{"id":"https://openalex.org/W7147641322","doi":"https://doi.org/10.1109/access.2026.3679299","title":"Cycle Time Optimization in Scheduling Automated Bench Cleaning Tool for Semiconductor Manufacturing","display_name":"Cycle Time Optimization in Scheduling Automated Bench Cleaning Tool for Semiconductor Manufacturing","publication_year":2026,"publication_date":"2026-01-01","ids":{"openalex":"https://openalex.org/W7147641322","doi":"https://doi.org/10.1109/access.2026.3679299"},"language":"en","primary_location":{"id":"doi:10.1109/access.2026.3679299","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2026.3679299","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://doi.org/10.1109/access.2026.3679299","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5028417276","display_name":"Luetao Li","orcid":null},"institutions":[{"id":"https://openalex.org/I111950717","display_name":"Macau University of Science and Technology","ror":"https://ror.org/03jqs2n27","country_code":"MO","type":"education","lineage":["https://openalex.org/I111950717","https://openalex.org/I4391767947"]}],"countries":["MO"],"is_corresponding":false,"raw_author_name":"Luetao Li","raw_affiliation_strings":["Institute of Systems Engineering and Collaborative Laboratory for Intelligent Science and Systems, Macau University of Science and Technology, Macao, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Systems Engineering and Collaborative Laboratory for Intelligent Science and Systems, Macau University of Science and Technology, Macao, China","institution_ids":["https://openalex.org/I111950717"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5125662652","display_name":"Siwei Zhang","orcid":null},"institutions":[{"id":"https://openalex.org/I111950717","display_name":"Macau University of Science and Technology","ror":"https://ror.org/03jqs2n27","country_code":"MO","type":"education","lineage":["https://openalex.org/I111950717","https://openalex.org/I4391767947"]}],"countries":["MO"],"is_corresponding":false,"raw_author_name":"Siwei Zhang","raw_affiliation_strings":["Institute of Systems Engineering and Collaborative Laboratory for Intelligent Science and Systems, Macau University of Science and Technology, Macao, China"],"raw_orcid":"https://orcid.org/0009-0001-0701-3088","affiliations":[{"raw_affiliation_string":"Institute of Systems Engineering and Collaborative Laboratory for Intelligent Science and Systems, Macau University of Science and Technology, Macao, China","institution_ids":["https://openalex.org/I111950717"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5132626564","display_name":"Yan Qiao","orcid":null},"institutions":[{"id":"https://openalex.org/I111950717","display_name":"Macau University of Science and Technology","ror":"https://ror.org/03jqs2n27","country_code":"MO","type":"education","lineage":["https://openalex.org/I111950717","https://openalex.org/I4391767947"]}],"countries":["MO"],"is_corresponding":false,"raw_author_name":"Yan Qiao","raw_affiliation_strings":["Institute of Systems Engineering and Collaborative Laboratory for Intelligent Science and Systems, Macau University of Science and Technology, Macao, China"],"raw_orcid":"https://orcid.org/0000-0001-5162-0224","affiliations":[{"raw_affiliation_string":"Institute of Systems Engineering and Collaborative Laboratory for Intelligent Science and Systems, Macau University of Science and Technology, Macao, China","institution_ids":["https://openalex.org/I111950717"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5132623747","display_name":"Naiqi Wu","orcid":null},"institutions":[{"id":"https://openalex.org/I111950717","display_name":"Macau University of Science and Technology","ror":"https://ror.org/03jqs2n27","country_code":"MO","type":"education","lineage":["https://openalex.org/I111950717","https://openalex.org/I4391767947"]}],"countries":["MO"],"is_corresponding":false,"raw_author_name":"Naiqi Wu","raw_affiliation_strings":["Institute of Systems Engineering and Collaborative Laboratory for Intelligent Science and Systems, Macau University of Science and Technology, Macao, China"],"raw_orcid":"https://orcid.org/0000-0001-6782-458X","affiliations":[{"raw_affiliation_string":"Institute of Systems Engineering and Collaborative Laboratory for Intelligent Science and Systems, Macau University of Science and Technology, Macao, China","institution_ids":["https://openalex.org/I111950717"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5132607155","display_name":"Jie Li","orcid":null},"institutions":[{"id":"https://openalex.org/I3174185376","display_name":"China South Industries Group (China)","ror":"https://ror.org/04n0f2b96","country_code":"CN","type":"company","lineage":["https://openalex.org/I3174185376"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jie Li","raw_affiliation_strings":["IKAS Industries Company, Ltd, Beijing, China"],"raw_orcid":"https://orcid.org/0009-0001-3030-9370","affiliations":[{"raw_affiliation_string":"IKAS Industries Company, Ltd, Beijing, China","institution_ids":["https://openalex.org/I3174185376"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5132687530","display_name":"Bai Yang","orcid":null},"institutions":[{"id":"https://openalex.org/I2800372957","display_name":"China Electronics Technology Group Corporation","ror":"https://ror.org/0098hst83","country_code":"CN","type":"company","lineage":["https://openalex.org/I2800372957"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Bai Yang","raw_affiliation_strings":["The Information Science Academy, China Electronics Technology Group Corporation, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"The Information Science Academy, China Electronics Technology Group Corporation, Beijing, China","institution_ids":["https://openalex.org/I2800372957"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.34947286,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"1"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10551","display_name":"Scheduling and Optimization Algorithms","score":0.7847999930381775,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10551","display_name":"Scheduling and Optimization Algorithms","score":0.7847999930381775,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11814","display_name":"Advanced Manufacturing and Logistics Optimization","score":0.058800000697374344,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12782","display_name":"Assembly Line Balancing Optimization","score":0.019200000911951065,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.7993999719619751},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.7831000089645386},{"id":"https://openalex.org/keywords/wafer-fabrication","display_name":"Wafer fabrication","score":0.713699996471405},{"id":"https://openalex.org/keywords/scheduling","display_name":"Scheduling (production processes)","score":0.6794999837875366},{"id":"https://openalex.org/keywords/job-shop-scheduling","display_name":"Job shop scheduling","score":0.5407000184059143},{"id":"https://openalex.org/keywords/robot","display_name":"Robot","score":0.5067999958992004},{"id":"https://openalex.org/keywords/wafer-level-packaging","display_name":"Wafer-level packaging","score":0.4375999867916107}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.7993999719619751},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.7831000089645386},{"id":"https://openalex.org/C35750839","wikidata":"https://www.wikidata.org/wiki/Q7959421","display_name":"Wafer fabrication","level":3,"score":0.713699996471405},{"id":"https://openalex.org/C206729178","wikidata":"https://www.wikidata.org/wiki/Q2271896","display_name":"Scheduling (production processes)","level":2,"score":0.6794999837875366},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.567300021648407},{"id":"https://openalex.org/C55416958","wikidata":"https://www.wikidata.org/wiki/Q6206757","display_name":"Job shop scheduling","level":3,"score":0.5407000184059143},{"id":"https://openalex.org/C90509273","wikidata":"https://www.wikidata.org/wiki/Q11012","display_name":"Robot","level":2,"score":0.5067999958992004},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.4375999867916107},{"id":"https://openalex.org/C2780682718","wikidata":"https://www.wikidata.org/wiki/Q16321575","display_name":"Production control","level":3,"score":0.3716000020503998},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3546999990940094},{"id":"https://openalex.org/C79403827","wikidata":"https://www.wikidata.org/wiki/Q3988","display_name":"Real-time computing","level":1,"score":0.3506999909877777},{"id":"https://openalex.org/C107568181","wikidata":"https://www.wikidata.org/wiki/Q5319000","display_name":"Dynamic priority scheduling","level":3,"score":0.3479999899864197},{"id":"https://openalex.org/C21880701","wikidata":"https://www.wikidata.org/wiki/Q2144042","display_name":"Process engineering","level":1,"score":0.32899999618530273},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3174000084400177},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.3073999881744385},{"id":"https://openalex.org/C133731056","wikidata":"https://www.wikidata.org/wiki/Q4917288","display_name":"Control engineering","level":1,"score":0.2996000051498413},{"id":"https://openalex.org/C2778638305","wikidata":"https://www.wikidata.org/wiki/Q7406100","display_name":"Wafer-scale integration","level":3,"score":0.29760000109672546},{"id":"https://openalex.org/C171146098","wikidata":"https://www.wikidata.org/wiki/Q124192","display_name":"Automotive engineering","level":1,"score":0.296999990940094},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.2840999960899353},{"id":"https://openalex.org/C31689143","wikidata":"https://www.wikidata.org/wiki/Q733809","display_name":"Fair-share scheduling","level":3,"score":0.2824000120162964},{"id":"https://openalex.org/C126355924","wikidata":"https://www.wikidata.org/wiki/Q5274495","display_name":"Die preparation","level":4,"score":0.28029999136924744},{"id":"https://openalex.org/C8002213","wikidata":"https://www.wikidata.org/wiki/Q7959420","display_name":"Wafer backgrinding","level":4,"score":0.271699994802475},{"id":"https://openalex.org/C4775677","wikidata":"https://www.wikidata.org/wiki/Q7449393","display_name":"Semiconductor device modeling","level":3,"score":0.2635999917984009},{"id":"https://openalex.org/C157764524","wikidata":"https://www.wikidata.org/wiki/Q1383412","display_name":"Throughput","level":3,"score":0.2581999897956848}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2026.3679299","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2026.3679299","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:2d37a597f8d148e1abd35e2f5699d312","is_oa":true,"landing_page_url":"https://doaj.org/article/2d37a597f8d148e1abd35e2f5699d312","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 14, Pp 54861-54873 (2026)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2026.3679299","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2026.3679299","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.5315200090408325}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":[],"abstract_inverted_index":{"In":[0,136],"the":[1,13,16,29,76,80,83,93,109,119,125,133,160,168,175,178],"semiconductor":[2],"wafer":[3,6,30,38,120,146,169],"manufacturing":[4],"process,":[5],"cleaning":[7,23,42,87,115,147,170],"operation":[8],"is":[9,34,106,148,180],"responsible":[10],"for":[11,26,49,127,145],"removing":[12],"residues":[14],"on":[15,159],"surface":[17],"of":[18,28,45,79,103,112,177],"wafers":[19],"after":[20],"processing.":[21],"The":[22,101],"time":[24,78,122],"accounts":[25],"30%":[27],"fabrication":[31],"work,":[32],"which":[33],"significant":[35],"as":[36,92],"other":[37],"production":[39],"processes.":[40],"Wafer":[41],"equipment":[43],"consists":[44],"a":[46,59,73,86,128,142],"single-arm":[47],"robot":[48,81],"transportation":[50],"and":[51,150],"multiple":[52],"processing":[53,68,129],"tanks":[54,84,126],"that":[55],"are":[56,156,172],"organized":[57],"in":[58,72,85],"linear":[60],"topology":[61],"structure.":[62],"Unlike":[63],"cluster":[64],"tools":[65,116],"with":[66],"its":[67,96,151],"modules":[69],"being":[70],"arranged":[71],"radial":[74],"structure,":[75],"moving":[77],"between":[82],"tool":[88,134],"cannot":[89],"be":[90],"treated":[91],"same,":[94],"making":[95],"scheduling":[97,110,163],"problem":[98,111],"more":[99],"difficult.":[100],"purpose":[102],"this":[104,140],"paper":[105],"to":[107,117,138],"solve":[108],"automatic":[113],"bench":[114],"make":[118],"residency":[121],"same":[123],"among":[124],"step":[130],"while":[131],"maximizing":[132],"productivity.":[135],"order":[137],"achieve":[139],"goal,":[141],"backward":[143],"strategy":[144],"proposed":[149],"characteristics":[152],"under":[153],"steady":[154],"state":[155],"studied.":[157],"Based":[158],"analysis":[161],"results,":[162],"algorithms":[164],"aiming":[165],"at":[166],"minimizing":[167],"cycle":[171],"established.":[173],"Finally,":[174],"practicability":[176],"algorithm":[179],"proved":[181],"by":[182],"case":[183],"analysis.":[184]},"counts_by_year":[],"updated_date":"2026-04-02T13:53:19.096889","created_date":"2026-04-02T00:00:00"}