{"id":"https://openalex.org/W3005292987","doi":"https://doi.org/10.1109/asicon47005.2019.8983558","title":"Novel High-Performance and Cost Effective Soft Error Hardened Flip-Flop Design for Nanoscale CMOS Technology","display_name":"Novel High-Performance and Cost Effective Soft Error Hardened Flip-Flop Design for Nanoscale CMOS Technology","publication_year":2019,"publication_date":"2019-10-01","ids":{"openalex":"https://openalex.org/W3005292987","doi":"https://doi.org/10.1109/asicon47005.2019.8983558","mag":"3005292987"},"language":"en","primary_location":{"id":"doi:10.1109/asicon47005.2019.8983558","is_oa":false,"landing_page_url":"https://doi.org/10.1109/asicon47005.2019.8983558","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE 13th International Conference on ASIC (ASICON)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101665493","display_name":"Hongchen Li","orcid":"https://orcid.org/0000-0001-8593-7182"},"institutions":[{"id":"https://openalex.org/I204983213","display_name":"Harbin Institute of Technology","ror":"https://ror.org/01yqg2h08","country_code":"CN","type":"education","lineage":["https://openalex.org/I204983213"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Hong-Chen Li","raw_affiliation_strings":["Microelectronic center, Harbin Institute of Technology,Harbin,China,150001","Microelectronic center, Harbin Institute of Technology, Harbin, China"],"affiliations":[{"raw_affiliation_string":"Microelectronic center, Harbin Institute of Technology,Harbin,China,150001","institution_ids":["https://openalex.org/I204983213"]},{"raw_affiliation_string":"Microelectronic center, Harbin Institute of Technology, Harbin, China","institution_ids":["https://openalex.org/I204983213"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100651217","display_name":"Liyi Xiao","orcid":null},"institutions":[{"id":"https://openalex.org/I204983213","display_name":"Harbin Institute of Technology","ror":"https://ror.org/01yqg2h08","country_code":"CN","type":"education","lineage":["https://openalex.org/I204983213"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Li-Yi Xiao","raw_affiliation_strings":["Microelectronic center, Harbin Institute of Technology,Harbin,China,150001","Microelectronic center, Harbin Institute of Technology, Harbin, China"],"affiliations":[{"raw_affiliation_string":"Microelectronic center, Harbin Institute of Technology,Harbin,China,150001","institution_ids":["https://openalex.org/I204983213"]},{"raw_affiliation_string":"Microelectronic center, Harbin Institute of Technology, Harbin, China","institution_ids":["https://openalex.org/I204983213"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100428274","display_name":"Jie Li","orcid":"https://orcid.org/0000-0002-6914-5561"},"institutions":[{"id":"https://openalex.org/I204983213","display_name":"Harbin Institute of Technology","ror":"https://ror.org/01yqg2h08","country_code":"CN","type":"education","lineage":["https://openalex.org/I204983213"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jie Li","raw_affiliation_strings":["Microelectronic center, Harbin Institute of Technology,Harbin,China,150001","Microelectronic center, Harbin Institute of Technology, Harbin, China"],"affiliations":[{"raw_affiliation_string":"Microelectronic center, Harbin Institute of Technology,Harbin,China,150001","institution_ids":["https://openalex.org/I204983213"]},{"raw_affiliation_string":"Microelectronic center, Harbin Institute of Technology, Harbin, China","institution_ids":["https://openalex.org/I204983213"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100317871","display_name":"He Liu","orcid":"https://orcid.org/0000-0002-5685-3809"},"institutions":[{"id":"https://openalex.org/I204983213","display_name":"Harbin Institute of Technology","ror":"https://ror.org/01yqg2h08","country_code":"CN","type":"education","lineage":["https://openalex.org/I204983213"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"He Liu","raw_affiliation_strings":["Microelectronic center, Harbin Institute of Technology,Harbin,China,150001","Microelectronic center, Harbin Institute of Technology, Harbin, China"],"affiliations":[{"raw_affiliation_string":"Microelectronic center, Harbin Institute of Technology,Harbin,China,150001","institution_ids":["https://openalex.org/I204983213"]},{"raw_affiliation_string":"Microelectronic center, Harbin Institute of Technology, Harbin, China","institution_ids":["https://openalex.org/I204983213"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5101665493"],"corresponding_institution_ids":["https://openalex.org/I204983213"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.16368131,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11005","display_name":"Radiation Effects in Electronics","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11005","display_name":"Radiation Effects in Electronics","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9987000226974487,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/flip-flop","display_name":"Flip-flop","score":0.8619474768638611},{"id":"https://openalex.org/keywords/soft-error","display_name":"Soft error","score":0.8163043260574341},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.7017068862915039},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.6088777780532837},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5430478453636169},{"id":"https://openalex.org/keywords/logic-gate","display_name":"Logic gate","score":0.47102412581443787},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.44359925389289856},{"id":"https://openalex.org/keywords/fault-tolerance","display_name":"Fault tolerance","score":0.4400831460952759},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.235896497964859},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.1094295084476471}],"concepts":[{"id":"https://openalex.org/C2781007278","wikidata":"https://www.wikidata.org/wiki/Q183406","display_name":"Flip-flop","level":3,"score":0.8619474768638611},{"id":"https://openalex.org/C154474529","wikidata":"https://www.wikidata.org/wiki/Q1658917","display_name":"Soft error","level":2,"score":0.8163043260574341},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.7017068862915039},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6088777780532837},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5430478453636169},{"id":"https://openalex.org/C131017901","wikidata":"https://www.wikidata.org/wiki/Q170451","display_name":"Logic gate","level":2,"score":0.47102412581443787},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.44359925389289856},{"id":"https://openalex.org/C63540848","wikidata":"https://www.wikidata.org/wiki/Q3140932","display_name":"Fault tolerance","level":2,"score":0.4400831460952759},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.235896497964859},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.1094295084476471},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C120314980","wikidata":"https://www.wikidata.org/wiki/Q180634","display_name":"Distributed computing","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/asicon47005.2019.8983558","is_oa":false,"landing_page_url":"https://doi.org/10.1109/asicon47005.2019.8983558","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE 13th International Conference on ASIC (ASICON)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W1971440286","https://openalex.org/W1990960030","https://openalex.org/W2017426388","https://openalex.org/W2070655964","https://openalex.org/W2074083468","https://openalex.org/W2106672998","https://openalex.org/W2126481660","https://openalex.org/W2138815251","https://openalex.org/W2145822939","https://openalex.org/W2178304595","https://openalex.org/W2186829923","https://openalex.org/W2443429837","https://openalex.org/W2613938152","https://openalex.org/W2908633424","https://openalex.org/W4301409763"],"related_works":["https://openalex.org/W2108400598","https://openalex.org/W2025041939","https://openalex.org/W4221123967","https://openalex.org/W2047736125","https://openalex.org/W2944950085","https://openalex.org/W2904503064","https://openalex.org/W2130033702","https://openalex.org/W2363634100","https://openalex.org/W4402593075","https://openalex.org/W2575349682"],"abstract_inverted_index":{"We":[0],"proposed":[1,34],"a":[2],"novel":[3],"High":[4],"Performance":[5],"and":[6,25,38,44,74],"Cost":[7],"Effective":[8],"(HPCE)":[9],"soft":[10,62],"error":[11,63],"resilient":[12],"Flip-Flop":[13],"(FF)":[14],"in":[15,18],"65nm":[16],"technology":[17],"this":[19],"paper.":[20],"By":[21],"adding":[22],"XOR":[23],"gates":[24],"the":[26,33,40,42,45,48,60,66],"shadow":[27],"latch":[28],"controlled":[29],"by":[30],"pulsed":[31],"clock,":[32],"FF":[35,68],"can":[36],"detect":[37],"correct":[39],"SETs,":[41],"SEUs,":[43],"TEs":[46],"on":[47],"fly.":[49],"Simulation":[50],"results":[51],"have":[52],"indicated":[53],"that":[54],"compared":[55],"with":[56],"other":[57],"state":[58],"of":[59],"art":[61],"hardened":[64],"FFs,":[65],"HPCE":[67],"has":[69],"higher":[70,75],"reliability,":[71],"lower":[72],"cost":[73],"performance.":[76]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}