{"id":"https://openalex.org/W7162512686","doi":"https://doi.org/10.1109/access.2026.3697614","title":"Additively Manufactured X-Band Diplexer Using Laser Beam Powder Bed Fusion Technique","display_name":"Additively Manufactured X-Band Diplexer Using Laser Beam Powder Bed Fusion Technique","publication_year":2026,"publication_date":"2026-01-01","ids":{"openalex":"https://openalex.org/W7162512686","doi":"https://doi.org/10.1109/access.2026.3697614"},"language":"en","primary_location":{"id":"doi:10.1109/access.2026.3697614","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2026.3697614","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://doi.org/10.1109/access.2026.3697614","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5137123834","display_name":"Aleksandr Voronov","orcid":"https://orcid.org/0009-0008-4508-4400"},"institutions":[{"id":"https://openalex.org/I6585545","display_name":"European Telecommunications Standards Institute","ror":"https://ror.org/00pwny267","country_code":"FR","type":"nonprofit","lineage":["https://openalex.org/I6585545"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Aleksandr Voronov","raw_affiliation_strings":["Instituto de Telecomunicaciones y Aplicaciones Multimedia, Universitat Politécnica de Valéncia, Valéncia, Spain"],"raw_orcid":"https://orcid.org/0009-0008-4508-4400","affiliations":[{"raw_affiliation_string":"Instituto de Telecomunicaciones y Aplicaciones Multimedia, Universitat Politécnica de Valéncia, Valéncia, Spain","institution_ids":["https://openalex.org/I6585545"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5032553412","display_name":"V.E. Boria","orcid":null},"institutions":[{"id":"https://openalex.org/I6585545","display_name":"European Telecommunications Standards Institute","ror":"https://ror.org/00pwny267","country_code":"FR","type":"nonprofit","lineage":["https://openalex.org/I6585545"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Vicente E. Boria Esbert","raw_affiliation_strings":["Instituto de Telecomunicaciones y Aplicaciones Multimedia, Universitat Politécnica de Valéncia, Valéncia, Spain"],"raw_orcid":"https://orcid.org/0000-0001-7150-9785","affiliations":[{"raw_affiliation_string":"Instituto de Telecomunicaciones y Aplicaciones Multimedia, Universitat Politécnica de Valéncia, Valéncia, Spain","institution_ids":["https://openalex.org/I6585545"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080773490","display_name":"Lluc Sempere","orcid":null},"institutions":[{"id":"https://openalex.org/I4210121834","display_name":"Leitat Technological Center","ror":"https://ror.org/02njs1t69","country_code":"ES","type":"facility","lineage":["https://openalex.org/I4210121834"]}],"countries":["ES"],"is_corresponding":false,"raw_author_name":"Lluc Sempere","raw_affiliation_strings":["Innovative Materials and Manufacturing, AIJU Technological Institute, Ibi, Spain"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Innovative Materials and Manufacturing, AIJU Technological Institute, Ibi, Spain","institution_ids":["https://openalex.org/I4210121834"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5019065216","display_name":"Mirko Kunowsky","orcid":"https://orcid.org/0000-0003-4381-7398"},"institutions":[{"id":"https://openalex.org/I4210121834","display_name":"Leitat Technological Center","ror":"https://ror.org/02njs1t69","country_code":"ES","type":"facility","lineage":["https://openalex.org/I4210121834"]}],"countries":["ES"],"is_corresponding":false,"raw_author_name":"Mirko Kunowsky","raw_affiliation_strings":["Innovative Materials and Manufacturing, AIJU Technological Institute, Ibi, Spain"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Innovative Materials and Manufacturing, AIJU Technological Institute, Ibi, Spain","institution_ids":["https://openalex.org/I4210121834"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5082265172","display_name":"Carmen Bachiller","orcid":"https://orcid.org/0000-0002-5518-5060"},"institutions":[{"id":"https://openalex.org/I6585545","display_name":"European Telecommunications Standards Institute","ror":"https://ror.org/00pwny267","country_code":"FR","type":"nonprofit","lineage":["https://openalex.org/I6585545"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Carmen Bachiller","raw_affiliation_strings":["Instituto de Telecomunicaciones y Aplicaciones Multimedia, Universitat Politécnica de Valéncia, Valéncia, Spain"],"raw_orcid":"https://orcid.org/0000-0002-5518-5060","affiliations":[{"raw_affiliation_string":"Instituto de Telecomunicaciones y Aplicaciones Multimedia, Universitat Politécnica de Valéncia, Valéncia, Spain","institution_ids":["https://openalex.org/I6585545"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.60819717,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"14","issue":null,"first_page":"81023","last_page":"81029"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10705","display_name":"Additive Manufacturing Materials and Processes","score":0.2985000014305115,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10705","display_name":"Additive Manufacturing Materials and Processes","score":0.2985000014305115,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10732","display_name":"Laser Material Processing Techniques","score":0.21150000393390656,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11127","display_name":"Solid State Laser Technologies","score":0.044599998742341995,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/diplexer","display_name":"Diplexer","score":0.7400000095367432},{"id":"https://openalex.org/keywords/fusion","display_name":"Fusion","score":0.6345999836921692},{"id":"https://openalex.org/keywords/laser-beams","display_name":"Laser beams","score":0.5364999771118164},{"id":"https://openalex.org/keywords/laser","display_name":"Laser","score":0.424699991941452},{"id":"https://openalex.org/keywords/beam","display_name":"Beam (structure)","score":0.382099986076355}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8190000057220459},{"id":"https://openalex.org/C81774821","wikidata":"https://www.wikidata.org/wiki/Q1227176","display_name":"Diplexer","level":2,"score":0.7400000095367432},{"id":"https://openalex.org/C158525013","wikidata":"https://www.wikidata.org/wiki/Q2593739","display_name":"Fusion","level":2,"score":0.6345999836921692},{"id":"https://openalex.org/C2984025587","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser beams","level":3,"score":0.5364999771118164},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.42969998717308044},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.424699991941452},{"id":"https://openalex.org/C168834538","wikidata":"https://www.wikidata.org/wiki/Q3705329","display_name":"Beam (structure)","level":2,"score":0.382099986076355},{"id":"https://openalex.org/C107430045","wikidata":"https://www.wikidata.org/wiki/Q1364409","display_name":"Inertial confinement fusion","level":3,"score":0.37790000438690186},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3671000003814697},{"id":"https://openalex.org/C17163034","wikidata":"https://www.wikidata.org/wiki/Q390528","display_name":"Fiber laser","level":3,"score":0.3009999990463257},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.28850001096725464}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2026.3697614","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2026.3697614","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:8744b613488d458bbc1bf63eff869ab6","is_oa":false,"landing_page_url":"https://doaj.org/article/8744b613488d458bbc1bf63eff869ab6","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 14, Pp 81023-81029 (2026)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2026.3697614","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2026.3697614","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G2018108527","display_name":null,"funder_award_id":"CIPROM/2022/019","funder_id":"https://openalex.org/F4320311687","funder_display_name":"Ministry of Education"},{"id":"https://openalex.org/G4998408317","display_name":null,"funder_award_id":"INNEST/2022/124","funder_id":"https://openalex.org/F4320336419","funder_display_name":"Ag\u00e8ncia Valenciana de la Innovaci\u00f3"}],"funders":[{"id":"https://openalex.org/F4320311687","display_name":"Ministry of Education","ror":"https://ror.org/03m01yf64"},{"id":"https://openalex.org/F4320336419","display_name":"Ag\u00e8ncia Valenciana de la Innovaci\u00f3","ror":null}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":[],"abstract_inverted_index":{"This":[0,172],"work":[1],"presents":[2],"the":[3,85,90,96,153,157,160,181,185],"additive":[4,104,154],"manufacturing":[5,155,177],"of":[6,11,28,77,95,102,156,162,184],"an":[7,103,163],"X-Band":[8],"diplexer":[9,109],"composed":[10],"two":[12],"filters:":[13],"one":[14],"centered":[15],"at":[16,21],"9.5":[17],"GHz":[18],"and":[19,53,75,99,176],"another":[20],"10.5":[22],"GHz,":[23],"both":[24,73],"with":[25,58],"a":[26,32,46,121,142],"bandwidth":[27],"250":[29],"MHz,":[30],"plus":[31],"power":[33],"divider.":[34],"The":[35,108,125],"whole":[36],"set":[37,86],"was":[38,87,110,128],"implemented":[39,111],"in":[40,45,72,92],"rectangular":[41],"waveguide":[42],"technology,":[43,140],"manufactured":[44,105,129],"single":[47],"block.":[48],"Good":[49],"agreement":[50],"between":[51,80],"simulated":[52],"measured":[54],"results":[55],"is":[56],"achieved,":[57],"return":[59],"losses":[60,67],"(RL)":[61],"lower":[62],"than":[63],"20":[64],"dB,":[65],"insertion":[66],"(IL)":[68],"around":[69],"0.3":[70],"dB":[71,79],"filters,":[74],"isolation":[76],"30":[78],"them.":[81],"For":[82],"demonstration":[83],"purposes,":[84],"used":[88],"for":[89,152],"characterization":[91],"anechoic":[93],"chamber":[94],"directivity,":[97],"gain":[98],"radiation":[100],"efficiency":[101],"horn":[106,126],"antenna.":[107],"using":[112,141],"Powder":[113],"Bed":[114],"Fusion":[115],"Laser":[116],"Beam,":[117],"(PBF-L/M)":[118],"technology":[119],"on":[120],"metal":[122],"alloy":[123],"(AlSi10Mg).":[124],"antenna":[127],"via":[130],"Vat":[131],"Photopolymerization":[132],"by":[133],"exposure":[134],"to":[135],"Masked":[136],"UV":[137],"light":[138],"(VPP-UVM)":[139],"polymeric":[143],"resin":[144],"(Gray":[145],"from":[146],"Applylabwork),":[147],"subsequently":[148],"metallized.":[149],"Mechanical":[150],"optimization":[151],"design":[158],"allows":[159],"development":[161],"ergonomic":[164],"single-part":[165],"device,":[166],"enabling":[167],"perfectly":[168],"squared":[169],"inner":[170],"cavities.":[171],"reduces":[173],"weight,":[174],"volume,":[175],"waste,":[178],"while":[179],"maintaining":[180],"electromagnetic":[182],"response":[183],"diplexer.":[186]},"counts_by_year":[],"updated_date":"2026-06-03T06:16:58.514037","created_date":"2026-05-28T00:00:00"}