{"id":"https://openalex.org/W4405845649","doi":"https://doi.org/10.1109/apccas62602.2024.10808969","title":"An On-chip High-resolution Delay Measurement Scheme for TSVs in 3DIC","display_name":"An On-chip High-resolution Delay Measurement Scheme for TSVs in 3DIC","publication_year":2024,"publication_date":"2024-11-07","ids":{"openalex":"https://openalex.org/W4405845649","doi":"https://doi.org/10.1109/apccas62602.2024.10808969"},"language":"en","primary_location":{"id":"doi:10.1109/apccas62602.2024.10808969","is_oa":false,"landing_page_url":"https://doi.org/10.1109/apccas62602.2024.10808969","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5106023901","display_name":"Dong-Yi Chen","orcid":null},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"Dong-Yi Chen","raw_affiliation_strings":["National Cheng Kung University,Department of Electrical Engineering,Tainan,Taiwan"],"affiliations":[{"raw_affiliation_string":"National Cheng Kung University,Department of Electrical Engineering,Tainan,Taiwan","institution_ids":["https://openalex.org/I91807558"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113577136","display_name":"C.T. Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Cheng-Hong Lee","raw_affiliation_strings":["National Cheng Kung University,Department of Electrical Engineering,Tainan,Taiwan"],"affiliations":[{"raw_affiliation_string":"National Cheng Kung University,Department of Electrical Engineering,Tainan,Taiwan","institution_ids":["https://openalex.org/I91807558"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079657769","display_name":"Kuen-Jong Lee","orcid":"https://orcid.org/0000-0002-6690-0074"},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Kuen-Jong Lee","raw_affiliation_strings":["National Cheng Kung University,Department of Electrical Engineering,Tainan,Taiwan"],"affiliations":[{"raw_affiliation_string":"National Cheng Kung University,Department of Electrical Engineering,Tainan,Taiwan","institution_ids":["https://openalex.org/I91807558"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060707111","display_name":"Nan-Hsin Tseng","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Nan-Hsin Tseng","raw_affiliation_strings":["Taiwan Semiconductor Manufacturing Company,Silicon Validation & Test Department,Hsinchu,Taiwan"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Company,Silicon Validation & Test Department,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5090193137","display_name":"Hsin-Wei Hung","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Hsin-Wei Hung","raw_affiliation_strings":["Taiwan Semiconductor Manufacturing Company,Silicon Validation & Test Department,Hsinchu,Taiwan"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Company,Silicon Validation & Test Department,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5024475442","display_name":"Hao-Yu Yang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Hao-Yu Yang","raw_affiliation_strings":["Taiwan Semiconductor Manufacturing Company,Silicon Validation & Test Department,Hsinchu,Taiwan"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Company,Silicon Validation & Test Department,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5106023901"],"corresponding_institution_ids":["https://openalex.org/I91807558"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.22817196,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"74","last_page":"78"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9972000122070312,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/scheme","display_name":"Scheme (mathematics)","score":0.6110334396362305},{"id":"https://openalex.org/keywords/resolution","display_name":"Resolution (logic)","score":0.5602239966392517},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5588884949684143},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5091566443443298},{"id":"https://openalex.org/keywords/high-resolution","display_name":"High resolution","score":0.42863017320632935},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.115165114402771},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.09000390768051147},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.08614897727966309},{"id":"https://openalex.org/keywords/remote-sensing","display_name":"Remote sensing","score":0.05725187063217163}],"concepts":[{"id":"https://openalex.org/C77618280","wikidata":"https://www.wikidata.org/wiki/Q1155772","display_name":"Scheme (mathematics)","level":2,"score":0.6110334396362305},{"id":"https://openalex.org/C138268822","wikidata":"https://www.wikidata.org/wiki/Q1051925","display_name":"Resolution (logic)","level":2,"score":0.5602239966392517},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5588884949684143},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5091566443443298},{"id":"https://openalex.org/C3020199158","wikidata":"https://www.wikidata.org/wiki/Q210521","display_name":"High resolution","level":2,"score":0.42863017320632935},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.115165114402771},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.09000390768051147},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.08614897727966309},{"id":"https://openalex.org/C62649853","wikidata":"https://www.wikidata.org/wiki/Q199687","display_name":"Remote sensing","level":1,"score":0.05725187063217163},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/apccas62602.2024.10808969","is_oa":false,"landing_page_url":"https://doi.org/10.1109/apccas62602.2024.10808969","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.41999998688697815}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1967196629","https://openalex.org/W2023256572","https://openalex.org/W2055841712","https://openalex.org/W2497443636","https://openalex.org/W2785794857","https://openalex.org/W3015599398","https://openalex.org/W3021703067","https://openalex.org/W3175213418","https://openalex.org/W4239250096","https://openalex.org/W4390098500","https://openalex.org/W4392502206"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W4391913857","https://openalex.org/W2358668433","https://openalex.org/W4396701345","https://openalex.org/W4212954839","https://openalex.org/W3190051883","https://openalex.org/W4401570279"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"an":[3],"on-chip":[4],"high-resolution":[5],"delay":[6,20,32,93],"measurement":[7,21,33,53],"scheme":[8,54],"for":[9,91],"the":[10,31,37,42,66,74,85,96,116],"through":[11],"silicon":[12],"vias":[13],"(TSVs)":[14],"of":[15,44,46,69,87,122],"3DIC.":[16],"Unlike":[17],"previous":[18],"TSV":[19,92],"schemes":[22],"that":[23,55,81],"tend":[24],"to":[25],"include":[26],"some":[27],"logic":[28],"gates":[29],"in":[30,41],"results":[34,72],"and":[35,63,95,102,119],"hence":[36],"resolution":[38,86,118],"is":[39,105],"often":[40],"range":[43],"hundreds":[45],"pico-seconds,":[47],"we":[48,82],"develop":[49],"a":[50,88],"novel":[51],"ring-oscillaor":[52],"can":[56,83],"systematically":[57],"cancel":[58],"out":[59],"all":[60],"gate":[61],"delays":[62,68],"leave":[64],"only":[65,106],"routing":[67],"TSVs.":[70],"Experimental":[71],"on":[73],"TSMC":[75],"40":[76],"nm":[77],"process":[78,111],"technology":[79],"show":[80],"achieve":[84],"few":[89],"picoseconds":[90],"measurement,":[94],"maximum":[97],"error":[98],"between":[99],"our":[100,123],"method":[101],"SPICE":[103],"simulation":[104],"0.19":[107],"ps":[108],"even":[109],"with":[110],"variation":[112],"considered,":[113],"which":[114],"demonstrates":[115],"high":[117,120],"accuracy":[121],"method.":[124]},"counts_by_year":[],"updated_date":"2025-12-27T23:08:20.325037","created_date":"2025-10-10T00:00:00"}