{"id":"https://openalex.org/W2069748295","doi":"https://doi.org/10.1109/apccas.2014.7032750","title":"Live demonstration: A 3D die-level integration platform","display_name":"Live demonstration: A 3D die-level integration platform","publication_year":2014,"publication_date":"2014-11-01","ids":{"openalex":"https://openalex.org/W2069748295","doi":"https://doi.org/10.1109/apccas.2014.7032750","mag":"2069748295"},"language":"en","primary_location":{"id":"doi:10.1109/apccas.2014.7032750","is_oa":false,"landing_page_url":"https://doi.org/10.1109/apccas.2014.7032750","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5039735116","display_name":"Chih-Chyau Yang","orcid":"https://orcid.org/0000-0001-6508-8160"},"institutions":[{"id":"https://openalex.org/I4210166867","display_name":"National Institutes of Applied Research","ror":"https://ror.org/05wcstg80","country_code":"TW","type":"government","lineage":["https://openalex.org/I4210128167","https://openalex.org/I4210166867"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chih-Chyau Yang","raw_affiliation_strings":["National Chip Implementation Center, National Applied Research Laboratories, Hsinchu, Taiwan","National Chip Implementation Center, National Applied Research Laboratories, Hsinchu, 300 Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Chip Implementation Center, National Applied Research Laboratories, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210166867"]},{"raw_affiliation_string":"National Chip Implementation Center, National Applied Research Laboratories, Hsinchu, 300 Taiwan","institution_ids":["https://openalex.org/I4210166867"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100365628","display_name":"Yijun Liu","orcid":"https://orcid.org/0000-0002-5272-6570"},"institutions":[{"id":"https://openalex.org/I4210166867","display_name":"National Institutes of Applied Research","ror":"https://ror.org/05wcstg80","country_code":"TW","type":"government","lineage":["https://openalex.org/I4210128167","https://openalex.org/I4210166867"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yi-Jun Liu","raw_affiliation_strings":["National Chip Implementation Center, National Applied Research Laboratories, Hsinchu, Taiwan","National Chip Implementation Center, National Applied Research Laboratories, Hsinchu, 300 Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Chip Implementation Center, National Applied Research Laboratories, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210166867"]},{"raw_affiliation_string":"National Chip Implementation Center, National Applied Research Laboratories, Hsinchu, 300 Taiwan","institution_ids":["https://openalex.org/I4210166867"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103047746","display_name":"Chien\u2010Ming Wu","orcid":"https://orcid.org/0000-0001-9295-7181"},"institutions":[{"id":"https://openalex.org/I4210166867","display_name":"National Institutes of Applied Research","ror":"https://ror.org/05wcstg80","country_code":"TW","type":"government","lineage":["https://openalex.org/I4210128167","https://openalex.org/I4210166867"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chien-Ming Wu","raw_affiliation_strings":["National Chip Implementation Center, National Applied Research Laboratories, Hsinchu, Taiwan","National Chip Implementation Center, National Applied Research Laboratories, Hsinchu, 300 Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Chip Implementation Center, National Applied Research Laboratories, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210166867"]},{"raw_affiliation_string":"National Chip Implementation Center, National Applied Research Laboratories, Hsinchu, 300 Taiwan","institution_ids":["https://openalex.org/I4210166867"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5111606262","display_name":"Chun-Ming Huang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210166867","display_name":"National Institutes of Applied Research","ror":"https://ror.org/05wcstg80","country_code":"TW","type":"government","lineage":["https://openalex.org/I4210128167","https://openalex.org/I4210166867"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chun-Ming Huang","raw_affiliation_strings":["National Chip Implementation Center, National Applied Research Laboratories, Hsinchu, Taiwan","National Chip Implementation Center, National Applied Research Laboratories, Hsinchu, 300 Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Chip Implementation Center, National Applied Research Laboratories, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210166867"]},{"raw_affiliation_string":"National Chip Implementation Center, National Applied Research Laboratories, Hsinchu, 300 Taiwan","institution_ids":["https://openalex.org/I4210166867"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.1135646,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"179","last_page":"180"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9965000152587891,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10904","display_name":"Embedded Systems Design Techniques","score":0.9959999918937683,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.6759417653083801},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6106625199317932},{"id":"https://openalex.org/keywords/frame","display_name":"Frame (networking)","score":0.5690873861312866},{"id":"https://openalex.org/keywords/connection","display_name":"Connection (principal bundle)","score":0.5330407023429871},{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.5190120935440063},{"id":"https://openalex.org/keywords/partition","display_name":"Partition (number theory)","score":0.45597681403160095},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.38691458106040955},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.36941462755203247},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.285614550113678},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.1738278567790985},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.14170610904693604},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.09758144617080688}],"concepts":[{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.6759417653083801},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6106625199317932},{"id":"https://openalex.org/C126042441","wikidata":"https://www.wikidata.org/wiki/Q1324888","display_name":"Frame (networking)","level":2,"score":0.5690873861312866},{"id":"https://openalex.org/C13355873","wikidata":"https://www.wikidata.org/wiki/Q2920850","display_name":"Connection (principal bundle)","level":2,"score":0.5330407023429871},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.5190120935440063},{"id":"https://openalex.org/C42812","wikidata":"https://www.wikidata.org/wiki/Q1082910","display_name":"Partition (number theory)","level":2,"score":0.45597681403160095},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.38691458106040955},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.36941462755203247},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.285614550113678},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.1738278567790985},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.14170610904693604},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.09758144617080688},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C114614502","wikidata":"https://www.wikidata.org/wiki/Q76592","display_name":"Combinatorics","level":1,"score":0.0},{"id":"https://openalex.org/C129307140","wikidata":"https://www.wikidata.org/wiki/Q6795880","display_name":"Maximum bubble pressure method","level":3,"score":0.0},{"id":"https://openalex.org/C157915830","wikidata":"https://www.wikidata.org/wiki/Q2928001","display_name":"Bubble","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/apccas.2014.7032750","is_oa":false,"landing_page_url":"https://doi.org/10.1109/apccas.2014.7032750","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":1,"referenced_works":["https://openalex.org/W1998352674"],"related_works":["https://openalex.org/W2042913821","https://openalex.org/W2372289614","https://openalex.org/W2629813803","https://openalex.org/W2041067810","https://openalex.org/W2250518232","https://openalex.org/W587735977","https://openalex.org/W3199170188","https://openalex.org/W2360137025","https://openalex.org/W2362738566","https://openalex.org/W2469843853"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"a":[3,72],"three-dimensional":[4],"(3D)":[5],"die-level":[6,65],"integration":[7,30],"platform,":[8],"MorPACK.":[9],"The":[10],"structure":[11],"of":[12],"MorPACK":[13,26,41,69,83,97],"is":[14],"3D":[15],"stacked":[16],"by":[17,46,55],"the":[18,40,47,53,58,64,68,88,96],"connection":[19],"modules":[20],"and":[21,36,51,71,80],"circuit":[22],"modules.":[23],"It":[24],"makes":[25],"platform":[27,84],"own":[28],"heterogeneous":[29],"capabilities.":[31],"With":[32],"proper":[33],"system":[34,42,77],"partition":[35],"tri-state":[37],"interface":[38],"connection,":[39],"can":[43,90],"be":[44],"extended":[45],"peripheral":[48],"interfaces":[49],"efficiently":[50],"alternate":[52],"functions":[54],"only":[56],"updating":[57],"bare":[59],"die/module.":[60],"In":[61],"this":[62],"paper,":[63],"functional":[66],"substrates,":[67],"modules,":[70],"digital":[73],"photo":[74],"frame":[75],"demo":[76],"are":[78],"demonstrated":[79],"run":[81],"with":[82,95],"to":[85],"show":[86],"how":[87],"academics/industries":[89],"prototype":[91],"their":[92],"circuits/system":[93],"design":[94],"platform.":[98]},"counts_by_year":[],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}