{"id":"https://openalex.org/W2130836398","doi":"https://doi.org/10.1109/apccas.2010.5774908","title":"Design issues and optimization in DisplayPort link layer implementation","display_name":"Design issues and optimization in DisplayPort link layer implementation","publication_year":2010,"publication_date":"2010-12-01","ids":{"openalex":"https://openalex.org/W2130836398","doi":"https://doi.org/10.1109/apccas.2010.5774908","mag":"2130836398"},"language":"en","primary_location":{"id":"doi:10.1109/apccas.2010.5774908","is_oa":false,"landing_page_url":"https://doi.org/10.1109/apccas.2010.5774908","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE Asia Pacific Conference on Circuits and Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5103525001","display_name":"Jae\u2010Geun Oh","orcid":null},"institutions":[{"id":"https://openalex.org/I197347611","display_name":"Korea University","ror":"https://ror.org/047dqcg40","country_code":"KR","type":"education","lineage":["https://openalex.org/I197347611"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Jaegeun Oh","raw_affiliation_strings":["School of Electrical Engineering, Korea University, Seoul, South Korea","School of Electrical Engineering, Korea University, Seoul 136-701, South Korea"],"affiliations":[{"raw_affiliation_string":"School of Electrical Engineering, Korea University, Seoul, South Korea","institution_ids":["https://openalex.org/I197347611"]},{"raw_affiliation_string":"School of Electrical Engineering, Korea University, Seoul 136-701, South Korea","institution_ids":["https://openalex.org/I197347611"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5005365762","display_name":"Seon Wook Kim","orcid":"https://orcid.org/0000-0001-6555-1741"},"institutions":[{"id":"https://openalex.org/I197347611","display_name":"Korea University","ror":"https://ror.org/047dqcg40","country_code":"KR","type":"education","lineage":["https://openalex.org/I197347611"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Seon Wook Kim","raw_affiliation_strings":["School of Electrical Engineering, Korea University, Seoul, South Korea","School of Electrical Engineering, Korea University, Seoul 136-701, South Korea"],"affiliations":[{"raw_affiliation_string":"School of Electrical Engineering, Korea University, Seoul, South Korea","institution_ids":["https://openalex.org/I197347611"]},{"raw_affiliation_string":"School of Electrical Engineering, Korea University, Seoul 136-701, South Korea","institution_ids":["https://openalex.org/I197347611"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100671803","display_name":"Taejin Kim","orcid":"https://orcid.org/0000-0003-0758-8823"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Taejin Kim","raw_affiliation_strings":["DOESTEK Corporation, Seoul, South Korea","DOESTEK Corporation, Techno Complex Building #606, Seoul 136-701, South Korea"],"affiliations":[{"raw_affiliation_string":"DOESTEK Corporation, Seoul, South Korea","institution_ids":[]},{"raw_affiliation_string":"DOESTEK Corporation, Techno Complex Building #606, Seoul 136-701, South Korea","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5103525001"],"corresponding_institution_ids":["https://openalex.org/I197347611"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.21227301,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"1","issue":null,"first_page":"188","last_page":"191"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11408","display_name":"Advanced Optical Imaging Technologies","score":0.9599000215530396,"subfield":{"id":"https://openalex.org/subfields/2214","display_name":"Media Technology"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11408","display_name":"Advanced Optical Imaging Technologies","score":0.9599000215530396,"subfield":{"id":"https://openalex.org/subfields/2214","display_name":"Media Technology"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.7203714847564697},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.6022774577140808},{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.5489731431007385},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.47802671790122986},{"id":"https://openalex.org/keywords/transmission","display_name":"Transmission (telecommunications)","score":0.4778330326080322},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.47587624192237854},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.4386865496635437},{"id":"https://openalex.org/keywords/user-interface","display_name":"User interface","score":0.41713398694992065},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.3010314702987671},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.2128089964389801},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.14221221208572388}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7203714847564697},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.6022774577140808},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.5489731431007385},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.47802671790122986},{"id":"https://openalex.org/C761482","wikidata":"https://www.wikidata.org/wiki/Q118093","display_name":"Transmission (telecommunications)","level":2,"score":0.4778330326080322},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.47587624192237854},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.4386865496635437},{"id":"https://openalex.org/C89505385","wikidata":"https://www.wikidata.org/wiki/Q47146","display_name":"User interface","level":2,"score":0.41713398694992065},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.3010314702987671},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.2128089964389801},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.14221221208572388},{"id":"https://openalex.org/C178790620","wikidata":"https://www.wikidata.org/wiki/Q11351","display_name":"Organic chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C129307140","wikidata":"https://www.wikidata.org/wiki/Q6795880","display_name":"Maximum bubble pressure method","level":3,"score":0.0},{"id":"https://openalex.org/C157915830","wikidata":"https://www.wikidata.org/wiki/Q2928001","display_name":"Bubble","level":2,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/apccas.2010.5774908","is_oa":false,"landing_page_url":"https://doi.org/10.1109/apccas.2010.5774908","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE Asia Pacific Conference on Circuits and Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.5699999928474426,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2378005410","https://openalex.org/W2170435352","https://openalex.org/W2048876619","https://openalex.org/W1979131826","https://openalex.org/W2370066713","https://openalex.org/W1984979050","https://openalex.org/W2978161533","https://openalex.org/W2379338802","https://openalex.org/W1649706580","https://openalex.org/W3195608031"],"abstract_inverted_index":{"Nowadays,":[0],"the":[1,21,27,43,78,83],"advanced":[2],"digital":[3],"display":[4,7,28,59],"technology":[5],"makes":[6],"devices":[8,29],"support":[9,20],"extreme":[10],"high":[11,33,53],"quality":[12],"video":[13,36],"like":[14],"full":[15],"HD.":[16],"In":[17,61],"order":[18],"to":[19,51,72],"quality,":[22],"a":[23,32,74],"communication":[24],"interface":[25,80],"of":[26,42,77,88],"must":[30],"provide":[31],"bandwidth":[34],"in":[35],"transmission.":[37],"The":[38],"DisplayPort,":[39],"as":[40,47],"one":[41],"solutions,":[44],"was":[45],"proposed":[46],"an":[48],"industry":[49],"standard":[50,85],"transmit":[52],"color":[54],"depths,":[55],"refresh":[56],"rates":[57],"and":[58,100],"resolution.":[60],"this":[62],"paper,":[63],"we":[64,91],"present":[65],"several":[66],"optimization":[67],"methods":[68],"from":[69],"our":[70,94],"experience":[71],"prototype":[73],"datalink":[75],"layer":[76],"DisplayPort":[79,84],"based":[81],"on":[82],"version":[86],"1.1a":[87],"VESA.":[89],"Also,":[90],"show":[92],"that":[93],"system":[95],"consumes":[96],"205.3K":[97],"logic":[98],"cells":[99],"55.6mW":[101],"power":[102],"with":[103],"Samsung":[104],"0.13um":[105],"library.":[106]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}