{"id":"https://openalex.org/W3004463905","doi":"https://doi.org/10.1109/asicon47005.2019.8983616","title":"Scalable Modeling for the CPW Gap Discontinuity at Frequency up to 150 GHz","display_name":"Scalable Modeling for the CPW Gap Discontinuity at Frequency up to 150 GHz","publication_year":2019,"publication_date":"2019-10-01","ids":{"openalex":"https://openalex.org/W3004463905","doi":"https://doi.org/10.1109/asicon47005.2019.8983616","mag":"3004463905"},"language":"en","primary_location":{"id":"doi:10.1109/asicon47005.2019.8983616","is_oa":false,"landing_page_url":"https://doi.org/10.1109/asicon47005.2019.8983616","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE 13th International Conference on ASIC (ASICON)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100778529","display_name":"Hao Sun","orcid":"https://orcid.org/0000-0003-0951-6428"},"institutions":[{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Hao Sun","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University,Beijing,China,100084","Institute of Microelectronics, Tsinghua University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University,Beijing,China,100084","institution_ids":["https://openalex.org/I99065089","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101735949","display_name":"Jun Fu","orcid":"https://orcid.org/0000-0001-8851-0491"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jun Fu","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University,Beijing,China,100084","Institute of Microelectronics, Tsinghua University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University,Beijing,China,100084","institution_ids":["https://openalex.org/I99065089","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110560869","display_name":"Wenpu Cui","orcid":null},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wenpu Cui","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University,Beijing,China,100084","Institute of Microelectronics, Tsinghua University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University,Beijing,China,100084","institution_ids":["https://openalex.org/I99065089","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024756322","display_name":"Tian\u2010Ling Ren","orcid":"https://orcid.org/0000-0002-7330-0544"},"institutions":[{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Tianling Ren","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University,Beijing,China,100084","Institute of Microelectronics, Tsinghua University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University,Beijing,China,100084","institution_ids":["https://openalex.org/I99065089","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100409383","display_name":"Linlin Liu","orcid":"https://orcid.org/0000-0001-8647-5493"},"institutions":[{"id":"https://openalex.org/I4210089783","display_name":"Shanghai Medical Information Center","ror":"https://ror.org/007wz9933","country_code":"CN","type":"other","lineage":["https://openalex.org/I4210089783"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"LinLin Liu","raw_affiliation_strings":["Shanghai IC R&D Center,Shanghai,China,201210","Shanghai IC R&D Center, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Shanghai IC R&D Center,Shanghai,China,201210","institution_ids":["https://openalex.org/I4210089783"]},{"raw_affiliation_string":"Shanghai IC R&D Center, Shanghai, China","institution_ids":["https://openalex.org/I4210089783"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101665888","display_name":"Wei Zhou","orcid":"https://orcid.org/0000-0002-3608-1047"},"institutions":[{"id":"https://openalex.org/I4210089783","display_name":"Shanghai Medical Information Center","ror":"https://ror.org/007wz9933","country_code":"CN","type":"other","lineage":["https://openalex.org/I4210089783"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wei Zhou","raw_affiliation_strings":["Shanghai IC R&D Center,Shanghai,China,201210","Shanghai IC R&D Center, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Shanghai IC R&D Center,Shanghai,China,201210","institution_ids":["https://openalex.org/I4210089783"]},{"raw_affiliation_string":"Shanghai IC R&D Center, Shanghai, China","institution_ids":["https://openalex.org/I4210089783"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100418272","display_name":"Quan Wang","orcid":"https://orcid.org/0000-0003-2345-442X"},"institutions":[{"id":"https://openalex.org/I4210089783","display_name":"Shanghai Medical Information Center","ror":"https://ror.org/007wz9933","country_code":"CN","type":"other","lineage":["https://openalex.org/I4210089783"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Quan Wang","raw_affiliation_strings":["Shanghai IC R&D Center,Shanghai,China,201210","Shanghai IC R&D Center, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Shanghai IC R&D Center,Shanghai,China,201210","institution_ids":["https://openalex.org/I4210089783"]},{"raw_affiliation_string":"Shanghai IC R&D Center, Shanghai, China","institution_ids":["https://openalex.org/I4210089783"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101943490","display_name":"Ao Guo","orcid":"https://orcid.org/0000-0002-9698-8425"},"institutions":[{"id":"https://openalex.org/I4210089783","display_name":"Shanghai Medical Information Center","ror":"https://ror.org/007wz9933","country_code":"CN","type":"other","lineage":["https://openalex.org/I4210089783"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ao Guo","raw_affiliation_strings":["Shanghai IC R&D Center,Shanghai,China,201210","Shanghai IC R&D Center, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Shanghai IC R&D Center,Shanghai,China,201210","institution_ids":["https://openalex.org/I4210089783"]},{"raw_affiliation_string":"Shanghai IC R&D Center, Shanghai, China","institution_ids":["https://openalex.org/I4210089783"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":8,"corresponding_author_ids":["https://openalex.org/A5100778529"],"corresponding_institution_ids":["https://openalex.org/I4210119392","https://openalex.org/I99065089"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.16135192,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"3"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10299","display_name":"Photonic and Optical Devices","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/discontinuity","display_name":"Discontinuity (linguistics)","score":0.7736769318580627},{"id":"https://openalex.org/keywords/scalability","display_name":"Scalability","score":0.6212649345397949},{"id":"https://openalex.org/keywords/coplanar-waveguide","display_name":"Coplanar waveguide","score":0.6206287741661072},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5853333473205566},{"id":"https://openalex.org/keywords/microwave","display_name":"Microwave","score":0.5832021832466125},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5749777555465698},{"id":"https://openalex.org/keywords/equivalent-circuit","display_name":"Equivalent circuit","score":0.5444669723510742},{"id":"https://openalex.org/keywords/space-mapping","display_name":"Space mapping","score":0.5159988403320312},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.46192046999931335},{"id":"https://openalex.org/keywords/software","display_name":"Software","score":0.44401073455810547},{"id":"https://openalex.org/keywords/solid-modeling","display_name":"Solid modeling","score":0.41893765330314636},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2739025950431824},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.23151308298110962},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.12201768159866333}],"concepts":[{"id":"https://openalex.org/C2777042112","wikidata":"https://www.wikidata.org/wiki/Q5281658","display_name":"Discontinuity (linguistics)","level":2,"score":0.7736769318580627},{"id":"https://openalex.org/C48044578","wikidata":"https://www.wikidata.org/wiki/Q727490","display_name":"Scalability","level":2,"score":0.6212649345397949},{"id":"https://openalex.org/C3736036","wikidata":"https://www.wikidata.org/wiki/Q15525941","display_name":"Coplanar waveguide","level":3,"score":0.6206287741661072},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5853333473205566},{"id":"https://openalex.org/C44838205","wikidata":"https://www.wikidata.org/wiki/Q127995","display_name":"Microwave","level":2,"score":0.5832021832466125},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5749777555465698},{"id":"https://openalex.org/C23572009","wikidata":"https://www.wikidata.org/wiki/Q964981","display_name":"Equivalent circuit","level":3,"score":0.5444669723510742},{"id":"https://openalex.org/C68028875","wikidata":"https://www.wikidata.org/wiki/Q7572595","display_name":"Space mapping","level":2,"score":0.5159988403320312},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.46192046999931335},{"id":"https://openalex.org/C2777904410","wikidata":"https://www.wikidata.org/wiki/Q7397","display_name":"Software","level":2,"score":0.44401073455810547},{"id":"https://openalex.org/C108882727","wikidata":"https://www.wikidata.org/wiki/Q2991685","display_name":"Solid modeling","level":2,"score":0.41893765330314636},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2739025950431824},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.23151308298110962},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.12201768159866333},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.0},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/asicon47005.2019.8983616","is_oa":false,"landing_page_url":"https://doi.org/10.1109/asicon47005.2019.8983616","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE 13th International Conference on ASIC (ASICON)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.5699999928474426,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W2020151710","https://openalex.org/W2046255593","https://openalex.org/W2049905908","https://openalex.org/W2071571978","https://openalex.org/W2074774443","https://openalex.org/W2134554920","https://openalex.org/W2149152394","https://openalex.org/W2150027710","https://openalex.org/W2593577643","https://openalex.org/W6669256127"],"related_works":["https://openalex.org/W2267583951","https://openalex.org/W2159490149","https://openalex.org/W2165119375","https://openalex.org/W2588915956","https://openalex.org/W2493144531","https://openalex.org/W4399169110","https://openalex.org/W1984488024","https://openalex.org/W2099993101","https://openalex.org/W3145803047","https://openalex.org/W3124760000"],"abstract_inverted_index":{"The":[0,64],"coplanar":[1],"waveguide":[2],"(CPW)":[3],"gap":[4,26,55,87],"discontinuity":[5,27,56],"is":[6,28,62,95],"an":[7],"important":[8,30],"component":[9],"of":[10,23,36,52],"many":[11],"applications":[12],"in":[13,86,112],"the":[14,24,34,50,53,83,98],"monolithic":[15],"microwave":[16],"integrated":[17],"circuits":[18],"(MMICs).":[19],"Therefore,":[20],"accurate":[21],"modeling":[22],"CPW":[25,54],"very":[29],"and":[31,73,90,101,120],"fundamental":[32],"for":[33],"design":[35,114,118],"MMICs.":[37],"In":[38],"this":[39],"work,":[40],"a":[41],"new":[42],"lumped":[43],"equivalent-circuit":[44],"model":[45,84,99,108],"which":[46,104],"can":[47,109],"accurately":[48],"describe":[49],"characterization":[51],"from":[57,68],"0":[58],"to":[59,116],"150":[60],"GHz":[61],"proposed.":[63],"parameters":[65],"are":[66],"extracted":[67],"electromagnetic":[69],"(EM)":[70],"simulations":[71],"simply":[72],"conveniently":[74],"without":[75],"any":[76],"complicated":[77],"optimization":[78],"algorithms.":[79],"And":[80],"we":[81],"make":[82],"scalable":[85],"length,":[88],"width":[89],"space.":[91],"Satisfactory":[92],"fitting":[93],"accuracy":[94],"obtained":[96],"between":[97],"data":[100],"EM":[102],"simulations,":[103],"verifies":[105],"that":[106],"our":[107],"be":[110],"implemented":[111],"computer-aided":[113],"software":[115],"reduce":[117],"time":[119],"save":[121],"computer":[122],"resources.":[123]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}