{"id":"https://openalex.org/W4408164108","doi":"https://doi.org/10.1109/access.2025.3547963","title":"Essential Frequency Analysis for Stacked Cu-CNT Composite Cells of TSVs","display_name":"Essential Frequency Analysis for Stacked Cu-CNT Composite Cells of TSVs","publication_year":2025,"publication_date":"2025-01-01","ids":{"openalex":"https://openalex.org/W4408164108","doi":"https://doi.org/10.1109/access.2025.3547963"},"language":"en","primary_location":{"id":"doi:10.1109/access.2025.3547963","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2025.3547963","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://doi.org/10.1109/access.2025.3547963","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5079331263","display_name":"Mekala Girish Kumar","orcid":"https://orcid.org/0000-0003-1724-7336"},"institutions":[{"id":"https://openalex.org/I4210131147","display_name":"SRM University","ror":"https://ror.org/037skf023","country_code":"IN","type":"education","lineage":["https://openalex.org/I145286018","https://openalex.org/I4210131147"]},{"id":"https://openalex.org/I4401726783","display_name":"VIT-AP University","ror":"https://ror.org/007v4hf75","country_code":null,"type":"education","lineage":["https://openalex.org/I4401726783"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Mekala Girish Kumar","raw_affiliation_strings":["School of Electronics Engineering, VIT-AP University, Amaravati, India","School of Electronics Engineering, VIT-AP University, Amaravathi, Guntur, India"],"raw_orcid":"https://orcid.org/0000-0003-1724-7336","affiliations":[{"raw_affiliation_string":"School of Electronics Engineering, VIT-AP University, Amaravati, India","institution_ids":["https://openalex.org/I4210131147","https://openalex.org/I4401726783"]},{"raw_affiliation_string":"School of Electronics Engineering, VIT-AP University, Amaravathi, Guntur, India","institution_ids":["https://openalex.org/I4210131147","https://openalex.org/I4401726783"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5000010949","display_name":"Yash Agrawal","orcid":"https://orcid.org/0000-0001-9736-9581"},"institutions":[{"id":"https://openalex.org/I98389781","display_name":"Dhirubhai Ambani University","ror":"https://ror.org/02d5b7g69","country_code":"IN","type":"education","lineage":["https://openalex.org/I98389781"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Yash Agrawal","raw_affiliation_strings":["Department of ICT, Dhirubhai Ambani Institute of Information and Communication Technology, Gandhinagar, India"],"raw_orcid":"https://orcid.org/0000-0001-9736-9581","affiliations":[{"raw_affiliation_string":"Department of ICT, Dhirubhai Ambani Institute of Information and Communication Technology, Gandhinagar, India","institution_ids":["https://openalex.org/I98389781"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Harish Pulluri","orcid":null},"institutions":[{"id":"https://openalex.org/I4210115222","display_name":"Advanced Numerical Research and Analysis Group","ror":"https://ror.org/02a61vy29","country_code":"IN","type":"facility","lineage":["https://openalex.org/I1340206300","https://openalex.org/I4210115222","https://openalex.org/I4210150591"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Harish Pulluri","raw_affiliation_strings":["Department of Electrical and Electronics Engineering, Anurag University, Hyderabad, Telangana, India","Department of Electrical Engineering, Anurag University, Telangana, India"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Electronics Engineering, Anurag University, Hyderabad, Telangana, India","institution_ids":["https://openalex.org/I4210115222"]},{"raw_affiliation_string":"Department of Electrical Engineering, Anurag University, Telangana, India","institution_ids":["https://openalex.org/I4210115222"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5020173536","display_name":"Rohit Sharma","orcid":"https://orcid.org/0000-0002-7795-7551"},"institutions":[{"id":"https://openalex.org/I119241673","display_name":"Indian Institute of Technology Ropar","ror":"https://ror.org/02qkhhn56","country_code":"IN","type":"education","lineage":["https://openalex.org/I119241673"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Rohit Sharma","raw_affiliation_strings":["Department of Electrical Engineering, Indian Institute of Technology Ropar, Rupnagar, Punjab, India"],"raw_orcid":"https://orcid.org/0000-0002-7795-7551","affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, Indian Institute of Technology Ropar, Rupnagar, Punjab, India","institution_ids":["https://openalex.org/I119241673"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":0.4626,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.60444022,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":97},"biblio":{"volume":"13","issue":null,"first_page":"41221","last_page":"41229"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.996999979019165,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.996999979019165,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9937999844551086,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10723","display_name":"Advanced Welding Techniques Analysis","score":0.9925000071525574,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/composite-number","display_name":"Composite number","score":0.7227349877357483},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5913842916488647},{"id":"https://openalex.org/keywords/carbon-nanotube","display_name":"Carbon nanotube","score":0.42827731370925903},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.41108062863349915},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.35789185762405396},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.320881187915802}],"concepts":[{"id":"https://openalex.org/C104779481","wikidata":"https://www.wikidata.org/wiki/Q50707","display_name":"Composite number","level":2,"score":0.7227349877357483},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5913842916488647},{"id":"https://openalex.org/C513720949","wikidata":"https://www.wikidata.org/wiki/Q1778729","display_name":"Carbon nanotube","level":2,"score":0.42827731370925903},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.41108062863349915},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.35789185762405396},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.320881187915802}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2025.3547963","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2025.3547963","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:469d14f56d1249d880810ccbd73d851c","is_oa":true,"landing_page_url":"https://doaj.org/article/469d14f56d1249d880810ccbd73d851c","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 13, Pp 41221-41229 (2025)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2025.3547963","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2025.3547963","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":31,"referenced_works":["https://openalex.org/W1551766335","https://openalex.org/W1979682966","https://openalex.org/W2022787060","https://openalex.org/W2055512203","https://openalex.org/W2073254867","https://openalex.org/W2074256944","https://openalex.org/W2096561210","https://openalex.org/W2104240799","https://openalex.org/W2106997452","https://openalex.org/W2120551433","https://openalex.org/W2124047460","https://openalex.org/W2124829011","https://openalex.org/W2136039657","https://openalex.org/W2153602935","https://openalex.org/W2154677460","https://openalex.org/W2167079884","https://openalex.org/W2170839472","https://openalex.org/W2329762937","https://openalex.org/W2617086827","https://openalex.org/W2727321233","https://openalex.org/W2800334986","https://openalex.org/W2911367753","https://openalex.org/W2997459872","https://openalex.org/W3005755829","https://openalex.org/W3204624114","https://openalex.org/W4206116423","https://openalex.org/W4234856324","https://openalex.org/W4286434284","https://openalex.org/W4289535683","https://openalex.org/W4384499231","https://openalex.org/W4400665652"],"related_works":["https://openalex.org/W2899084033","https://openalex.org/W4404995717","https://openalex.org/W2016187641","https://openalex.org/W4404725684","https://openalex.org/W4246450666","https://openalex.org/W4388998267","https://openalex.org/W2898370298","https://openalex.org/W2137437058","https://openalex.org/W2619507405","https://openalex.org/W1072657899"],"abstract_inverted_index":{"This":[0,34],"paper":[1],"presents":[2],"a":[3,20,56],"comprehensive":[4,57],"frequency":[5,77],"analysis":[6],"of":[7,46,52,59,68,120],"copper-carbon":[8],"nanotube":[9],"(Cu-CNT)":[10],"composite":[11,26],"cells":[12,27],"in":[13,23,118],"stacked":[14,69],"through-silicon":[15],"vias":[16],"(TSVs),":[17],"focusing":[18],"on":[19,99],"novel":[21],"approach":[22],"which":[24,96],"Cu-CNT":[25,70,112],"are":[28,90],"distributed":[29],"normally":[30],"within":[31],"the":[32,44,47,83,87,100],"TSVs.":[33],"distribution":[35],"is":[36],"designed":[37],"to":[38,65,81,125],"simulate":[39],"real-world":[40],"conditions":[41],"and":[42,61,78,103],"enhance":[43],"reliability":[45],"findings.":[48],"The":[49,108],"key":[50],"contributions":[51],"this":[53],"work":[54],"encompass":[55],"assessment":[58],"insertion":[60],"return":[62],"losses":[63],"related":[64],"electrical":[66],"characteristics":[67],"TSVs,":[71],"varying":[72],"critical":[73],"factors":[74],"such":[75],"as":[76,128],"material":[79],"composition":[80],"evaluate":[82],"system":[84],"performance.":[85],"Also":[86],"eye":[88],"diagrams":[89],"investigated":[91],"at":[92],"various":[93],"data":[94],"rates,":[95],"shed":[97],"light":[98],"signal":[101],"quality":[102],"integrity":[104],"for":[105,132],"high-speed":[106],"applications.":[107],"findings":[109],"show":[110],"that":[111],"composites":[113],"outperform":[114],"conventional":[115],"copper-based":[116],"TSVs":[117],"terms":[119],"performance":[121],"metrics,":[122],"drawing":[123],"attention":[124],"their":[126],"promise":[127],"next-generation,":[129],"high-density":[130],"interconnects":[131],"3D":[133],"integrated":[134],"circuits.":[135]},"counts_by_year":[{"year":2026,"cited_by_count":1}],"updated_date":"2025-12-28T23:10:05.387466","created_date":"2025-10-10T00:00:00"}