{"id":"https://openalex.org/W2101678414","doi":"https://doi.org/10.1109/apccas.2010.5775098","title":"An improved I/O buffer correlation methodology between silicon and the SPICE model","display_name":"An improved I/O buffer correlation methodology between silicon and the SPICE model","publication_year":2010,"publication_date":"2010-12-01","ids":{"openalex":"https://openalex.org/W2101678414","doi":"https://doi.org/10.1109/apccas.2010.5775098","mag":"2101678414"},"language":"en","primary_location":{"id":"doi:10.1109/apccas.2010.5775098","is_oa":false,"landing_page_url":"https://doi.org/10.1109/apccas.2010.5775098","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE Asia Pacific Conference on Circuits and Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5033060935","display_name":"Chen Leong Lai","orcid":null},"institutions":[{"id":"https://openalex.org/I22433950","display_name":"Altera (United States)","ror":"https://ror.org/017b7j426","country_code":"US","type":"company","lineage":["https://openalex.org/I22433950"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Chen Leong Lai","raw_affiliation_strings":["Altera Corporation (M) Sdn. Bhd., Plot 6 Bayan Lepas Technoplex, Medan Bayan Lepas, 11900 Penang. Malaysia","Altera Corporation (M) Sdn. Bhd., Plot 6, Bayan Lepas Technoplex, Medan Bayan Lepas, 11900 Penang, Malaysia"],"affiliations":[{"raw_affiliation_string":"Altera Corporation (M) Sdn. Bhd., Plot 6 Bayan Lepas Technoplex, Medan Bayan Lepas, 11900 Penang. Malaysia","institution_ids":["https://openalex.org/I22433950"]},{"raw_affiliation_string":"Altera Corporation (M) Sdn. Bhd., Plot 6, Bayan Lepas Technoplex, Medan Bayan Lepas, 11900 Penang, Malaysia","institution_ids":["https://openalex.org/I22433950"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036764439","display_name":"Hour Ying See","orcid":null},"institutions":[{"id":"https://openalex.org/I22433950","display_name":"Altera (United States)","ror":"https://ror.org/017b7j426","country_code":"US","type":"company","lineage":["https://openalex.org/I22433950"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Hour Ying See","raw_affiliation_strings":["Altera Corporation (M) Sdn. Bhd., Plot 6 Bayan Lepas Technoplex, Medan Bayan Lepas, 11900 Penang. Malaysia","Altera Corporation (M) Sdn. Bhd., Plot 6, Bayan Lepas Technoplex, Medan Bayan Lepas, 11900 Penang, Malaysia"],"affiliations":[{"raw_affiliation_string":"Altera Corporation (M) Sdn. Bhd., Plot 6 Bayan Lepas Technoplex, Medan Bayan Lepas, 11900 Penang. Malaysia","institution_ids":["https://openalex.org/I22433950"]},{"raw_affiliation_string":"Altera Corporation (M) Sdn. Bhd., Plot 6, Bayan Lepas Technoplex, Medan Bayan Lepas, 11900 Penang, Malaysia","institution_ids":["https://openalex.org/I22433950"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5007407932","display_name":"Seong Fong Chee","orcid":null},"institutions":[{"id":"https://openalex.org/I22433950","display_name":"Altera (United States)","ror":"https://ror.org/017b7j426","country_code":"US","type":"company","lineage":["https://openalex.org/I22433950"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Seong Fong Chee","raw_affiliation_strings":["Altera Corporation (M) Sdn. Bhd., Plot 6 Bayan Lepas Technoplex, Medan Bayan Lepas, 11900 Penang. Malaysia","Altera Corporation (M) Sdn. Bhd., Plot 6, Bayan Lepas Technoplex, Medan Bayan Lepas, 11900 Penang, Malaysia"],"affiliations":[{"raw_affiliation_string":"Altera Corporation (M) Sdn. Bhd., Plot 6 Bayan Lepas Technoplex, Medan Bayan Lepas, 11900 Penang. Malaysia","institution_ids":["https://openalex.org/I22433950"]},{"raw_affiliation_string":"Altera Corporation (M) Sdn. Bhd., Plot 6, Bayan Lepas Technoplex, Medan Bayan Lepas, 11900 Penang, Malaysia","institution_ids":["https://openalex.org/I22433950"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5051354973","display_name":"Wei Lo Wei","orcid":null},"institutions":[{"id":"https://openalex.org/I22433950","display_name":"Altera (United States)","ror":"https://ror.org/017b7j426","country_code":"US","type":"company","lineage":["https://openalex.org/I22433950"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Wei Lo Wei","raw_affiliation_strings":["Altera Corporation (M) Sdn. Bhd., Plot 6 Bayan Lepas Technoplex, Medan Bayan Lepas, 11900 Penang. Malaysia","Altera Corporation (M) Sdn. Bhd., Plot 6, Bayan Lepas Technoplex, Medan Bayan Lepas, 11900 Penang, Malaysia"],"affiliations":[{"raw_affiliation_string":"Altera Corporation (M) Sdn. Bhd., Plot 6 Bayan Lepas Technoplex, Medan Bayan Lepas, 11900 Penang. Malaysia","institution_ids":["https://openalex.org/I22433950"]},{"raw_affiliation_string":"Altera Corporation (M) Sdn. Bhd., Plot 6, Bayan Lepas Technoplex, Medan Bayan Lepas, 11900 Penang, Malaysia","institution_ids":["https://openalex.org/I22433950"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5033060935"],"corresponding_institution_ids":["https://openalex.org/I22433950"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.15046581,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"1","issue":null,"first_page":"999","last_page":"1002"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9768999814987183,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9768999814987183,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9735999703407288,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9520999789237976,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/spice","display_name":"Spice","score":0.9037421941757202},{"id":"https://openalex.org/keywords/ibis","display_name":"Ibis","score":0.8892456293106079},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6520291566848755},{"id":"https://openalex.org/keywords/timeline","display_name":"Timeline","score":0.5949875116348267},{"id":"https://openalex.org/keywords/netlist","display_name":"Netlist","score":0.5528693199157715},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5054068565368652},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.4599423110485077},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3767353296279907},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.28334081172943115},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2095150351524353}],"concepts":[{"id":"https://openalex.org/C2780077345","wikidata":"https://www.wikidata.org/wiki/Q16891888","display_name":"Spice","level":2,"score":0.9037421941757202},{"id":"https://openalex.org/C2780698032","wikidata":"https://www.wikidata.org/wiki/Q193833","display_name":"Ibis","level":2,"score":0.8892456293106079},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6520291566848755},{"id":"https://openalex.org/C4438859","wikidata":"https://www.wikidata.org/wiki/Q186117","display_name":"Timeline","level":2,"score":0.5949875116348267},{"id":"https://openalex.org/C177650935","wikidata":"https://www.wikidata.org/wiki/Q1760303","display_name":"Netlist","level":2,"score":0.5528693199157715},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5054068565368652},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.4599423110485077},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3767353296279907},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.28334081172943115},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2095150351524353},{"id":"https://openalex.org/C166957645","wikidata":"https://www.wikidata.org/wiki/Q23498","display_name":"Archaeology","level":1,"score":0.0},{"id":"https://openalex.org/C95457728","wikidata":"https://www.wikidata.org/wiki/Q309","display_name":"History","level":0,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/apccas.2010.5775098","is_oa":false,"landing_page_url":"https://doi.org/10.1109/apccas.2010.5775098","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE Asia Pacific Conference on Circuits and Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6200000047683716,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":2,"referenced_works":["https://openalex.org/W1594820472","https://openalex.org/W2111472801"],"related_works":["https://openalex.org/W4232600088","https://openalex.org/W1858249912","https://openalex.org/W2170314243","https://openalex.org/W2114034199","https://openalex.org/W2119179026","https://openalex.org/W2794947590","https://openalex.org/W4239926154","https://openalex.org/W4237774341","https://openalex.org/W2317428717","https://openalex.org/W2023095720"],"abstract_inverted_index":{"High-performance":[0],"systems":[1],"that":[2,138],"involve":[3],"tightly-constrained":[4],"design":[5,19],"parameters":[6],"create":[7],"significant":[8],"challenges":[9],"for":[10],"board":[11,24],"designers.":[12],"The":[13,162],"ability":[14],"to":[15,104,120,132,154,179,188],"simulate":[16],"a":[17,27,34,41,59,102],"complex":[18],"before":[20],"laying":[21],"out":[22,131],"the":[23,31,37,45,54,68,74,98,134,168,182],"has":[25],"become":[26],"critical":[28],"factor":[29],"in":[30,148,158],"success":[32],"of":[33,47,62,83,101],"project.":[35],"From":[36],"manufacturers'":[38],"standpoint,":[39],"releasing":[40],"SPICE":[42,69,75],"model":[43,76,103,114,187],"involves":[44],"risk":[46],"exposing":[48],"confidential":[49],"circuit":[50],"netlists.":[51],"Altera":[52,166],"provides":[53],"IBIS":[55,84,160,186],"model,":[56],"which":[57],"is":[58,123],"behavioral":[60],"method":[61],"modeling":[63,95,141],"I/O":[64,110],"buffers":[65],"derived":[66],"from":[67,117],"model.":[70,161],"Extensive":[71],"correlation":[72,88,115,127,172],"between":[73],"and":[77,81,90,146,167,181],"silicon":[78,112],"increases":[79],"reliability":[80],"accuracy":[82],"generation.":[85],"However,":[86],"long":[87],"timeline":[89],"various":[91],"factors":[92],"such":[93],"as":[94],"complexity":[96],"jeopardize":[97],"timely":[99],"release":[100],"customers.":[105,189],"This":[106],"paper":[107],"demonstrates":[108],"Altera's":[109],"buffer":[111],"versus":[113],"evolution":[116],"its":[118],"infancy":[119],"where":[121],"it":[122],"today.":[124],"Research":[125],"on":[126],"methodology":[128],"was":[129],"carried":[130],"minimize":[133],"PCB":[135],"interconnect":[136],"effect":[137],"complicates":[139],"these":[140],"efforts.":[142],"Statistical":[143],"data":[144],"collection":[145],"analysis":[147],"an":[149],"automated":[150],"environment":[151],"adds":[152],"value":[153],"increase":[155],"customers'":[156],"confidence":[157],"our":[159],"simplification":[163],"efforts":[164],"benefit":[165],"industry":[169],"by":[170],"increasing":[171],"efficiencies,":[173],"reducing":[174],"material":[175],"costs,":[176],"improved":[177],"time":[178],"market,":[180],"providing":[183],"highly":[184],"reliable":[185]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}