{"id":"https://openalex.org/W4409883028","doi":"https://doi.org/10.1109/access.2025.3564892","title":"Optimization of MLCC Bar Design to Minimize Failure Rates Under Isostatic Pressing Using Numerical Analysis and Homogenization Technique","display_name":"Optimization of MLCC Bar Design to Minimize Failure Rates Under Isostatic Pressing Using Numerical Analysis and Homogenization Technique","publication_year":2025,"publication_date":"2025-01-01","ids":{"openalex":"https://openalex.org/W4409883028","doi":"https://doi.org/10.1109/access.2025.3564892"},"language":"en","primary_location":{"id":"doi:10.1109/access.2025.3564892","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2025.3564892","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://doi.org/10.1109/access.2025.3564892","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5107735893","display_name":"Kent Justine B. Legada","orcid":null},"institutions":[{"id":"https://openalex.org/I4210116376","display_name":"SUNY Korea","ror":"https://ror.org/02d07gm56","country_code":"KR","type":"education","lineage":["https://openalex.org/I4210116376"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Kent Justine B. Legada","raw_affiliation_strings":["Department of Mechanical Engineering, State University of New York, Incheon, South Korea","Department of Mechanical Engineering, State University of New York, Incheon, Korea"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, State University of New York, Incheon, South Korea","institution_ids":["https://openalex.org/I4210116376"]},{"raw_affiliation_string":"Department of Mechanical Engineering, State University of New York, Incheon, Korea","institution_ids":["https://openalex.org/I4210116376"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5070069522","display_name":"Changwoon Han","orcid":"https://orcid.org/0000-0002-9300-3328"},"institutions":[{"id":"https://openalex.org/I4210116376","display_name":"SUNY Korea","ror":"https://ror.org/02d07gm56","country_code":"KR","type":"education","lineage":["https://openalex.org/I4210116376"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Changwoon Han","raw_affiliation_strings":["Department of Mechanical Engineering, State University of New York, Incheon, South Korea","Department of Mechanical Engineering, State University of New York, Incheon, Korea"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, State University of New York, Incheon, South Korea","institution_ids":["https://openalex.org/I4210116376"]},{"raw_affiliation_string":"Department of Mechanical Engineering, State University of New York, Incheon, Korea","institution_ids":["https://openalex.org/I4210116376"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5107735893"],"corresponding_institution_ids":["https://openalex.org/I4210116376"],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.09758887,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"13","issue":null,"first_page":"76058","last_page":"76071"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11201","display_name":"Metallurgy and Material Forming","score":0.9907000064849854,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11201","display_name":"Metallurgy and Material Forming","score":0.9907000064849854,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10188","display_name":"Advanced machining processes and optimization","score":0.9882000088691711,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12080","display_name":"Injection Molding Process and Properties","score":0.9829000234603882,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/homogenization","display_name":"Homogenization (climate)","score":0.7989650964736938},{"id":"https://openalex.org/keywords/pressing","display_name":"Pressing","score":0.5842164754867554},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5702294111251831},{"id":"https://openalex.org/keywords/bar","display_name":"Bar (unit)","score":0.509023904800415},{"id":"https://openalex.org/keywords/hot-isostatic-pressing","display_name":"Hot isostatic pressing","score":0.484944611787796},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3417245149612427},{"id":"https://openalex.org/keywords/geology","display_name":"Geology","score":0.263034462928772},{"id":"https://openalex.org/keywords/sintering","display_name":"Sintering","score":0.19290941953659058}],"concepts":[{"id":"https://openalex.org/C2778722038","wikidata":"https://www.wikidata.org/wiki/Q17030643","display_name":"Homogenization (climate)","level":3,"score":0.7989650964736938},{"id":"https://openalex.org/C93021684","wikidata":"https://www.wikidata.org/wiki/Q3816735","display_name":"Pressing","level":2,"score":0.5842164754867554},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5702294111251831},{"id":"https://openalex.org/C188721877","wikidata":"https://www.wikidata.org/wiki/Q103510","display_name":"Bar (unit)","level":2,"score":0.509023904800415},{"id":"https://openalex.org/C2780036946","wikidata":"https://www.wikidata.org/wiki/Q1601582","display_name":"Hot isostatic pressing","level":3,"score":0.484944611787796},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3417245149612427},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.263034462928772},{"id":"https://openalex.org/C2777581544","wikidata":"https://www.wikidata.org/wiki/Q844613","display_name":"Sintering","level":2,"score":0.19290941953659058},{"id":"https://openalex.org/C18903297","wikidata":"https://www.wikidata.org/wiki/Q7150","display_name":"Ecology","level":1,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C130217890","wikidata":"https://www.wikidata.org/wiki/Q47041","display_name":"Biodiversity","level":2,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2025.3564892","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2025.3564892","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:a96376c2056b425f91602c4c548ef4d8","is_oa":true,"landing_page_url":"https://doaj.org/article/a96376c2056b425f91602c4c548ef4d8","pdf_url":null,"source":{"id":"https://openalex.org/S112646816","display_name":"SHILAP Revista de lepidopterolog\u00eda","issn_l":"0300-5267","issn":["0300-5267","2340-4078"],"is_oa":true,"is_in_doaj":true,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 13, Pp 76058-76071 (2025)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2025.3564892","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2025.3564892","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G4036019640","display_name":null,"funder_award_id":"RS-2024-0033681313982177840101","funder_id":"https://openalex.org/F4320322120","funder_display_name":"National Research Foundation of Korea"},{"id":"https://openalex.org/G5073177868","display_name":null,"funder_award_id":"20017488","funder_id":"https://openalex.org/F4320334879","funder_display_name":"Korea Evaluation Institute of Industrial Technology"}],"funders":[{"id":"https://openalex.org/F4320322120","display_name":"National Research Foundation of Korea","ror":"https://ror.org/013aysd81"},{"id":"https://openalex.org/F4320334879","display_name":"Korea Evaluation Institute of Industrial Technology","ror":"https://ror.org/03z9cwa38"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":22,"referenced_works":["https://openalex.org/W193186807","https://openalex.org/W1970656670","https://openalex.org/W1989993440","https://openalex.org/W2009097269","https://openalex.org/W2011759566","https://openalex.org/W2025945198","https://openalex.org/W2029814195","https://openalex.org/W2049666369","https://openalex.org/W2070151425","https://openalex.org/W2071519111","https://openalex.org/W2081085308","https://openalex.org/W2081465693","https://openalex.org/W2335786005","https://openalex.org/W2491281109","https://openalex.org/W2809125231","https://openalex.org/W2957321961","https://openalex.org/W3141228567","https://openalex.org/W4242753698","https://openalex.org/W4378450641","https://openalex.org/W4390615920","https://openalex.org/W4394754118","https://openalex.org/W6776763336"],"related_works":["https://openalex.org/W2104620528","https://openalex.org/W1986726427","https://openalex.org/W2384376446","https://openalex.org/W140119233","https://openalex.org/W2082871193","https://openalex.org/W2757910772","https://openalex.org/W2001498133","https://openalex.org/W4249473811","https://openalex.org/W2394422079","https://openalex.org/W2385302039"],"abstract_inverted_index":{"Multilayer":[0],"ceramic":[1],"capacitors":[2],"(MLCCs)":[3],"are":[4],"electronic":[5],"components":[6],"constructed":[7],"with":[8],"alternating":[9],"layers":[10,51],"of":[11,41,64,84,96,132,150,189],"electrode":[12],"and":[13,48,91,144,153],"dielectric":[14],"materials.":[15],"Nevertheless,":[16],"few":[17],"studies":[18],"have":[19],"examined":[20],"reliability":[21],"issues":[22],"during":[23],"the":[24,60,65,71,82,110,120,130,133,141,148,151,158,162,172,176],"manufacturing":[25,39],"process,":[26],"leaving":[27],"a":[28,115,137,165,186],"gap":[29],"in":[30,140],"understanding":[31],"how":[32],"production":[33,98,181],"conditions":[34],"impact":[35],"MLCC":[36,55,85,97,177],"performance.":[37],"The":[38,126],"process":[40],"MLCCs":[42],"utilizes":[43],"isostatic":[44,100],"pressing":[45,101],"to":[46,52,59,80,87,118,191],"laminate":[47],"compress":[49],"these":[50,170],"form":[53],"an":[54],"bar.":[56],"However,":[57],"due":[58],"heterogenous":[61],"multilayered":[62],"structure":[63],"bar,":[66],"non-uniform":[67,89],"deformation":[68,90,142],"occurs":[69],"after":[70],"procedure.":[72],"To":[73],"address":[74],"this":[75,77],"issue,":[76],"study":[78,173],"aims":[79],"optimize":[81],"design":[83,131,166],"bar":[86,178],"minimize":[88],"reduce":[92],"subsequent":[93],"failure":[94,145,182],"rates":[95,183],"under":[99],"condition.":[102],"Finite":[103],"Element":[104],"Analysis":[105],"(FEA)":[106],"is":[107],"employed":[108],"as":[109],"primary":[111],"research":[112],"tool,":[113],"incorporating":[114],"homogenization":[116],"method":[117],"simplify":[119],"geometry":[121],"while":[122],"maintaining":[123],"analytical":[124],"accuracy.":[125],"findings":[127],"indicate":[128],"that":[129],"index":[134,155],"regions":[135,156],"plays":[136],"critical":[138],"role":[139],"patterns":[143],"rates.":[146],"Specifically,":[147],"stiffness":[149],"side":[152],"corner":[154],"influences":[157],"curvature":[159],"observed":[160],"along":[161],"edges.":[163],"Through":[164],"sensitivity":[167],"analysis":[168],"on":[169],"regions,":[171],"successfully":[174],"optimized":[175],"design,":[179],"eliminating":[180],"from":[184],"previous":[185,187],"high":[188],"30%":[190],"0%.":[192]},"counts_by_year":[],"updated_date":"2026-03-27T05:58:40.876381","created_date":"2025-10-10T00:00:00"}