0.0},{"id":"https://openalex.org/C153349607","wikidata":"https://www.wikidata.org/wiki/Q36649","display_name":"Visual arts","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/asicon58565.2023.10396250","is_oa":false,"landing_page_url":"http://dx.doi.org/10.1109/asicon58565.2023.10396250","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE 15th International Conference on ASIC (ASICON)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W2007719944","https://openalex.org/W2033675353","https://openalex.org/W2047020565","https://openalex.org/W2562244986","https://openalex.org/W2800334986","https://openalex.org/W2887591654","https://openalex.org/W2889303625","https://openalex.org/W2947993147","https://openalex.org/W3006619829","https://openalex.org/W3216758177","https://openalex.org/W4226187548","https://openalex.org/W4226268775","https://openalex.org/W4286434284","https://openalex.org/W4312712610"],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W2358668433","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W2382290278","https://openalex.org/W2350741829","https://openalex.org/W2530322880","https://openalex.org/W1596801655","https://openalex.org/W2359140296"],"abstract_inverted_index":{"In":[0,63],"recent":[1],"years,":[2],"BS-PDN":[3,75,113],"(Back-Side":[4],"power":[5],"delivery":[6],"network":[7],"with":[8,23,53,153],"Buried-Power-Rails)":[9],"has":[10,147],"been":[11],"proposed":[12],"to":[13,43,50,74,76,94,115,142],"meet":[14],"the":[15,31,68,116,119,122,129,143],"challenge":[16],"of":[17,20,70,118,125,138],"continuous":[18],"scaling":[19],"integrated":[21],"circuits":[22],"excellent":[24],"PPA":[25],"(power,":[26],"performance,":[27,100],"and":[28,35,82,101,121,133,146,151],"area).":[29],"However,":[30,106],"additional":[32],"bonding":[33],"layer":[34],"thin":[36],"substrate":[37],"introduced":[38],"by":[39],"BPR":[40],"(Buried-Power-Rails)":[41],"lead":[42],"poor":[44],"heat":[45,55,149],"dissipation,":[46],"making":[47],"it":[48,107],"difficult":[49],"handle":[51],"situations":[52],"severe":[54],"dissipation":[56,150],"requirements":[57],"such":[58],"as":[59],"high-performance":[60],"computing":[61],"applications.":[62],"this":[64],"paper,":[65],"we":[66],"explore":[67],"feasibility":[69],"applying":[71],"Carbon-based":[72,88],"interconnect":[73,130,145],"improve":[77],"its":[78],"performance":[79],"through":[80],"modeling":[81],"simulation.":[83],"Our":[84],"results":[85],"demonstrate":[86],"that":[87],"interconnects":[89],"have":[90],"comparable":[91,141],"electrical":[92,139],"characteristics":[93,140],"copper-based":[95],"interconnects,":[96],"~20.4%":[97],"better":[98,148],"thermal":[99],"ten":[102],"times":[103],"more":[104],"reliability.":[105],"is":[108,160],"not":[109],"fully":[110],"applicable":[111],"for":[112],"due":[114],"limitation":[117],"process":[120],"large":[123],"loss":[124,155],"current":[126,157],"density.":[127],"Furthermore,":[128],"combining":[131],"Carbon":[132],"Cu":[134],"shows":[135],"a":[136,161],"level":[137],"Cu-based":[144],"reliability":[152],"little":[154],"in":[156],"density,":[158],"which":[159],"potential":[162],"solution.":[163]},"counts_by_year":[{"year":2026,"cited_by_count":1}],"updated_date":"2026-03-24T08:02:53.985720","created_date":"2025-10-10T00:00:00"}