{"id":"https://openalex.org/W7167731792","doi":"https://doi.org/10.1109/access.2026.3711482","title":"DSRD-YOLO: A Lightweight and High-Precision Framework for PCB Defect Detection","display_name":"DSRD-YOLO: A Lightweight and High-Precision Framework for PCB Defect Detection","publication_year":2026,"publication_date":"2026-01-01","ids":{"openalex":"https://openalex.org/W7167731792","doi":"https://doi.org/10.1109/access.2026.3711482"},"language":"en","primary_location":{"id":"doi:10.1109/access.2026.3711482","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2026.3711482","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://doi.org/10.1109/access.2026.3711482","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5140224354","display_name":"Zhijian Zheng","orcid":null},"institutions":[{"id":"https://openalex.org/I4210122893","display_name":"Wuxi Institute of Arts & Technology","ror":"https://ror.org/03s8wm141","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210122893"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhijian Zheng","raw_affiliation_strings":["Jiangxi Arts & Ceramics Technology Institute"],"raw_orcid":"https://orcid.org/0009-0008-7677-7031","affiliations":[{"raw_affiliation_string":"Jiangxi Arts & Ceramics Technology Institute","institution_ids":["https://openalex.org/I4210122893"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5140280841","display_name":"Bing Li","orcid":"https://orcid.org/0009-0006-0760-0465"},"institutions":[{"id":"https://openalex.org/I4210122893","display_name":"Wuxi Institute of Arts & Technology","ror":"https://ror.org/03s8wm141","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210122893"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Bing Li","raw_affiliation_strings":["Jiangxi Arts & Ceramics Technology Institute"],"raw_orcid":"https://orcid.org/0009-0006-0760-0465","affiliations":[{"raw_affiliation_string":"Jiangxi Arts & Ceramics Technology Institute","institution_ids":["https://openalex.org/I4210122893"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101104304","display_name":"Dongdong Fan","orcid":null},"institutions":[{"id":"https://openalex.org/I4210090502","display_name":"Jiujiang Vocational University","ror":"https://ror.org/00146qx36","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210090502"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Dongdong Fan","raw_affiliation_strings":["Jiujiang Vocational University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Jiujiang Vocational University","institution_ids":["https://openalex.org/I4210090502"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100951717","display_name":"Minjie Yu","orcid":null},"institutions":[{"id":"https://openalex.org/I4210122893","display_name":"Wuxi Institute of Arts & Technology","ror":"https://ror.org/03s8wm141","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210122893"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Minjie Yu","raw_affiliation_strings":["Jiangxi Arts & Ceramics Technology Institute"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Jiangxi Arts & Ceramics Technology Institute","institution_ids":["https://openalex.org/I4210122893"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101786356","display_name":"Zhaoxing Li","orcid":"https://orcid.org/0009-0006-4621-2289"},"institutions":[{"id":"https://openalex.org/I4210161995","display_name":"Yulin University","ror":"https://ror.org/05rp1t554","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210161995"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhaoxing Li","raw_affiliation_strings":["Yulin University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Yulin University","institution_ids":["https://openalex.org/I4210161995"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.84824038,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"14","issue":null,"first_page":"102504","last_page":"102520"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.6784999966621399,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.6784999966621399,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.09080000221729279,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10036","display_name":"Advanced Neural Network Applications","score":0.0812000036239624,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/signal-processing","display_name":"Signal processing","score":0.26420000195503235},{"id":"https://openalex.org/keywords/solid-modeling","display_name":"Solid modeling","score":0.23819999396800995},{"id":"https://openalex.org/keywords/fault-detection-and-isolation","display_name":"Fault detection and isolation","score":0.2354000061750412},{"id":"https://openalex.org/keywords/electronic-mail","display_name":"Electronic mail","score":0.227400004863739},{"id":"https://openalex.org/keywords/integrated-circuit-packaging","display_name":"Integrated circuit packaging","score":0.22679999470710754}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5842999815940857},{"id":"https://openalex.org/C104267543","wikidata":"https://www.wikidata.org/wiki/Q208163","display_name":"Signal processing","level":3,"score":0.26420000195503235},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.25679999589920044},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.24079999327659607},{"id":"https://openalex.org/C108882727","wikidata":"https://www.wikidata.org/wiki/Q2991685","display_name":"Solid modeling","level":2,"score":0.23819999396800995},{"id":"https://openalex.org/C152745839","wikidata":"https://www.wikidata.org/wiki/Q5438153","display_name":"Fault detection and isolation","level":3,"score":0.2354000061750412},{"id":"https://openalex.org/C3020028006","wikidata":"https://www.wikidata.org/wiki/Q9158","display_name":"Electronic mail","level":2,"score":0.227400004863739},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.22679999470710754},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.22280000150203705},{"id":"https://openalex.org/C2989121073","wikidata":"https://www.wikidata.org/wiki/Q1309019","display_name":"Transient analysis","level":3,"score":0.2214999943971634}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2026.3711482","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2026.3711482","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:bfe30022c2804e1684c8bd83224953e8","is_oa":false,"landing_page_url":"https://doaj.org/article/bfe30022c2804e1684c8bd83224953e8","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 14, Pp 102504-102520 (2026)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2026.3711482","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2026.3711482","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G167892387","display_name":null,"funder_award_id":"GJJ2505703","funder_id":"https://openalex.org/F4320338110","funder_display_name":"Science and Technology Department of Zhejiang Province"},{"id":"https://openalex.org/G4161469462","display_name":null,"funder_award_id":"72161035","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G7061527841","display_name":null,"funder_award_id":"72461033","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320338110","display_name":"Science and Technology Department of Zhejiang Province","ror":"https://ror.org/05yj3y977"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":[],"abstract_inverted_index":{"High-density":[0],"printed":[1],"circuit":[2],"board":[3],"(PCB)":[4],"manufacturing":[5],"requires":[6],"reliable":[7],"and":[8,28,145,183,190,214],"efficient":[9,216],"defect":[10,23,221],"inspection.":[11],"However,":[12],"existing":[13],"automated":[14],"visual":[15],"inspection":[16,202],"methods":[17],"are":[18,164],"often":[19],"challenged":[20],"by":[21,63,148],"small":[22],"scales,":[24],"complex":[25],"background":[26],"textures,":[27],"imaging":[29],"noise.":[30],"To":[31],"address":[32],"these":[33],"issues,":[34],"this":[35],"paper":[36],"proposes":[37],"DSRD-YOLO,":[38],"a":[39,47,72,97,212],"lightweight":[40],"detection":[41],"framework":[42],"based":[43],"on":[44,114,121,188],"YOLOv8.":[45],"First,":[46],"Dynamic":[48],"Spatial":[49,73,82],"Residual":[50],"Downsampling":[51],"(DSRD)":[52],"module":[53,77],"is":[54,85,101],"designed":[55],"to":[56,87,103,199],"preserve":[57],"fine-grained":[58],"spatial":[59],"information":[60],"during":[61],"downsampling":[62],"integrating":[64],"multi-branch":[65],"feature":[66],"extraction":[67],"with":[68,79,151,180],"dynamic":[69],"convolution.":[70],"Second,":[71],"Pyramid":[74],"Pooling":[75],"Fast":[76],"enhanced":[78],"Lightweight":[80],"Directional":[81],"Attention":[83],"(SPPF-LDSA)":[84],"introduced":[86],"better":[88],"capture":[89],"directional":[90],"structural":[91],"features":[92],"in":[93],"PCB":[94,220],"images.":[95],"Third,":[96],"SlideLoss-based":[98],"optimization":[99],"strategy":[100],"adopted":[102],"improve":[104],"training":[105],"stability":[106],"under":[107],"hard-sample":[108],"conditions,":[109],"dynamically":[110],"adjusting":[111],"the":[112,122,127,152,162,195,208],"focus":[113],"ambiguous":[115],"samples":[116],"near":[117],"decision":[118],"boundaries.":[119],"Experiments":[120],"PKU-Market-PCB":[123],"dataset":[124],"show":[125],"that":[126,161,194,207],"proposed":[128,209],"method":[129,196,210],"achieves":[130],"<inline-formula>":[131,156],"<tex-math":[132,157,168],"notation=\"LaTeX\">$95.49\\pm":[133],"0.18\\%$":[134],"</tex-math></inline-formula>":[135],"mAP@0.5":[136],"(mean":[137],"&#x00B1;":[138],"standard":[139],"deviation":[140],"over":[141],"five":[142],"independent":[143],"runs)":[144],"improves":[146],"recall":[147],"4.6%":[149],"compared":[150],"YOLOv8n":[153],"baseline;":[154],"paired":[155],"notation=\"LaTeX\">$t$":[158],"</tex-math></inline-formula>-tests":[159],"confirm":[160],"gains":[163],"statistically":[165],"significant":[166],"(<inline-formula>":[167],"notation=\"LaTeX\">$p\\lt":[169],"0.01$":[170],"</tex-math></inline-formula>).":[171],"The":[172],"model":[173],"maintains":[174],"real-time":[175],"performance":[176],"at":[177],"170.0":[178],"FPS":[179],"3.5M":[181],"parameters":[182],"9.2":[184],"GFLOPs.":[185],"Further":[186],"evaluations":[187],"DEEP_PCB":[189],"NEU_DET":[191],"datasets":[192],"indicate":[193],"generalizes":[197],"reasonably":[198],"other":[200],"industrial":[201,219],"scenarios.":[203],"These":[204],"results":[205],"suggest":[206],"offers":[211],"competitive":[213],"computationally":[215],"solution":[217],"for":[218],"detection.":[222]},"counts_by_year":[],"updated_date":"2026-07-22T05:54:00.624950","created_date":"2026-07-09T00:00:00"}