{"id":"https://openalex.org/W4405754721","doi":"https://doi.org/10.1109/access.2024.3522180","title":"Semi-Supervised Learning With Wafer-Specific Augmentations for Wafer Defect Classification","display_name":"Semi-Supervised Learning With Wafer-Specific Augmentations for Wafer Defect Classification","publication_year":2024,"publication_date":"2024-12-24","ids":{"openalex":"https://openalex.org/W4405754721","doi":"https://doi.org/10.1109/access.2024.3522180"},"language":"en","primary_location":{"id":"doi:10.1109/access.2024.3522180","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2024.3522180","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://doi.org/10.1109/access.2024.3522180","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5115632214","display_name":"Uk Jo","orcid":null},"institutions":[{"id":"https://openalex.org/I197347611","display_name":"Korea University","ror":"https://ror.org/047dqcg40","country_code":"KR","type":"education","lineage":["https://openalex.org/I197347611"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Uk Jo","raw_affiliation_strings":["School of Industrial and Management Engineering, Korea University, Seoul, South Korea"],"raw_orcid":"https://orcid.org/0009-0000-7494-2373","affiliations":[{"raw_affiliation_string":"School of Industrial and Management Engineering, Korea University, Seoul, South Korea","institution_ids":["https://openalex.org/I197347611"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5058258354","display_name":"Seoung Bum Kim","orcid":"https://orcid.org/0000-0002-2205-8516"},"institutions":[{"id":"https://openalex.org/I197347611","display_name":"Korea University","ror":"https://ror.org/047dqcg40","country_code":"KR","type":"education","lineage":["https://openalex.org/I197347611"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Seoung Bum Kim","raw_affiliation_strings":["School of Industrial and Management Engineering, Korea University, Seoul, South Korea"],"raw_orcid":"https://orcid.org/0000-0002-2205-8516","affiliations":[{"raw_affiliation_string":"School of Industrial and Management Engineering, Korea University, Seoul, South Korea","institution_ids":["https://openalex.org/I197347611"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5115632214"],"corresponding_institution_ids":["https://openalex.org/I197347611"],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":1.5934,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.85767588,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":95,"max":99},"biblio":{"volume":"13","issue":null,"first_page":"56","last_page":"66"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9934999942779541,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.8770671486854553},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6633644700050354},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.473671019077301},{"id":"https://openalex.org/keywords/wafer-fabrication","display_name":"Wafer fabrication","score":0.424347460269928},{"id":"https://openalex.org/keywords/machine-learning","display_name":"Machine learning","score":0.33230385184288025},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.30079513788223267},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.21792778372764587}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.8770671486854553},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6633644700050354},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.473671019077301},{"id":"https://openalex.org/C35750839","wikidata":"https://www.wikidata.org/wiki/Q7959421","display_name":"Wafer fabrication","level":3,"score":0.424347460269928},{"id":"https://openalex.org/C119857082","wikidata":"https://www.wikidata.org/wiki/Q2539","display_name":"Machine learning","level":1,"score":0.33230385184288025},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.30079513788223267},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.21792778372764587}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2024.3522180","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2024.3522180","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:b46d5f8b90bc4d66a40a4fbdcc5d9cef","is_oa":true,"landing_page_url":"https://doaj.org/article/b46d5f8b90bc4d66a40a4fbdcc5d9cef","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 13, Pp 56-66 (2025)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2024.3522180","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2024.3522180","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320322120","display_name":"National Research Foundation of Korea","ror":"https://ror.org/013aysd81"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":31,"referenced_works":["https://openalex.org/W1985914844","https://openalex.org/W2020286945","https://openalex.org/W2042065072","https://openalex.org/W2108598243","https://openalex.org/W2553245249","https://openalex.org/W2764262416","https://openalex.org/W2805484002","https://openalex.org/W2891602716","https://openalex.org/W2904651525","https://openalex.org/W2913085327","https://openalex.org/W2922187519","https://openalex.org/W2975403694","https://openalex.org/W3000664697","https://openalex.org/W3035406940","https://openalex.org/W3035682985","https://openalex.org/W3088622113","https://openalex.org/W3101748915","https://openalex.org/W3157059293","https://openalex.org/W3177330184","https://openalex.org/W4293581782","https://openalex.org/W4327663221","https://openalex.org/W4377139221","https://openalex.org/W6677919164","https://openalex.org/W6685133223","https://openalex.org/W6703116779","https://openalex.org/W6730169791","https://openalex.org/W6743261063","https://openalex.org/W6757817989","https://openalex.org/W6770578729","https://openalex.org/W6773005947","https://openalex.org/W6787972765"],"related_works":["https://openalex.org/W2961085424","https://openalex.org/W4306674287","https://openalex.org/W4387369504","https://openalex.org/W3046775127","https://openalex.org/W4394896187","https://openalex.org/W3170094116","https://openalex.org/W4386462264","https://openalex.org/W3107602296","https://openalex.org/W4364306694","https://openalex.org/W4312192474"],"abstract_inverted_index":{"Semi-supervised":[0],"learning":[1,29],"(SSL)":[2],"models,":[3],"which":[4],"leverage":[5],"both":[6],"labeled":[7,34,122,144],"and":[8,78,106,132,142,153,161,165,168,214],"unlabeled":[9],"datasets,":[10],"have":[11,60],"been":[12,63],"increasingly":[13],"applied":[14],"to":[15,130,135],"classify":[16],"wafer":[17,43,102,201,226],"bin":[18,44,202,227],"map":[19,45,90,203,220],"patterns":[20],"in":[21,31,47,173,181,190,200],"semiconductor":[22],"manufacturing.":[23],"These":[24],"models":[25,30],"typically":[26],"outperform":[27],"supervised":[28],"scenarios":[32],"where":[33],"data":[35,46],"are":[36],"scarce.":[37],"However,":[38],"the":[39,71,207,215,223],"challenges":[40],"posed":[41],"by":[42,127,185],"applying":[48],"conventional":[49],"image":[50],"augmentation":[51,212],"methods,":[52],"particularly":[53],"within":[54,81],"SSL":[55],"frameworks":[56],"such":[57],"as":[58],"FixMatch,":[59,82],"not":[61],"yet":[62],"fully":[64],"addressed":[65],"despite":[66],"their":[67],"significant":[68,179],"role.":[69],"Recognizing":[70],"importance":[72],"of":[73,76,117,150,158,209,217,225],"thoughtful":[74],"implementation":[75],"weak":[77],"strong":[79],"augmentations":[80],"we":[83],"propose":[84],"a":[85,114],"method":[86,147,172,195],"that":[87],"incorporates":[88],"saliency":[89,219],"information":[91,221],"into":[92],"cutout":[93,191],"augmentation.":[94,192],"This":[95],"approach":[96,112],"preserves":[97],"essential":[98],"regions":[99,189],"crucial":[100],"for":[101],"defect":[103,182,204],"pattern":[104,183],"classification":[105,184],"thus":[107],"improving":[108],"model":[109],"performance.":[110],"Our":[111],"achieves":[113,148,196],"macro":[115],"F1-score":[116],"0.841":[118],"with":[119,139],"only":[120],"5%":[121],"data,":[123,145],"surpassing":[124],"state-of-the-art":[125,198],"methods":[126],"6.2%":[128],"compared":[129,134],"WaPIRL":[131,164],"7.5%":[133],"Manivannan\u2019s":[136,171],"method.":[137],"Similarly,":[138],"10%,":[140],"25%,":[141],"50%":[143],"our":[146,210],"F1-scores":[149],"0.856,":[151],"0.874,":[152],"0.891,":[154],"respectively,":[155],"showing":[156],"improvements":[157,180],"3.5%,":[159],"1.7%,":[160],"1.2%":[162],"over":[163,170],"5.0%,":[166],"6.6%,":[167],"11.9%":[169],"each":[174],"case.":[175],"Experimental":[176],"results":[177],"indicate":[178],"avoiding":[186],"cutting":[187],"important":[188],"The":[193],"proposed":[194],"new":[197],"performance":[199],"classification,":[205],"demonstrating":[206],"potential":[208],"tailored":[211],"techniques":[213],"effectiveness":[216],"incorporating":[218],"reflecting":[222],"characteristics":[224],"maps.":[228]},"counts_by_year":[{"year":2026,"cited_by_count":3},{"year":2025,"cited_by_count":2}],"updated_date":"2026-05-20T08:49:12.498775","created_date":"2025-10-10T00:00:00"}