{"id":"https://openalex.org/W2169987936","doi":"https://doi.org/10.1109/ahs.2010.5546231","title":"System level self-healing for parametric yield and reliability improvement under power bound","display_name":"System level self-healing for parametric yield and reliability improvement under power bound","publication_year":2010,"publication_date":"2010-06-01","ids":{"openalex":"https://openalex.org/W2169987936","doi":"https://doi.org/10.1109/ahs.2010.5546231","mag":"2169987936"},"language":"en","primary_location":{"id":"doi:10.1109/ahs.2010.5546231","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ahs.2010.5546231","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 NASA/ESA Conference on Adaptive Hardware and Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5004668210","display_name":"Seetharam Narasimhan","orcid":null},"institutions":[{"id":"https://openalex.org/I58956616","display_name":"Case Western Reserve University","ror":"https://ror.org/051fd9666","country_code":"US","type":"education","lineage":["https://openalex.org/I58956616"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. Narasimhan","raw_affiliation_strings":["Department of EECS, Case Western Reserve University, Cleveland, OH, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of EECS, Case Western Reserve University, Cleveland, OH, USA","institution_ids":["https://openalex.org/I58956616"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100619718","display_name":"Sudip Paul","orcid":"https://orcid.org/0000-0001-9856-539X"},"institutions":[{"id":"https://openalex.org/I58956616","display_name":"Case Western Reserve University","ror":"https://ror.org/051fd9666","country_code":"US","type":"education","lineage":["https://openalex.org/I58956616"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. Paul","raw_affiliation_strings":["Department of EECS, Case Western Reserve University, Cleveland, OH, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of EECS, Case Western Reserve University, Cleveland, OH, USA","institution_ids":["https://openalex.org/I58956616"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049426113","display_name":"Rajat Subhra Chakraborty","orcid":"https://orcid.org/0000-0003-3588-163X"},"institutions":[{"id":"https://openalex.org/I58956616","display_name":"Case Western Reserve University","ror":"https://ror.org/051fd9666","country_code":"US","type":"education","lineage":["https://openalex.org/I58956616"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"R. S. Chakraborty","raw_affiliation_strings":["Department of EECS, Case Western Reserve University, Cleveland, OH, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of EECS, Case Western Reserve University, Cleveland, OH, USA","institution_ids":["https://openalex.org/I58956616"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110198567","display_name":"Francis Wolff","orcid":null},"institutions":[{"id":"https://openalex.org/I58956616","display_name":"Case Western Reserve University","ror":"https://ror.org/051fd9666","country_code":"US","type":"education","lineage":["https://openalex.org/I58956616"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"F. Wolff","raw_affiliation_strings":["Department of EECS, Case Western Reserve University, Cleveland, OH, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of EECS, Case Western Reserve University, Cleveland, OH, USA","institution_ids":["https://openalex.org/I58956616"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046620750","display_name":"C. Papachristou","orcid":"https://orcid.org/0000-0002-5399-3208"},"institutions":[{"id":"https://openalex.org/I58956616","display_name":"Case Western Reserve University","ror":"https://ror.org/051fd9666","country_code":"US","type":"education","lineage":["https://openalex.org/I58956616"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"C. Papachristou","raw_affiliation_strings":["Department of EECS, Case Western Reserve University, Cleveland, OH, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of EECS, Case Western Reserve University, Cleveland, OH, USA","institution_ids":["https://openalex.org/I58956616"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022123752","display_name":"Daniel Weyer","orcid":"https://orcid.org/0000-0002-8355-9402"},"institutions":[{"id":"https://openalex.org/I57053284","display_name":"Rockwell Automation (United States)","ror":"https://ror.org/01sx1pm50","country_code":"US","type":"company","lineage":["https://openalex.org/I57053284"]},{"id":"https://openalex.org/I58956616","display_name":"Case Western Reserve University","ror":"https://ror.org/051fd9666","country_code":"US","type":"education","lineage":["https://openalex.org/I58956616"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. J. Weyer","raw_affiliation_strings":["Rockwell Automation, Case Western Reserve University, Cleveland, OH, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Rockwell Automation, Case Western Reserve University, Cleveland, OH, USA","institution_ids":["https://openalex.org/I58956616","https://openalex.org/I57053284"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5039442844","display_name":"Swarup Bhunia","orcid":"https://orcid.org/0000-0001-6082-6961"},"institutions":[{"id":"https://openalex.org/I58956616","display_name":"Case Western Reserve University","ror":"https://ror.org/051fd9666","country_code":"US","type":"education","lineage":["https://openalex.org/I58956616"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. Bhunia","raw_affiliation_strings":["Department of EECS, Case Western Reserve University, Cleveland, OH, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of EECS, Case Western Reserve University, Cleveland, OH, USA","institution_ids":["https://openalex.org/I58956616"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.5885,"has_fulltext":false,"cited_by_count":9,"citation_normalized_percentile":{"value":0.74408229,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"52","last_page":"58"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.7113803625106812},{"id":"https://openalex.org/keywords/parametric-statistics","display_name":"Parametric statistics","score":0.6749470233917236},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.6016111373901367},{"id":"https://openalex.org/keywords/yield","display_name":"Yield (engineering)","score":0.5978167653083801},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4709542691707611},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.46446341276168823},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2566773295402527},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.25026875734329224},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.1881304681301117},{"id":"https://openalex.org/keywords/statistics","display_name":"Statistics","score":0.13980883359909058},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.09504610300064087},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.0717146098613739}],"concepts":[{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.7113803625106812},{"id":"https://openalex.org/C117251300","wikidata":"https://www.wikidata.org/wiki/Q1849855","display_name":"Parametric statistics","level":2,"score":0.6749470233917236},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.6016111373901367},{"id":"https://openalex.org/C134121241","wikidata":"https://www.wikidata.org/wiki/Q899301","display_name":"Yield (engineering)","level":2,"score":0.5978167653083801},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4709542691707611},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.46446341276168823},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2566773295402527},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.25026875734329224},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.1881304681301117},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.13980883359909058},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.09504610300064087},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0717146098613739},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/ahs.2010.5546231","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ahs.2010.5546231","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 NASA/ESA Conference on Adaptive Hardware and Systems","raw_type":"proceedings-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.717.2004","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.717.2004","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://engr.case.edu/bhunia_swarup/papers/C/C73.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.44999998807907104,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":12,"referenced_works":["https://openalex.org/W1968885510","https://openalex.org/W2043318181","https://openalex.org/W2108759610","https://openalex.org/W2117648153","https://openalex.org/W2135100177","https://openalex.org/W2136103183","https://openalex.org/W2138052574","https://openalex.org/W2150526221","https://openalex.org/W2165252892","https://openalex.org/W2169403209","https://openalex.org/W3139678091","https://openalex.org/W3146517309"],"related_works":["https://openalex.org/W2033512842","https://openalex.org/W4322734194","https://openalex.org/W4233600955","https://openalex.org/W2913665393","https://openalex.org/W2369695847","https://openalex.org/W3005535424","https://openalex.org/W2994319598","https://openalex.org/W2047067935","https://openalex.org/W1607054433","https://openalex.org/W2110842462"],"abstract_inverted_index":{"Post-silicon":[0,69],"process":[1,36],"compensation":[2,80],"or":[3,67],"\u201chealing\u201d":[4],"of":[5,28,65,124,153],"integrated":[6],"circuits":[7],"(ICs)":[8],"has":[9,71],"emerged":[10],"as":[11,63,109],"an":[12,110,138],"effective":[13],"approach":[14,171],"to":[15,39,48,54,118,141,156,182],"improve":[16],"yield":[17,176],"and":[18,58,132,159,177],"reliability":[19],"under":[20,101],"parameter":[21,100],"variations.":[22,42],"In":[23,82],"a":[24,87,97,145],"System-on-Chip":[25],"(SoC)":[26],"comprising":[27],"multiple":[29],"cores,":[30],"different":[31,35,50],"cores":[32,45,116,155],"can":[33,172],"experience":[34],"shift":[37],"due":[38],"local":[40],"within-die":[41],"Furthermore,":[43],"the":[44,106,121,128,142,150,154,168],"are":[46],"likely":[47],"have":[49],"sensitivities":[51,152],"with":[52],"respect":[53],"system":[55,59,88,130,157],"power":[56,102,133],"dissipation":[57],"output":[60,99],"parameters":[61],"such":[62],"quality":[64],"service":[66],"throughput.":[68],"healing":[70,90,107,125,170,184],"been":[72],"addressed":[73],"earlier":[74],"at":[75],"core":[76],"level":[77,89],"using":[78,144],"various":[79],"approaches.":[81,185],"this":[83],"paper,":[84],"we":[85,136],"present":[86],"algorithm":[91],"for":[92,96,163],"compensating":[93],"SoC":[94],"chips":[95],"specific":[98],"constraint.":[103],"We":[104],"formulate":[105],"problem":[108,143],"ordinal":[111],"optimization":[112],"problem,":[113],"where":[114],"individual":[115],"need":[117],"be":[119],"assigned":[120],"right":[122],"amount":[123],"that":[126,167],"satisfies":[127],"target":[129],"performance":[131,158],"requirement.":[134],"Next,":[135],"propose":[137],"efficient":[139],"solution":[140],"priori":[146],"design-time":[147],"information":[148],"about":[149],"relative":[151],"power.":[160],"Simulation":[161],"results":[162],"example":[164],"systems":[165],"show":[166],"proposed":[169],"achieve":[173],"higher":[174],"parametric":[175],"better":[178],"settling":[179],"time":[180],"compared":[181],"conventional":[183]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2021,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":1},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}