{"id":"https://openalex.org/W2504741847","doi":"https://doi.org/10.1109/asicon.2015.7517144","title":"A TSV repair method for clustered faults","display_name":"A TSV repair method for clustered faults","publication_year":2015,"publication_date":"2015-11-01","ids":{"openalex":"https://openalex.org/W2504741847","doi":"https://doi.org/10.1109/asicon.2015.7517144","mag":"2504741847"},"language":"en","primary_location":{"id":"doi:10.1109/asicon.2015.7517144","is_oa":false,"landing_page_url":"https://doi.org/10.1109/asicon.2015.7517144","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE 11th International Conference on ASIC (ASICON)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100669780","display_name":"Shijie Zhang","orcid":"https://orcid.org/0000-0001-5394-3991"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Shijie Zhang","raw_affiliation_strings":["Key Lab of Integrated Microsystems, Shenzhen Graduate School, Shenzhen, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Key Lab of Integrated Microsystems, Shenzhen Graduate School, Shenzhen, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5050097039","display_name":"Xiaole Cui","orcid":"https://orcid.org/0000-0002-3382-3703"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Xiaole Cui","raw_affiliation_strings":["Key Lab of Integrated Microsystems, Shenzhen Graduate School, Shenzhen, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Key Lab of Integrated Microsystems, Shenzhen Graduate School, Shenzhen, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100381999","display_name":"Qiang Zhang","orcid":"https://orcid.org/0000-0003-3776-9799"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Qiang Zhang","raw_affiliation_strings":["Key Lab of Integrated Microsystems, Shenzhen Graduate School, Shenzhen, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Key Lab of Integrated Microsystems, Shenzhen Graduate School, Shenzhen, China","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5102422388","display_name":"Yufeng Jin","orcid":"https://orcid.org/0009-0002-9038-0248"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Yufeng Jin","raw_affiliation_strings":["Key Lab of Integrated Microsystems, Shenzhen Graduate School, Shenzhen, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Key Lab of Integrated Microsystems, Shenzhen Graduate School, Shenzhen, China","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9940000176429749,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.9916999936103821,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/router","display_name":"Router","score":0.7537993788719177},{"id":"https://openalex.org/keywords/stacking","display_name":"Stacking","score":0.6754168272018433},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.5964324474334717},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5763014554977417},{"id":"https://openalex.org/keywords/yield","display_name":"Yield (engineering)","score":0.49540984630584717},{"id":"https://openalex.org/keywords/imperfect","display_name":"Imperfect","score":0.4424579441547394},{"id":"https://openalex.org/keywords/cluster","display_name":"Cluster (spacecraft)","score":0.436920702457428},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.42605993151664734},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4138389229774475},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.4118027687072754},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.4007152318954468},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3933379054069519},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3738465905189514},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3571660816669464},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.29953303933143616},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.2834120988845825},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.14359015226364136},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.1317833662033081},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.09611186385154724},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.09539377689361572}],"concepts":[{"id":"https://openalex.org/C2775896111","wikidata":"https://www.wikidata.org/wiki/Q642560","display_name":"Router","level":2,"score":0.7537993788719177},{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.6754168272018433},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.5964324474334717},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5763014554977417},{"id":"https://openalex.org/C134121241","wikidata":"https://www.wikidata.org/wiki/Q899301","display_name":"Yield (engineering)","level":2,"score":0.49540984630584717},{"id":"https://openalex.org/C2780310539","wikidata":"https://www.wikidata.org/wiki/Q12547192","display_name":"Imperfect","level":2,"score":0.4424579441547394},{"id":"https://openalex.org/C164866538","wikidata":"https://www.wikidata.org/wiki/Q367351","display_name":"Cluster (spacecraft)","level":2,"score":0.436920702457428},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.42605993151664734},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4138389229774475},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.4118027687072754},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.4007152318954468},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3933379054069519},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3738465905189514},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3571660816669464},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.29953303933143616},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.2834120988845825},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.14359015226364136},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1317833662033081},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.09611186385154724},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.09539377689361572},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/asicon.2015.7517144","is_oa":false,"landing_page_url":"https://doi.org/10.1109/asicon.2015.7517144","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE 11th International Conference on ASIC (ASICON)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.5099999904632568,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W2033330932","https://openalex.org/W2039742323","https://openalex.org/W2062899780","https://openalex.org/W2102230032","https://openalex.org/W2104613728","https://openalex.org/W2107304970","https://openalex.org/W2124414146","https://openalex.org/W2158277795","https://openalex.org/W4253117434","https://openalex.org/W4255435342","https://openalex.org/W4361868703"],"related_works":["https://openalex.org/W1990828594","https://openalex.org/W2016970881","https://openalex.org/W2027159884","https://openalex.org/W2333804548","https://openalex.org/W2534942874","https://openalex.org/W3093450488","https://openalex.org/W2016589506","https://openalex.org/W2376702355","https://openalex.org/W4385062230","https://openalex.org/W4237709086"],"abstract_inverted_index":{"Three-dimensional":[0],"integrated":[1],"circuits":[2],"(3D-ICs)":[3],"using":[4],"Through-silicon":[5],"Vias":[6],"(TSVs)":[7],"allow":[8],"the":[9,27,43,51,61,68,94,97,110],"stacking":[10,32],"multiple":[11],"dies":[12],"to":[13,49,82,107],"manufacture":[14],"chips":[15],"with":[16,33,102],"many":[17],"benefits,":[18],"such":[19],"as":[20],"high":[21,24],"density":[22],"and":[23],"bandwidth.":[25],"Unfortunately,":[26],"yield":[28,52,95],"of":[29,37,45,53,67,72,96,109],"3D":[30],"dies,":[31],"a":[34],"large":[35],"number":[36],"TSVs":[38,55,63,86],"is":[39,100],"significantly":[40],"impacted":[41],"by":[42],"reliability":[44],"TSVs.":[46,73],"In":[47,59],"order":[48],"improve":[50],"3D-ICs,":[54],"must":[56],"be":[57],"reparable.":[58],"practice,":[60],"faulty":[62,85],"may":[64],"cluster":[65],"because":[66],"imperfect":[69],"bonding":[70],"quality":[71],"A":[74],"right":[75],"trapezoidal":[76],"grouping":[77],"based":[78],"method":[79,99],"was":[80],"proposed":[81,98],"repair":[83],"clustered":[84],"in":[87],"this":[88],"paper.":[89],"Experimental":[90],"results":[91],"show":[92],"that":[93,108],"99.80%":[101],"50%":[103],"area":[104],"reduction":[105],"compared":[106],"router-based":[111],"method.":[112]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2019,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}