{"id":"https://openalex.org/W2144320893","doi":"https://doi.org/10.1109/apccas.2008.4746079","title":"A design of CMOS bandgap reference with low thermal drift and low offset","display_name":"A design of CMOS bandgap reference with low thermal drift and low offset","publication_year":2008,"publication_date":"2008-11-01","ids":{"openalex":"https://openalex.org/W2144320893","doi":"https://doi.org/10.1109/apccas.2008.4746079","mag":"2144320893"},"language":"en","primary_location":{"id":"doi:10.1109/apccas.2008.4746079","is_oa":false,"landing_page_url":"https://doi.org/10.1109/apccas.2008.4746079","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"APCCAS 2008 - 2008 IEEE Asia Pacific Conference on Circuits and Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100893600","display_name":"Fang-Jie Luo","orcid":null},"institutions":[{"id":"https://openalex.org/I16365422","display_name":"Hefei University of Technology","ror":"https://ror.org/02czkny70","country_code":"CN","type":"education","lineage":["https://openalex.org/I16365422"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fang-Jie Luo","raw_affiliation_strings":["Inst. of VLSI Design, Hefei Univ. of Technol., Hefei"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Inst. of VLSI Design, Hefei Univ. of Technol., Hefei","institution_ids":["https://openalex.org/I16365422"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5003303436","display_name":"Honghui Deng","orcid":"https://orcid.org/0000-0002-5549-623X"},"institutions":[{"id":"https://openalex.org/I16365422","display_name":"Hefei University of Technology","ror":"https://ror.org/02czkny70","country_code":"CN","type":"education","lineage":["https://openalex.org/I16365422"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Hong-Hui Deng","raw_affiliation_strings":["Inst. of VLSI Design, Hefei Univ. of Technol., Hefei"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Inst. of VLSI Design, Hefei Univ. of Technol., Hefei","institution_ids":["https://openalex.org/I16365422"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5111823007","display_name":"Minglun Gao","orcid":null},"institutions":[{"id":"https://openalex.org/I16365422","display_name":"Hefei University of Technology","ror":"https://ror.org/02czkny70","country_code":"CN","type":"education","lineage":["https://openalex.org/I16365422"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ming-Lun Gao","raw_affiliation_strings":["Inst. of VLSI Design, Hefei Univ. of Technol., Hefei"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Inst. of VLSI Design, Hefei Univ. of Technol., Hefei","institution_ids":["https://openalex.org/I16365422"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.5002,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.71083455,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":"1","issue":null,"first_page":"538","last_page":"541"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10323","display_name":"Analog and Mixed-Signal Circuit Design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10323","display_name":"Analog and Mixed-Signal Circuit Design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12564","display_name":"Sensor Technology and Measurement Systems","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/bandgap-voltage-reference","display_name":"Bandgap voltage reference","score":0.9727166295051575},{"id":"https://openalex.org/keywords/power-supply-rejection-ratio","display_name":"Power supply rejection ratio","score":0.6542764902114868},{"id":"https://openalex.org/keywords/resistor","display_name":"Resistor","score":0.6433373689651489},{"id":"https://openalex.org/keywords/temperature-coefficient","display_name":"Temperature coefficient","score":0.6170284748077393},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.6027562022209167},{"id":"https://openalex.org/keywords/voltage-reference","display_name":"Voltage reference","score":0.5935542583465576},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5671157240867615},{"id":"https://openalex.org/keywords/offset","display_name":"Offset (computer science)","score":0.5226359367370605},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.5085047483444214},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.5023257732391357},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.48792192339897156},{"id":"https://openalex.org/keywords/silicon-bandgap-temperature-sensor","display_name":"Silicon bandgap temperature sensor","score":0.4583016037940979},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4087613821029663},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3493040204048157},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.26608806848526},{"id":"https://openalex.org/keywords/dropout-voltage","display_name":"Dropout voltage","score":0.23424458503723145},{"id":"https://openalex.org/keywords/amplifier","display_name":"Amplifier","score":0.09230396151542664}],"concepts":[{"id":"https://openalex.org/C127033052","wikidata":"https://www.wikidata.org/wiki/Q48635","display_name":"Bandgap voltage reference","level":5,"score":0.9727166295051575},{"id":"https://openalex.org/C15892472","wikidata":"https://www.wikidata.org/wiki/Q1482413","display_name":"Power supply rejection ratio","level":4,"score":0.6542764902114868},{"id":"https://openalex.org/C137488568","wikidata":"https://www.wikidata.org/wiki/Q5321","display_name":"Resistor","level":3,"score":0.6433373689651489},{"id":"https://openalex.org/C16643434","wikidata":"https://www.wikidata.org/wiki/Q898642","display_name":"Temperature coefficient","level":2,"score":0.6170284748077393},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.6027562022209167},{"id":"https://openalex.org/C44351266","wikidata":"https://www.wikidata.org/wiki/Q1465532","display_name":"Voltage reference","level":3,"score":0.5935542583465576},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5671157240867615},{"id":"https://openalex.org/C175291020","wikidata":"https://www.wikidata.org/wiki/Q1156822","display_name":"Offset (computer science)","level":2,"score":0.5226359367370605},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.5085047483444214},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.5023257732391357},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.48792192339897156},{"id":"https://openalex.org/C168032602","wikidata":"https://www.wikidata.org/wiki/Q7515014","display_name":"Silicon bandgap temperature sensor","level":5,"score":0.4583016037940979},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4087613821029663},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3493040204048157},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.26608806848526},{"id":"https://openalex.org/C15032970","wikidata":"https://www.wikidata.org/wiki/Q851210","display_name":"Dropout voltage","level":4,"score":0.23424458503723145},{"id":"https://openalex.org/C194257627","wikidata":"https://www.wikidata.org/wiki/Q211554","display_name":"Amplifier","level":3,"score":0.09230396151542664},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/apccas.2008.4746079","is_oa":false,"landing_page_url":"https://doi.org/10.1109/apccas.2008.4746079","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"APCCAS 2008 - 2008 IEEE Asia Pacific Conference on Circuits and Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.8999999761581421}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W1504370941","https://openalex.org/W1566907904","https://openalex.org/W2012962664","https://openalex.org/W2100463091","https://openalex.org/W2134754694","https://openalex.org/W2538293727"],"related_works":["https://openalex.org/W3004564537","https://openalex.org/W2393887177","https://openalex.org/W2384491229","https://openalex.org/W2351074943","https://openalex.org/W2544323617","https://openalex.org/W2370976371","https://openalex.org/W1970992322","https://openalex.org/W2384707532","https://openalex.org/W2363077520","https://openalex.org/W2538177767"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"a":[3],"high":[4],"performance":[5],"bandgap":[6,45,71],"voltage":[7,46,72],"reference,":[8],"together":[9],"with":[10],"the":[11,14,17,32,40,44,50,53,77,84,95,107],"discussion":[12],"of":[13,16,27,43],"principle":[15],"quadratic":[18,33],"temperature":[19,41,96],"compensation.":[20],"The":[21,63],"circuit":[22,58,74],"utilizes":[23],"two":[24],"resistors":[25],"made":[26],"different":[28],"materials":[29],"to":[30,37,75],"compensate":[31],"temperature,":[34],"so":[35],"as":[36],"efficiently":[38],"reduce":[39,49],"drift":[42],"reference.":[47],"To":[48],"offset":[51],"voltage,":[52],"improved":[54],"design":[55],"methods":[56],"for":[57],"and":[59,105],"layout":[60],"are":[61],"introduced.":[62],"cascode":[64],"structure":[65],"is":[66,98],"also":[67],"introduced":[68],"in":[69],"this":[70],"reference":[73],"improve":[76],"power":[78],"supply":[79],"rejection":[80],"ratio":[81],"(PSRR).":[82],"Finally":[83],"simulation":[85],"results":[86],"based":[87],"on":[88],"0.35":[89],"mum":[90],"CMOS":[91],"process":[92],"show":[93],"that":[94],"coefficient":[97],"3.5":[99],"ppm/degC":[100],"And":[101],"after":[102],"MPW":[103],"manufacture":[104],"testing,":[106],"result":[108],"achieves":[109],"our":[110],"targets.":[111]},"counts_by_year":[{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}