{"id":"https://openalex.org/W4411406745","doi":"https://doi.org/10.1109/access.2025.3580727","title":"Image-Based Accelerated Prediction of Thermal Properties of Package Substrates Using Combined Deep-Learning and an Enhanced Thermal Network Model","display_name":"Image-Based Accelerated Prediction of Thermal Properties of Package Substrates Using Combined Deep-Learning and an Enhanced Thermal Network Model","publication_year":2025,"publication_date":"2025-01-01","ids":{"openalex":"https://openalex.org/W4411406745","doi":"https://doi.org/10.1109/access.2025.3580727"},"language":"en","primary_location":{"id":"doi:10.1109/access.2025.3580727","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2025.3580727","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://doi.org/10.1109/access.2025.3580727","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5006763690","display_name":"Jeong-Hyeon Park","orcid":"https://orcid.org/0000-0001-5305-3710"},"institutions":[{"id":"https://openalex.org/I848706","display_name":"Sungkyunkwan University","ror":"https://ror.org/04q78tk20","country_code":"KR","type":"education","lineage":["https://openalex.org/I848706"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jeong-Hyeon Park","raw_affiliation_strings":["Department of Mechanical Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do, Republic of Korea"],"raw_orcid":"https://orcid.org/0000-0001-5305-3710","affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do, Republic of Korea","institution_ids":["https://openalex.org/I848706"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078667904","display_name":"Jaechoon Kim","orcid":"https://orcid.org/0000-0003-0886-3903"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jaechoon Kim","raw_affiliation_strings":["Division of Semiconductor Research and Development Center, Samsung Electronics, Yongin, Gyeonggi-do, Republic of Korea","Division of the Semiconductor R&D Center, Samsung Electronics, Yongin, Gyeonggi-do, Republic of Korea"],"raw_orcid":"https://orcid.org/0000-0003-0886-3903","affiliations":[{"raw_affiliation_string":"Division of Semiconductor Research and Development Center, Samsung Electronics, Yongin, Gyeonggi-do, Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]},{"raw_affiliation_string":"Division of the Semiconductor R&D Center, Samsung Electronics, Yongin, Gyeonggi-do, Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044886384","display_name":"Sukwon Jang","orcid":"https://orcid.org/0000-0001-7581-7240"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sukwon Jang","raw_affiliation_strings":["Division of Semiconductor Research and Development Center, Samsung Electronics, Yongin, Gyeonggi-do, Republic of Korea","Division of the Semiconductor R&D Center, Samsung Electronics, Yongin, Gyeonggi-do, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Division of Semiconductor Research and Development Center, Samsung Electronics, Yongin, Gyeonggi-do, Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]},{"raw_affiliation_string":"Division of the Semiconductor R&D Center, Samsung Electronics, Yongin, Gyeonggi-do, Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5048184791","display_name":"Sungho Mun","orcid":"https://orcid.org/0000-0002-5083-5386"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sungho Mun","raw_affiliation_strings":["Division of Semiconductor Research and Development Center, Samsung Electronics, Yongin, Gyeonggi-do, Republic of Korea","Division of the Semiconductor R&D Center, Samsung Electronics, Yongin, Gyeonggi-do, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Division of Semiconductor Research and Development Center, Samsung Electronics, Yongin, Gyeonggi-do, Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]},{"raw_affiliation_string":"Division of the Semiconductor R&D Center, Samsung Electronics, Yongin, Gyeonggi-do, Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5102027725","display_name":"Eun\u2010Ho Lee","orcid":"https://orcid.org/0000-0003-1270-7954"},"institutions":[{"id":"https://openalex.org/I848706","display_name":"Sungkyunkwan University","ror":"https://ror.org/04q78tk20","country_code":"KR","type":"education","lineage":["https://openalex.org/I848706"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Eun-Ho Lee","raw_affiliation_strings":["Department of Mechanical Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do, Republic of Korea"],"raw_orcid":"https://orcid.org/0000-0003-1270-7954","affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do, Republic of Korea","institution_ids":["https://openalex.org/I848706"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":1.6056,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.84019524,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":99},"biblio":{"volume":"13","issue":null,"first_page":"107926","last_page":"107935"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9902999997138977,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9902999997138977,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9812999963760376,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14156","display_name":"Engineering Applied Research","score":0.9681000113487244,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6356587409973145},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.5854243040084839},{"id":"https://openalex.org/keywords/deep-learning","display_name":"Deep learning","score":0.47619521617889404},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.47289028763771057},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3456723690032959},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.07705414295196533}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6356587409973145},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5854243040084839},{"id":"https://openalex.org/C108583219","wikidata":"https://www.wikidata.org/wiki/Q197536","display_name":"Deep learning","level":2,"score":0.47619521617889404},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.47289028763771057},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3456723690032959},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.07705414295196533},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2025.3580727","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2025.3580727","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:ebc66d5b24b645e696ed0103d199ab56","is_oa":true,"landing_page_url":"https://doaj.org/article/ebc66d5b24b645e696ed0103d199ab56","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 13, Pp 107926-107935 (2025)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2025.3580727","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2025.3580727","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.44999998807907104}],"awards":[{"id":"https://openalex.org/G5155366766","display_name":null,"funder_award_id":"RS-2024-00423772","funder_id":"https://openalex.org/F4320322120","funder_display_name":"National Research Foundation of Korea"}],"funders":[{"id":"https://openalex.org/F4320320671","display_name":"National Research Foundation","ror":"https://ror.org/05s0g1g46"},{"id":"https://openalex.org/F4320322120","display_name":"National Research Foundation of Korea","ror":"https://ror.org/013aysd81"},{"id":"https://openalex.org/F4320332195","display_name":"Samsung","ror":"https://ror.org/04w3jy968"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":24,"referenced_works":["https://openalex.org/W1993595429","https://openalex.org/W2045072037","https://openalex.org/W2083267133","https://openalex.org/W2120613764","https://openalex.org/W2127172410","https://openalex.org/W2169219063","https://openalex.org/W2512385765","https://openalex.org/W2562502661","https://openalex.org/W2622148586","https://openalex.org/W3012527148","https://openalex.org/W3086507160","https://openalex.org/W3161879169","https://openalex.org/W3193056901","https://openalex.org/W4285107832","https://openalex.org/W4385062230","https://openalex.org/W4385525190","https://openalex.org/W4392349825","https://openalex.org/W4393033247","https://openalex.org/W4396598807","https://openalex.org/W4396680712","https://openalex.org/W4400034405","https://openalex.org/W4400034713","https://openalex.org/W4400786863","https://openalex.org/W4408280846"],"related_works":["https://openalex.org/W2899084033","https://openalex.org/W2731899572","https://openalex.org/W3215138031","https://openalex.org/W3009238340","https://openalex.org/W4360585206","https://openalex.org/W4321369474","https://openalex.org/W4285208911","https://openalex.org/W3082895349","https://openalex.org/W4213079790","https://openalex.org/W2248239756"],"abstract_inverted_index":{"As":[0],"the":[1,13,52,68,91,131],"need":[2],"for":[3,67,126,133],"processing":[4],"large":[5],"amounts":[6],"of":[7,15,36,48,71,95],"data":[8,94],"increases,":[9],"power":[10],"consumption":[11],"and":[12,45,81,104,124,148,152,164],"complexity":[14],"semiconductor":[16],"package":[17,75,96,145],"patterns":[18,38,73],"also":[19],"rise,":[20],"making":[21],"thermal":[22,34,49,69,84,107,115,135],"management":[23],"crucial.":[24],"Traditional":[25],"analytical":[26],"models":[27],"suffer":[28],"from":[29],"accuracy":[30,158],"issues":[31],"when":[32],"analyzing":[33],"behaviors":[35],"complex":[37,72],"in":[39,55,74,166],"commercial":[40],"packages.":[41],"To":[42],"enable":[43],"accurate":[44],"fast":[46],"prediction":[47,65,167],"behavior":[50],"during":[51],"design":[53],"stage":[54],"practical":[56],"industry":[57],"applications,":[58],"this":[59],"study":[60],"proposes":[61],"an":[62,82],"image-based":[63],"accelerated":[64],"method":[66,89,140],"properties":[70],"substrates":[76,97],"by":[77],"using":[78],"combined":[79],"deep-learning":[80],"enhanced":[83],"network":[85,108],"model.":[86],"The":[87,113,138],"proposed":[88,139],"divides":[90],"layer-wise":[92],"image":[93],"into":[98],"subdomains":[99],"to":[100,143],"define":[101],"unit":[102,121],"cells,":[103],"applies":[105],"a":[106,110],"with":[109,120,159],"new":[111],"structure.":[112],"specified":[114],"networks":[116],"are":[117],"then":[118],"matched":[119],"cell":[122],"images":[123],"used":[125],"deep":[127],"learning,":[128],"thus":[129],"automating":[130],"process":[132],"quick":[134],"property":[136],"assessment.":[137],"is":[141],"applied":[142],"commercialized":[144],"substrate":[146],"designs":[147],"validated":[149],"through":[150],"experiments":[151],"finite":[153],"element-based":[154],"models,":[155],"demonstrating":[156],"high":[157],"R-squared":[160],"values":[161],"over":[162],"0.99":[163],"reduction":[165],"time":[168],"exceeding":[169],"90%.":[170]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}