{"id":"https://openalex.org/W4400351492","doi":"https://doi.org/10.1109/access.2024.3423761","title":"Melt Pool Width Extraction Method in Laser Directed Energy Deposition Based on Variable Step Size Erosion Model","display_name":"Melt Pool Width Extraction Method in Laser Directed Energy Deposition Based on Variable Step Size Erosion Model","publication_year":2024,"publication_date":"2024-01-01","ids":{"openalex":"https://openalex.org/W4400351492","doi":"https://doi.org/10.1109/access.2024.3423761"},"language":"en","primary_location":{"id":"doi:10.1109/access.2024.3423761","is_oa":true,"landing_page_url":"http://dx.doi.org/10.1109/access.2024.3423761","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"http://dx.doi.org/10.1109/access.2024.3423761","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5047559757","display_name":"Y. H. Chai","orcid":"https://orcid.org/0009-0009-6173-6824"},"institutions":[{"id":"https://openalex.org/I157507598","display_name":"Shenyang University of Technology","ror":"https://ror.org/00d7f8730","country_code":"CN","type":"education","lineage":["https://openalex.org/I157507598"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuanxin Chai","raw_affiliation_strings":["School of Mechanical Engineering, Shenyang University of Technology, Shenyang, China"],"raw_orcid":"https://orcid.org/0009-0009-6173-6824","affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Shenyang University of Technology, Shenyang, China","institution_ids":["https://openalex.org/I157507598"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021594635","display_name":"Liguo Miao","orcid":null},"institutions":[{"id":"https://openalex.org/I157507598","display_name":"Shenyang University of Technology","ror":"https://ror.org/00d7f8730","country_code":"CN","type":"education","lineage":["https://openalex.org/I157507598"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Liguo Miao","raw_affiliation_strings":["School of Mechanical Engineering, Shenyang University of Technology, Shenyang, China"],"raw_orcid":"https://orcid.org/0000-0001-9073-614X","affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Shenyang University of Technology, Shenyang, China","institution_ids":["https://openalex.org/I157507598"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006340038","display_name":"Jinghu Tang","orcid":null},"institutions":[{"id":"https://openalex.org/I9224756","display_name":"Northeastern University","ror":"https://ror.org/03awzbc87","country_code":"CN","type":"education","lineage":["https://openalex.org/I9224756"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jinghu Tang","raw_affiliation_strings":["School of Mechanical Engineering and Automation, Northeastern University, Shenyang, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering and Automation, Northeastern University, Shenyang, China","institution_ids":["https://openalex.org/I9224756"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5077530975","display_name":"Dianqi Li","orcid":null},"institutions":[{"id":"https://openalex.org/I157507598","display_name":"Shenyang University of Technology","ror":"https://ror.org/00d7f8730","country_code":"CN","type":"education","lineage":["https://openalex.org/I157507598"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Dianqi Li","raw_affiliation_strings":["School of Mechanical Engineering, Shenyang University of Technology, Shenyang, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Shenyang University of Technology, Shenyang, China","institution_ids":["https://openalex.org/I157507598"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.09126348,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"12","issue":null,"first_page":"93363","last_page":"93371"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10705","display_name":"Additive Manufacturing Materials and Processes","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10705","display_name":"Additive Manufacturing Materials and Processes","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11854","display_name":"Laser-induced spectroscopy and plasma","score":0.991599977016449,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":0.9864000082015991,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/robustness","display_name":"Robustness (evolution)","score":0.5916824340820312},{"id":"https://openalex.org/keywords/erosion","display_name":"Erosion","score":0.5411199331283569},{"id":"https://openalex.org/keywords/thresholding","display_name":"Thresholding","score":0.49411895871162415},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.48921751976013184},{"id":"https://openalex.org/keywords/deposition","display_name":"Deposition (geology)","score":0.4528806805610657},{"id":"https://openalex.org/keywords/segmentation","display_name":"Segmentation","score":0.4366159439086914},{"id":"https://openalex.org/keywords/extraction","display_name":"Extraction (chemistry)","score":0.42325571179389954},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.39392974972724915},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.1848720908164978},{"id":"https://openalex.org/keywords/geology","display_name":"Geology","score":0.14480435848236084},{"id":"https://openalex.org/keywords/image","display_name":"Image (mathematics)","score":0.14359179139137268}],"concepts":[{"id":"https://openalex.org/C63479239","wikidata":"https://www.wikidata.org/wiki/Q7353546","display_name":"Robustness (evolution)","level":3,"score":0.5916824340820312},{"id":"https://openalex.org/C123157820","wikidata":"https://www.wikidata.org/wiki/Q80026","display_name":"Erosion","level":2,"score":0.5411199331283569},{"id":"https://openalex.org/C191178318","wikidata":"https://www.wikidata.org/wiki/Q2256906","display_name":"Thresholding","level":3,"score":0.49411895871162415},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.48921751976013184},{"id":"https://openalex.org/C64297162","wikidata":"https://www.wikidata.org/wiki/Q1987070","display_name":"Deposition (geology)","level":3,"score":0.4528806805610657},{"id":"https://openalex.org/C89600930","wikidata":"https://www.wikidata.org/wiki/Q1423946","display_name":"Segmentation","level":2,"score":0.4366159439086914},{"id":"https://openalex.org/C4725764","wikidata":"https://www.wikidata.org/wiki/Q844704","display_name":"Extraction (chemistry)","level":2,"score":0.42325571179389954},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.39392974972724915},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.1848720908164978},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.14480435848236084},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.14359179139137268},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C43617362","wikidata":"https://www.wikidata.org/wiki/Q170050","display_name":"Chromatography","level":1,"score":0.0},{"id":"https://openalex.org/C55493867","wikidata":"https://www.wikidata.org/wiki/Q7094","display_name":"Biochemistry","level":1,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C104317684","wikidata":"https://www.wikidata.org/wiki/Q7187","display_name":"Gene","level":2,"score":0.0},{"id":"https://openalex.org/C2816523","wikidata":"https://www.wikidata.org/wiki/Q180184","display_name":"Sediment","level":2,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2024.3423761","is_oa":true,"landing_page_url":"http://dx.doi.org/10.1109/access.2024.3423761","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:0093697157c84fa397909ee1d90b46a2","is_oa":true,"landing_page_url":"https://doaj.org/article/0093697157c84fa397909ee1d90b46a2","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 12, Pp 93363-93371 (2024)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2024.3423761","is_oa":true,"landing_page_url":"http://dx.doi.org/10.1109/access.2024.3423761","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[{"display_name":"Climate action","id":"https://metadata.un.org/sdg/13","score":0.5600000023841858}],"awards":[{"id":"https://openalex.org/G1301030649","display_name":null,"funder_award_id":"2022YFB4602200","funder_id":"https://openalex.org/F4320335777","funder_display_name":"National Key Research and Development Program of China"}],"funders":[{"id":"https://openalex.org/F4320335777","display_name":"National Key Research and Development Program of China","ror":null}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W1542224353","https://openalex.org/W1661087619","https://openalex.org/W2348769214","https://openalex.org/W4366783026","https://openalex.org/W2031280244","https://openalex.org/W4253540454","https://openalex.org/W2017196451","https://openalex.org/W3186444248","https://openalex.org/W3083651517","https://openalex.org/W2044959242"],"abstract_inverted_index":{"To":[0,55],"solve":[1],"the":[2,21,33,43,46,50,60,64,82,103,106,114,133,141,144,148],"problem":[3],"of":[4,45,49,59,105,147],"insufficient":[5],"melt":[6,26,51,61,65,83,107,123,149],"pool":[7,27,52,62,66,84,108,124,150],"width":[8,28],"feature":[9],"extraction":[10,29],"accuracy":[11,118],"caused":[12],"by":[13,102],"splash,":[14],"arc":[15],"light,":[16],"and":[17,74,119],"other":[18],"interferences":[19],"in":[20,121,131],"metal":[22],"deposition":[23],"process,":[24],"a":[25],"method":[30,115],"based":[31],"on":[32],"variable":[34],"step":[35],"size":[36,53],"erosion":[37,90],"model":[38,91],"is":[39,68,86],"proposed":[40],"according":[41],"to":[42,92],"characteristics":[44],"spatial":[47],"distribution":[48],"features.":[54],"achieve":[56],"accurate":[57],"measurement":[58],"width,":[63,125],"image":[67],"first":[69],"denoised":[70],"using":[71,78,88],"mathematical":[72],"morphology":[73],"then":[75],"segmented":[76],"roughly":[77],"manual":[79],"thresholding.":[80],"Subsequently,":[81],"contour":[85],"iterated":[87],"an":[89],"obtain":[93],"precise":[94],"point":[95],"localization":[96],"information":[97],"after":[98],"fine":[99],"segmentation,":[100],"followed":[101],"calculation":[104],"width.":[109],"Comparison":[110],"experiments":[111],"demonstrate":[112],"that":[113],"exhibits":[116],"excellent":[117],"robustness":[120],"extracting":[122],"while":[126],"also":[127],"showcasing":[128],"high":[129],"efficiency":[130],"fulfilling":[132],"requirements":[134],"for":[135,143],"closed-loop":[136,145],"control.":[137],"These":[138],"findings":[139],"lay":[140],"groundwork":[142],"control":[146],"size.":[151]},"counts_by_year":[],"updated_date":"2026-03-27T05:58:40.876381","created_date":"2025-10-10T00:00:00"}