{"id":"https://openalex.org/W2574724564","doi":"https://doi.org/10.1109/apccas.2016.7804061","title":"Self-contained built-in-self-test/repair transceivers for interconnects in 3DICs","display_name":"Self-contained built-in-self-test/repair transceivers for interconnects in 3DICs","publication_year":2016,"publication_date":"2016-10-01","ids":{"openalex":"https://openalex.org/W2574724564","doi":"https://doi.org/10.1109/apccas.2016.7804061","mag":"2574724564"},"language":"en","primary_location":{"id":"doi:10.1109/apccas.2016.7804061","is_oa":false,"landing_page_url":"https://doi.org/10.1109/apccas.2016.7804061","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5068290446","display_name":"Myat Thu Linn Aung","orcid":"https://orcid.org/0000-0001-7482-2056"},"institutions":[{"id":"https://openalex.org/I172675005","display_name":"Nanyang Technological University","ror":"https://ror.org/02e7b5302","country_code":"SG","type":"education","lineage":["https://openalex.org/I172675005"]}],"countries":["SG"],"is_corresponding":true,"raw_author_name":"Myat Thu Linn Aung","raw_affiliation_strings":["Sch. of EEE, Nanyang Technological University, Singapore"],"affiliations":[{"raw_affiliation_string":"Sch. of EEE, Nanyang Technological University, Singapore","institution_ids":["https://openalex.org/I172675005"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5013775632","display_name":"Tony T. Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I172675005","display_name":"Nanyang Technological University","ror":"https://ror.org/02e7b5302","country_code":"SG","type":"education","lineage":["https://openalex.org/I172675005"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Tony T. Kim","raw_affiliation_strings":["VIRTUS, School of EEE, Nanyang Technological University, Singapore"],"affiliations":[{"raw_affiliation_string":"VIRTUS, School of EEE, Nanyang Technological University, Singapore","institution_ids":["https://openalex.org/I172675005"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5068290446"],"corresponding_institution_ids":["https://openalex.org/I172675005"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.15615738,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"94","issue":null,"first_page":"640","last_page":"641"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/transceiver","display_name":"Transceiver","score":0.774388313293457},{"id":"https://openalex.org/keywords/built-in-self-test","display_name":"Built-in self-test","score":0.6569693088531494},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.6041122674942017},{"id":"https://openalex.org/keywords/ohmic-contact","display_name":"Ohmic contact","score":0.5802410244941711},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5003914833068848},{"id":"https://openalex.org/keywords/capacitive-coupling","display_name":"Capacitive coupling","score":0.4983973503112793},{"id":"https://openalex.org/keywords/failure-mode-and-effects-analysis","display_name":"Failure mode and effects analysis","score":0.48264962434768677},{"id":"https://openalex.org/keywords/dual-mode","display_name":"Dual mode","score":0.48020634055137634},{"id":"https://openalex.org/keywords/capacitive-sensing","display_name":"Capacitive sensing","score":0.46850186586380005},{"id":"https://openalex.org/keywords/dual","display_name":"Dual (grammatical number)","score":0.467363566160202},{"id":"https://openalex.org/keywords/wire-bonding","display_name":"Wire bonding","score":0.46610507369041443},{"id":"https://openalex.org/keywords/mode","display_name":"Mode (computer interface)","score":0.45742782950401306},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4198681712150574},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.41691094636917114},{"id":"https://openalex.org/keywords/face","display_name":"Face (sociological concept)","score":0.41237160563468933},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3644030690193176},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.35901010036468506},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3466927409172058},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.27426671981811523},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.17052823305130005},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.15848177671432495},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.137436181306839},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.1335260570049286},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.12367701530456543},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.11383858323097229},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.09458008408546448}],"concepts":[{"id":"https://openalex.org/C7720470","wikidata":"https://www.wikidata.org/wiki/Q954187","display_name":"Transceiver","level":3,"score":0.774388313293457},{"id":"https://openalex.org/C2780980493","wikidata":"https://www.wikidata.org/wiki/Q181142","display_name":"Built-in self-test","level":2,"score":0.6569693088531494},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6041122674942017},{"id":"https://openalex.org/C138230450","wikidata":"https://www.wikidata.org/wiki/Q2016597","display_name":"Ohmic contact","level":3,"score":0.5802410244941711},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5003914833068848},{"id":"https://openalex.org/C68278764","wikidata":"https://www.wikidata.org/wiki/Q444167","display_name":"Capacitive coupling","level":3,"score":0.4983973503112793},{"id":"https://openalex.org/C66283442","wikidata":"https://www.wikidata.org/wiki/Q1389268","display_name":"Failure mode and effects analysis","level":2,"score":0.48264962434768677},{"id":"https://openalex.org/C3019325349","wikidata":"https://www.wikidata.org/wiki/Q3874753","display_name":"Dual mode","level":2,"score":0.48020634055137634},{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.46850186586380005},{"id":"https://openalex.org/C2780980858","wikidata":"https://www.wikidata.org/wiki/Q110022","display_name":"Dual (grammatical number)","level":2,"score":0.467363566160202},{"id":"https://openalex.org/C140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","level":3,"score":0.46610507369041443},{"id":"https://openalex.org/C48677424","wikidata":"https://www.wikidata.org/wiki/Q6888088","display_name":"Mode (computer interface)","level":2,"score":0.45742782950401306},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4198681712150574},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.41691094636917114},{"id":"https://openalex.org/C2779304628","wikidata":"https://www.wikidata.org/wiki/Q3503480","display_name":"Face (sociological concept)","level":2,"score":0.41237160563468933},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3644030690193176},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.35901010036468506},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3466927409172058},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.27426671981811523},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.17052823305130005},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.15848177671432495},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.137436181306839},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.1335260570049286},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.12367701530456543},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.11383858323097229},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.09458008408546448},{"id":"https://openalex.org/C36289849","wikidata":"https://www.wikidata.org/wiki/Q34749","display_name":"Social science","level":1,"score":0.0},{"id":"https://openalex.org/C124952713","wikidata":"https://www.wikidata.org/wiki/Q8242","display_name":"Literature","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C142362112","wikidata":"https://www.wikidata.org/wiki/Q735","display_name":"Art","level":0,"score":0.0},{"id":"https://openalex.org/C144024400","wikidata":"https://www.wikidata.org/wiki/Q21201","display_name":"Sociology","level":0,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/apccas.2016.7804061","is_oa":false,"landing_page_url":"https://doi.org/10.1109/apccas.2016.7804061","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":2,"referenced_works":["https://openalex.org/W2125118018","https://openalex.org/W2137893918"],"related_works":["https://openalex.org/W2038727579","https://openalex.org/W4200112421","https://openalex.org/W2169607299","https://openalex.org/W2372280005","https://openalex.org/W2067470011","https://openalex.org/W2028653720","https://openalex.org/W4363675227","https://openalex.org/W2078115537","https://openalex.org/W2081788405","https://openalex.org/W2069097390"],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"we":[3],"propose":[4],"self-contained":[5],"built-in-self-test/repair":[6],"(BIST/R)":[7],"solutions":[8],"to":[9,25],"improve":[10],"the":[11,14,33,45],"reliability":[12],"of":[13],"direct":[15],"face-to-face":[16],"copper":[17],"thermo-compression":[18],"bonding":[19,34,46],"A":[20],"dual-mode":[21],"transceiver":[22],"is":[23,47],"presented":[24],"operate":[26],"either":[27],"as":[28,39],"an":[29],"ohmic":[30],"mode":[31,43],"when":[32,44],"has":[35],"low":[36],"resistance":[37],"or":[38],"a":[40],"capacitive":[41],"coupling":[42],"faulty":[48],"showing":[49],"high":[50],"resistance.":[51]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}