{"id":"https://openalex.org/W2486294344","doi":"https://doi.org/10.1109/asicon.2015.7517025","title":"Multi-technology simulation with mixed design environments","display_name":"Multi-technology simulation with mixed design environments","publication_year":2015,"publication_date":"2015-11-01","ids":{"openalex":"https://openalex.org/W2486294344","doi":"https://doi.org/10.1109/asicon.2015.7517025","mag":"2486294344"},"language":"en","primary_location":{"id":"doi:10.1109/asicon.2015.7517025","is_oa":false,"landing_page_url":"https://doi.org/10.1109/asicon.2015.7517025","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE 11th International Conference on ASIC (ASICON)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5050731638","display_name":"Bin Wan","orcid":null},"institutions":[{"id":"https://openalex.org/I53486688","display_name":"Skyworks Solutions (United States)","ror":"https://ror.org/02jymes45","country_code":"US","type":"company","lineage":["https://openalex.org/I53486688"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Bin Wan","raw_affiliation_strings":["Skyworks Solutions, Inc., Woburn, Massachusetts, United States"],"affiliations":[{"raw_affiliation_string":"Skyworks Solutions, Inc., Woburn, Massachusetts, United States","institution_ids":["https://openalex.org/I53486688"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024775575","display_name":"Cindy Zhang","orcid":null},"institutions":[{"id":"https://openalex.org/I53486688","display_name":"Skyworks Solutions (United States)","ror":"https://ror.org/02jymes45","country_code":"US","type":"company","lineage":["https://openalex.org/I53486688"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Cindy Zhang","raw_affiliation_strings":["Skyworks Solutions, Inc., Santa Clara, California, United States"],"affiliations":[{"raw_affiliation_string":"Skyworks Solutions, Inc., Santa Clara, California, United States","institution_ids":["https://openalex.org/I53486688"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5026151620","display_name":"Xingang Wang","orcid":"https://orcid.org/0000-0002-6851-0109"},"institutions":[{"id":"https://openalex.org/I53486688","display_name":"Skyworks Solutions (United States)","ror":"https://ror.org/02jymes45","country_code":"US","type":"company","lineage":["https://openalex.org/I53486688"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Xingang Wang","raw_affiliation_strings":["Skyworks Solutions, Inc., Irvine, California, United States"],"affiliations":[{"raw_affiliation_string":"Skyworks Solutions, Inc., Irvine, California, United States","institution_ids":["https://openalex.org/I53486688"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5050731638"],"corresponding_institution_ids":["https://openalex.org/I53486688"],"apc_list":null,"apc_paid":null,"fwci":0.4006,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.73595909,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11195","display_name":"Simulation Techniques and Applications","score":0.9800999760627747,"subfield":{"id":"https://openalex.org/subfields/1803","display_name":"Management Science and Operations Research"},"field":{"id":"https://openalex.org/fields/18","display_name":"Decision Sciences"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}},"topics":[{"id":"https://openalex.org/T11195","display_name":"Simulation Techniques and Applications","score":0.9800999760627747,"subfield":{"id":"https://openalex.org/subfields/1803","display_name":"Management Science and Operations Research"},"field":{"id":"https://openalex.org/fields/18","display_name":"Decision Sciences"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9726999998092651,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9609000086784363,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electronic-design-automation","display_name":"Electronic design automation","score":0.7471696138381958},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6021292209625244},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5298671126365662},{"id":"https://openalex.org/keywords/node","display_name":"Node (physics)","score":0.5250078439712524},{"id":"https://openalex.org/keywords/integrated-circuit-design","display_name":"Integrated circuit design","score":0.5216808319091797},{"id":"https://openalex.org/keywords/physical-design","display_name":"Physical design","score":0.5212993621826172},{"id":"https://openalex.org/keywords/automation","display_name":"Automation","score":0.49571549892425537},{"id":"https://openalex.org/keywords/design-process","display_name":"Design process","score":0.4608587324619293},{"id":"https://openalex.org/keywords/design-flow","display_name":"Design flow","score":0.45821326971054077},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4516618847846985},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.4162288308143616},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.4106371998786926},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.3831876814365387},{"id":"https://openalex.org/keywords/circuit-design","display_name":"Circuit design","score":0.35457277297973633},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.29782700538635254},{"id":"https://openalex.org/keywords/work-in-process","display_name":"Work in process","score":0.2823430597782135},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.0978918969631195},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.09457775950431824},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.08249178528785706}],"concepts":[{"id":"https://openalex.org/C64260653","wikidata":"https://www.wikidata.org/wiki/Q1194864","display_name":"Electronic design automation","level":2,"score":0.7471696138381958},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6021292209625244},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5298671126365662},{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.5250078439712524},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.5216808319091797},{"id":"https://openalex.org/C188817802","wikidata":"https://www.wikidata.org/wiki/Q13426855","display_name":"Physical design","level":3,"score":0.5212993621826172},{"id":"https://openalex.org/C115901376","wikidata":"https://www.wikidata.org/wiki/Q184199","display_name":"Automation","level":2,"score":0.49571549892425537},{"id":"https://openalex.org/C48262172","wikidata":"https://www.wikidata.org/wiki/Q16908765","display_name":"Design process","level":3,"score":0.4608587324619293},{"id":"https://openalex.org/C37135326","wikidata":"https://www.wikidata.org/wiki/Q931942","display_name":"Design flow","level":2,"score":0.45821326971054077},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4516618847846985},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.4162288308143616},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.4106371998786926},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.3831876814365387},{"id":"https://openalex.org/C190560348","wikidata":"https://www.wikidata.org/wiki/Q3245116","display_name":"Circuit design","level":2,"score":0.35457277297973633},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.29782700538635254},{"id":"https://openalex.org/C174998907","wikidata":"https://www.wikidata.org/wiki/Q357662","display_name":"Work in process","level":2,"score":0.2823430597782135},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0978918969631195},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.09457775950431824},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.08249178528785706},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.0},{"id":"https://openalex.org/C21547014","wikidata":"https://www.wikidata.org/wiki/Q1423657","display_name":"Operations management","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/asicon.2015.7517025","is_oa":false,"landing_page_url":"https://doi.org/10.1109/asicon.2015.7517025","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE 11th International Conference on ASIC (ASICON)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.6399999856948853,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":1,"referenced_works":["https://openalex.org/W2072704624"],"related_works":["https://openalex.org/W4253195573","https://openalex.org/W2020934033","https://openalex.org/W2051886008","https://openalex.org/W2535520145","https://openalex.org/W1716153929","https://openalex.org/W2743305891","https://openalex.org/W3205162826","https://openalex.org/W2078506771","https://openalex.org/W2610167993","https://openalex.org/W2134664711"],"abstract_inverted_index":{"Typical":[0],"circuit":[1],"simulation":[2,119,139],"flows":[3],"within":[4,75],"a":[5,17,40,70],"design":[6,11,77,95],"environment":[7],"provided":[8],"by":[9],"electronic":[10],"automation":[12],"(EDA)":[13],"vendors":[14,66],"only":[15],"support":[16],"single":[18],"foundry":[19,35],"process":[20,36],"technology":[21,54],"node.":[22],"But":[23],"multi-chip":[24],"modules":[25],"(MCM)":[26],"and":[27,87,108,116,140],"3D-IC":[28],"designs":[29],"are":[30],"typically":[31],"done":[32],"with":[33,52,113],"multiple":[34,50],"nodes,":[37],"which":[38],"bring":[39],"challenge":[41],"for":[42,83],"the":[43,135],"EDA":[44,65],"industry":[45],"on":[46,122],"how":[47,141],"to":[48,56,85,142],"simulate":[49],"dies":[51],"different":[53],"nodes":[55],"capture":[57],"interaction":[58],"effects":[59],"among":[60],"various":[61],"dies.":[62],"Although":[63],"some":[64],"have":[67],"recently":[68],"introduced":[69],"Multi-Technology":[71],"Simulation":[72],"(MTS)":[73],"feature":[74],"their":[76],"tools,":[78],"it":[79],"is":[80],"not":[81,90],"easy":[82],"designers":[84],"use":[86],"also":[88,131],"does":[89],"work":[91,112],"in":[92,133],"cross":[93],"platform":[94],"environments.":[96],"In":[97],"this":[98],"paper,":[99],"we":[100],"will":[101,130],"present":[102],"an":[103],"internally":[104],"developed":[105],"MTS":[106],"methodology":[107],"utility":[109],"that":[110],"can":[111],"both":[114],"Cadence":[115],"Keysight":[117],"ADS":[118],"environments":[120],"based":[121],"our":[123],"Central":[124],"Chip":[125],"Repository":[126],"methodology.":[127],"The":[128],"paper":[129],"describe":[132],"detail":[134],"challenges":[136],"of":[137],"multi-technology":[138],"address":[143],"these":[144],"challenges.":[145]},"counts_by_year":[{"year":2018,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}